Forming Piezoelectric Crystals Patents (Class 125/901)
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Patent number: 10030937Abstract: A system and method for simulating lead of a target includes a network, a simulation administrator and a user device connected to the network, a database connected to the simulation administrator, and a set of position trackers positioned at a simulator site. The user device includes a virtual reality unit and a computer connected to the set of virtual reality unit and to the network. A generated target is simulated. The target and the user are tracked to generate a phantom target and a phantom halo. The phantom target and the phantom halo are displayed on the virtual reality unit at a lead distance and a drop distance from the target as viewed through the virtual reality unit.Type: GrantFiled: April 14, 2015Date of Patent: July 24, 2018Assignee: Shooting Simulator, LLCInventors: James L. Northrup, Robert P. Northrup, Peter F. Blakeley
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Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof
Patent number: 9855635Abstract: A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.Type: GrantFiled: June 11, 2017Date of Patent: January 2, 2018Assignee: TIANJIN UNIVERSITYInventors: Chengzu Ren, Xiaofan Deng, Yinglun He, Guang Chen, Xinmin Jin -
Patent number: 9839987Abstract: A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.Type: GrantFiled: June 10, 2017Date of Patent: December 12, 2017Assignee: TIANJIN UNIVERSITYInventors: Chengzu Ren, Xiaofan Deng, Yinglun He, Guang Chen, Xinmin Jin
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Patent number: 7137865Abstract: A method for the division of single crystals, in particular of GaAs, is provided in which a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) are moved relative to one another in a direction of advancement (V) and wherein the single crystal (1) is oriented in such a way that a specified crystallographic orientation (K) lies in the cutting plane (T), characterized in that an angle (?) between the specified crystallographic direction (K) and the direction of advancement (V) is chosen in such a way that forces which act on the cutting tool during cutting in a direction at right angles to the cutting plane compensate one another.Type: GrantFiled: July 30, 2001Date of Patent: November 21, 2006Assignee: Freiberger Compound Materials GmbHInventors: Ralf Hammer, André Kleinwechter, Tilo Flade, Cornelia Kumann, Ralf Gruszynsky
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Patent number: 6827072Abstract: A dressing wheel has a disk-shaped base body centered on an axis and formed with an annular groove also centered on the axis and having an inner surface. A multiplicity of abrasive elements distributed along the groove are in direct contact with the groove inner surface. Matrix powder fills the groove between the elements and between the elements and the groove surfaces. A hardened infiltrating agent, e.g. solder, fills interstices of the matrix powder.Type: GrantFiled: January 24, 2003Date of Patent: December 7, 2004Assignee: Wendt GmbHInventor: Holger Schwämmle
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Patent number: 6390889Abstract: A holding strip is used to hold a semiconductor ingot during semiconductor wafer fabrication. The holding strip is formed from a semiconductor material, typically the same material used to form the ingot itself. The holding strip has a holding surface shaped to receive the ingot and at least one surface other than the holding surface, into which at least one notch is formed. The holding strip has a characteristic breaking strength that changes when a cut is formed through the holding surface and into the notch. In some embodiments, the notch has sides that are substantially parallel to each other, and in other embodiments, the notch has tapered sides. In alternative embodiments, the shape of the notch causes an abrupt change or a gradual change in the breaking strength of the holding strip as the cut penetrates into the notch. In either case, the notch can be shaped to cause a gradual change in breaking strength as the cut moves deeper into the notch.Type: GrantFiled: September 29, 1999Date of Patent: May 21, 2002Assignee: Virginia SemiconductorInventors: A. Dempsey McGregor, Marshall P. Toombs, James E. Brooks, Benjamin J. Meadows
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Patent number: 6286499Abstract: Disclosed is an improved method of cutting and separating a bent board into individual small divisions. Prior to the cutting and separating of the board into the individual chips the board is cut and separated into two or more pieces each large enough to have a reduced bend, compared with the bend of the board. Thus, each large division can be put and fixedly held on the chuck table of a cutting machine in stable condition, thus permitting the smooth, stable cutting of the large division into final small divisions.Type: GrantFiled: October 4, 1999Date of Patent: September 11, 2001Assignee: Disco CorporationInventors: Masahiro Yoshii, Shinichi Namioka
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Patent number: 6257224Abstract: A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, includes the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradiation of a laser beam upon the preform, thereby forming grooves on the preform, and then cleaving the preform along the groove.Type: GrantFiled: February 26, 1998Date of Patent: July 10, 2001Assignee: NGK Insulators, Ltd.Inventors: Takashi Yoshino, Kenji Kato, Minoru Imaeda
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Patent number: 5287843Abstract: A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.Type: GrantFiled: July 27, 1992Date of Patent: February 22, 1994Assignee: Tokyo Seimitsu Co., Ltd.Inventors: Ichiro Katayama, Yoshio Kamoshita
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Patent number: 5174270Abstract: A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.Type: GrantFiled: April 30, 1991Date of Patent: December 29, 1992Assignee: Tokyo Seimitsu Co., Ltd.Inventors: Ichiro Katayama, Yoshio Kamoshita
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Patent number: 5135727Abstract: An automatic single crystal ingot disconnector which is mounted on the uppermost chuck of the conventional single crystal ingot removing assembly, which uppermost chuck assembly is adapted to shift in the axial direction of the ingot being chucked; the proposed single crystal ingot disconnector includes: (a) a neck clamper for clamping the neck of the single crystal ingot, (b) a neck cutter for cutting through the neck of the ingot to thereby disconnect the ingot from the seed crystal to which the ingot is connected, and (c) a TV camera to view the position where the neck cutter applies a cutting operation on the neck of the ingot.Type: GrantFiled: November 29, 1991Date of Patent: August 4, 1992Assignee: Shin-Etsu Handotai Co., Ltd.Inventor: Hiroyuki Ibe