Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: A rotating and telescoping cleaning system improves high pressure water cleaning of the inner surfaces of vessels or tanks. Vessels can be vertically divided with dividing plates with centered through-holes. Synchronized and controlled transverse and rotary movements of water jets result in a controlled spiral or helical cleaning track along the vessel walls. The water jets are directed at a pre-adjusted distance from the vessel wall and the travel speed of the water nozzle jets is exactly controlled allowing the removal of very hard deposits. One pass with the tool carrier with operating water jets along the length axis of the vessel results in a thoroughly cleaned vessel wall. The tool unfolds and folds inside of the vessel powered by the flow of the high pressure cleaning water.

Abstract: A surface treating device includes a member adapted for engaging a surface to be treated and a driver operatively associated with the member. The driver is adapted for imparting a linear reciprocating motion to the member, wherein the member engages the surface in a manner substantially perpendicular to the surface to be treated. The surface treating device further includes a dispenser for delivering a fluid drawn from a discrete fluid source to the surface being treated by the member.

Abstract: A cleaning probe capable of providing uniform cleaning to an entire wafer while not damaging the edge portion of the wafer, and a megasonic cleaning apparatus having the cleaning probe are provided. The cleaning probe comprises a front portion located near the center of the wafer, a rear portion connected to a piezoelectric transducer, and a protrusion located between the rear portion and the front portion, located on an edge portion of the wafer, and having a larger cross section width than the front portion.

Abstract: A system for cleaning a semiconductor substrate is provided. The system includes transducers for generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate and an acoustic energy oriented in a substantially parallel direction to the surface of the semiconductor substrate. Each orientation of the acoustic energy may be simultaneously or alternately generated.