Wire Drawing Die Making Patents (Class 125/30.02)
  • Patent number: 10155293
    Abstract: The diamond surface polishing method according to the present invention involves polishing a polished object, the surface of which is made of diamond, by rubbing a polishing member having an elongated shape such as a linear or belt-like shape and containing at least a metal or a metal oxide against the diamond surface, wherein a pressing force of the polishing member is controlled in accordance with material properties of the polishing member and/or a shape of the polished object and a diamond crystal size in a rubbing section so that contact surface pressure in a machining area becomes uniform.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: December 18, 2018
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Masahiro Shimamura, Kenichi Takao, Ryozo Shiroishi
  • Patent number: 9776254
    Abstract: A machining method for at least one shaping machining operation can include carrying out a machining operation over a first distance using a cutting tool which is subjected to axial oscillations as it moves forward, then reducing the amplitude of the axial oscillations while continuing to drive the cutting tool in terms of rotation.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: October 3, 2017
    Assignee: MITIS
    Inventor: Sylvain Laporte
  • Patent number: 8591287
    Abstract: Methods for fabricating a honeycomb extrusion die from a die body include the step of machining extrusion slots with at least one grinding wheel to provide a honeycomb pattern of extrusion slots. In further examples, a plurality of the extrusion slots of the honeycomb pattern of extrusion slots can be machined with a wire electrical discharge machining process after machining the plurality of extrusion slots of the honeycomb pattern of extrusion slots with the grinding wheel.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: November 26, 2013
    Assignee: Corning Incorporated
    Inventors: David William Folmar, Aniello Mario Palumbo
  • Patent number: 6915796
    Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: July 12, 2005
    Inventor: Chien-Min Sung