Abstract: A system for preventing contaminants and particulates from coming into contact with a back side of a workpiece as the workpiece is vacuum held on a chuck or robotic end effector.

Abstract: A cleaning container and method for using the same for chemically cleaning elongated members including quartz thermocouple sleeves including a first body member and a second body member said first body member and second body member respectively forming a first containing space and a second containing space including a first means for reversibly compressively sealing the first body member and the second body member to a form a combined containing space for sealably holding a cleaning solution level; a cap member disposed at a distal end of the first body member said cap member including a second means for reversibly compressively sealing a first opening in communication with the first containing space; and, a second opening centrally disposed in a distal end of the second containing space said second opening including a third means for reversibly compressively sealing around at least one elongated member penetrating through said second opening.

Abstract: Disclosed are methods of cleaning articles of manufacture using hydrofluorocarbon and hydrochlorofluorocarbon fluids. The methods comprise generally the steps of (a) providing a hydrofluorocarbon and/or hydrochlorofluorocarbon fluid in liquid or supercritical state; (b) contacting an article of manufacture with said fluid; and (c) removing substantially all of said fluid from said article of manufacture.

Abstract: A method for cleaning a silicon-based substrate in an ammonia-containing solution without incurring any damages to the silicon surface by NH4OH vapor is described. The method can be conducted by first providing a silicon-based substrate that has a silicon surface, then forming a silicon oxide layer of very small thickness, i.e. less than 10 Å, on the silicon surface. The silicon-based substrate can then be cleaned in an ammonia-containing solution without incurring any surface damage to the silicon, i.e. such as the formation of silicon holes. The present invention novel method can be carried out by either adding an additional oxidation tank before the SC-1 cleaning tank, or adding an oxidant to a quick dump rinse tank prior to the SC-1 cleaning process.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: An apparatus for transporting semiconductor wafers between processing steps that can also be used to support the wafers during various processing steps. The apparatus minimizes the obstruction of fluid flow in the process tank, reduces the amount of devices that will fail due to edge exclusion, and reduces processing times. In one embodiment, the apparatus is a wafer carrier comprising a wire frame having three load supporting members, the load supporting members having a plurality of wafer engaging elements adapted to support a plurality of wafers.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: A method of cleaning a hard floor surface with a surface maintenance vehicle including the steps of generating a foam-like aerated cleaning liquid, selectively conveying the foam-like aerated cleaning liquid to the hard floor surface and a scrubbing medium operatively coupled to the surface maintenance vehicle, scrubbing the hard floor surface with said rotating scrubbing medium and said foam-like aerated cleaning liquid so as to loosen soil from the hard floor surface leaving behind a soiled solution of cleaning liquid and soil, and removing at least a portion of the soiled solution from the hard floor surface through a fluid recovery device. Additional aspects of the present invention include devices for performing the cleaning method.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the first surface of the workpiece at an elevated temperature. Ozone is provided around the workpiece under conditions where the ozone diffuses through the boundary layer and reacts with the material on the first surface. The temperature of the first surface is controlled to maintain condensation of the steam.

Abstract: The present invention provides a defined alkylpolyglucoside having a degree of oligomerization of at least 1.7 to 3 and an alkyl radical comprising 8 carbon atoms, and mixtures of this alkylpolyglucoside with further alkylpolyglucosides, as cleaner concentrate. The present invention also relates to compositions which include the defined alkylpolyglucoside and a concentrated alkali metal hydroxide solution as well as a method of using the composition as a cleaner.

Abstract: A process tank and method for stripping photoresist from semiconductor wafers. In one aspect, the invention is a method for processing integrated circuits comprising: placing at least one wafer having an edge in a process tank having a lid; closing the lid; filling the process tank with a process liquid to a predetermined level below the edge of the wafer; and applying acoustical energy to the process liquid so as to form a mist of process liquid in the process tank.

Abstract: A wafer guide for supporting at least one semiconductor wafer during a cleaning process, includes side panels having a plurality of side fixing grooves on an upper surface thereof for stabilizing the at least one semiconductor wafer and for maintaining a sufficient distance between a surface of the at least one semiconductor wafer and an adjacent surface; a center panel having a plurality of center fixing grooves on the upper surface thereof for supporting the at least one semiconductor wafer, each of the plurality of center fixing grooves having inner walls, wherein a contact line is formed on each of the inner walls of the center fixing grooves, and wherein the center panel is positioned between the pair of side panels; and a pair of fixing plates, one of the pair of fixing plates being fixedly attached at each end of the center panel and the pair of side panels.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: A method for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

Abstract: A lift-off procedure is provided which enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure. A wafer having a surface on which a pattern is formed which contains a pattern portion to be removed is soaked into a chemical liquid at an angle at which the surface faces downward.

Abstract: A substrate processing method of the present invention prevents the reattachment of particles to substrates, such as semiconductor wafers, when processing and cleaning the substrates by immersing the substrates held in a vertical attitude in a processing liquid and a cleaning liquid. After processing the substrates in the processing liquid, they are drawn out from the processing liquid. Then, lower parts of the processed substrates are immersed in the cleaning liquid and temporarily kept stationary in the cleaning liquid. Alternatively, the cleaning liquid is sprayed onto the lower parts of the processed substrates. After a predetermined time, the substrates are immersed entirely in the cleaning liquid.

Abstract: A method of manufacturing an electrophotographic photosensitive member includes the steps of: cleaning a substrate of the electrophotographic photosensitive member by cleaning step using a vessel and machining the substrate. The cleaning step includes a first overflowing step and a second overflowing step. In the first overflowing step, the liquid is allowed to be overflowed from a vessel while the substrate of the electrophotographic photosensitive member is immersed in the liquid contained in the vessel. In the second overflowing step, the liquid is allowed to overflow from a vessel while the substrate of the electrophotographic photosensitive member is pulled up in the liquid contained in the vessel. A flow rate Q2 of the overflowing liquid of the second overflowing step is higher than a flow rate Q1 of the overflowing liquid of the first overflowing step. The machining step forms a film of a photosensitive substance on the substrate.

Abstract: A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber, and rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas to remove the organic material from the surface.

Abstract: The present invention provides an apparatus for cleaning a workpiece with a cleaning medium that is maintained at a single fluid phase. The apparatus includes means for providing the cleaning medium; a pressurizable cleaning vessel for receiving the cleaning medium and the workpiece; and means for maintaining a single fluid phase of the cleaning medium in the cleaning vessel. The present invention further provides a process for cleaning the workpiece with cleaning medium under conditions such that the workpiece is exposed to a single fluid phase of the cleaning medium. The present invention further includes a process for a storage media that includes instructions for controlling a processor for the process of the present invention. The storage media includes means for controlling the processor to control contacting conditions of the workpiece and the cleaning medium such that the workpiece is exposed to a single fluid phase of the cleaning medium.

Abstract: A method for cleaning polyethylene terephthalate containers including contacting the PET container with an alkaline wash solution having a temperature ranging of less than about 60° C. is disclosed. The alkaline wash solution is formulated from a first concentrate, a second concentrate, an alkalinity source, and a balance of water. The first concentrate preferably has a first nonionic surfactant, a first builder, and acid in an amount effective to provide a phase stable solution. The second concentrate preferably has a second nonionic surfactant and a second builder. The first and second concentrate are present in the wash solution in a concentration ranging from about 0.3 wt. % to 2.0 wt. %. Preferably, the first nonionic surfactant has a cloud point ranging from about 5° C. to 60° C.

Abstract: Compositions for the removal of polymeric material from a substrate are provided where the compositions include a polyol compound selected from (C3-C20)alkanediols, substituted (C3—C20)alkanediols, (C3-C20)alkanetriols or substituted (C3-C20)alkanetriols, a glyco ether, at least 5% wt water based on the total weight of the composition, and a fluoride salt selected from ammonium fluoride, ammonium bifluoride, ammonium-tetramethylammonium bifluoride or mixtures thereof. Methods of removing polymeric material using these compositions are also provided.

Abstract: A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw bars stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars, which are stripped off from the transfer tools and are placed on the base, from the top.

Abstract: This invention provides an apparatus and method for washing a biological chip cartridge. A washing station comprises a cartridge holder that includes at least two cartridge mounting tubes that are structured to retain the biological chip cartridge on the washing station without doors. At least one fluid source communicates with one of the mounting tubes and a waste dump communicates with another mounting tube. A fluid controller controls delivery of a fluid from the fluid source to the mounting tube.

Abstract: A method of accessing and cleaning an interior portion of a gas scrubber canister in-situ. A removable glass member is attachable to a flange formed on the canister. By removing the removable glass member an access port in communication with the interior portion of the canister is provided. A vacuum device is insertable through the access port to clean the interior portion in-situ.

Abstract: A homogeneous non-aqueous composition containing a fluorinated solvent, ozone, and optionally a co-solvent and the use of these compositions for cleaning and oxidizing substrates is described.

Abstract: A method for cleaning returnable bottles and similar containers used in the food industry. The method uses an enzymatic solution during the cleaning process. The cleaning results are at least as good as conventional methods, without requiring an increase in the duration of cleaning. The method substantially reduces bottle corrosion and waste water pollution compared to conventional methods.

Abstract: An apparatus for wet cleaning or etching of flat substrates comprising a tank with an inlet opening and outlet opening for said substrates. Said tank contains a cleaning liquid and is installed in a gaseous environment. At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface. In the tank there may be a portion above the liquid filled with a gas with a pressure being lower than the pressure within said environment. The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.

Abstract: Potentiated compositions and methods for disinfection of porous surfaces, such as ceiling tiles contaminated with bacteria and fungi permits renewal without requiring replacement tiles. The compositions, preferably water clear aqueous solutions, comprise synergistic combination of quaternary ammonium compound, a surfactant, and a hydrogen peroxide solution at very low concentrations than otherwise required if used alone. The active components are present in minimal proportional ranges sufficient to achieve a virtual 100 percent kill of bacteria and fungi present on surfaces.

Abstract: A new method and apparatus is provided that assures constant fluid flow of the fluid that is entered into a semiconductor device processing tank or container. A flow meter is set to a particular flow rate; the fluid that comes from the POU is routed through the flow meter. The fluid passes through a flow meter into a processing tank. The fluid is allowed to fill the container up to an overflow point of the container. An overflow basin is provided into which the overflowing fluid is routed from where the fluid is drained into a fluid reclaim vessel. The overflow is detected by a sensor, the sensor activates an overflow relieve valve that is mounted in the bottom of the container. The overflow relieve valve is opened and drains fluid from the container thus counteracting the overflow of the fluid into the overflow basin. The interaction between the overflow detector and the overflow relieve valve assures a constant rate of supply of the fluid to the processing tank or container.

Abstract: Rubber plugs, which are to be used with medical containers or medical devices, are produced by forming a vulcanizable, mixed rubber compound, vulcanizing a resultant formed rubber compound, treating the rubber plug with steam of high temperature and high pressure, treating the rubber plugs in an aqueous solution which has been adjusted to be acidic, rinsing the rubber plugs with high-quality water, washing the rubber plugs with a shower of dust- and germ-free water, and drying the rubber plugs by at least one of far infrared radiation and high frequency heating. The process makes it possible to reduce the number of insoluble fine particles, which are attracted on a surface of each rubber plug, to an extremely low level and moreover, remove (or deactivate) pyrogen substances on and in the vicinity of the surface of the rubber plug.

Abstract: A method for manufacturing an integrated circuit device. The method includes retrieving an in process substrate comprising one or more particles from an input chamber, which is coupled to a chamber for a robot arm, which is maintained under a predetermined environment. The method moves the substrate from the input chamber into a cleaning chamber, which is coupled to the robot arm chamber. The method places the substrate onto a susceptor in the cleaning chamber; and applies a high energy photon from a high energy photon source onto a surface of a substrate to release the one or more particles from the surface of the substrate while the substrate is maintained in the predetermined environment.

Abstract: A composition for adding to an aqueous rinse which is applied to a ferrous metal surface after treatment of the ferrous metal surface with an aqueous acid solution is disclosed. The composition includes a base. The base is present in the composition in an amount sufficient to adjust the pH of the aqueous rinse to a value greater than 7.0 after the composition is added to the aqueous rinse. The composition also includes a salt of gluconic acid. The composition further includes a polyquaternium compound. An associated method for inhibiting stain formation on a ferrous metal surface is also disclosed.

Abstract: A processing tank has at least one fluid distribution device for introducing a treatment fluid. The fluid distribution device has at least one porous hollow rod, at least one porous plate, at least one capillary plate, or at least one single-ply or multi-ply fabric.

Abstract: The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck and the fluid delivery assembly comprises one or more nozzles. The invention also provide a method for etching a substrate, comprising: rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate.

Abstract: A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

Abstract: A system for preventing contaminants and particulates from coming into contact with a back side of a workpiece as the workpiece is vacuum held on a chuck or robotic end effector.

Abstract: A method for cleaning a silicon wafer by a wet bench method with improved cleaning efficiency and without oxide formation is disclosed. In the method, the wafer may first be cleaned in a first cleaning solution that includes a base or an acid, and then the wafer is rinsed in a second solution that includes DI water and ozone. The ozone concentration in the DI water may be between about 1 ppm and about 20 ppm, and preferably between about 3 ppm and about 10 ppm. A diluted HF cleaning step may be utilized after the ozone/DI water rinsing step to remove any possible oxide formation on the silicon surface before a final rinsing step and drying step.

Abstract: A system and method are disclosed including a vapor dryer chamber (12) with a lid (14). A heater (16) is disposed within the vapor dryer chamber to vaporize liquid drying medium (24), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber (12). Cooling coils (18) disposed within an upper portion of the vapor drying chamber (12) condense the drying medium vapor. A vapor monitor assembly (30) is disposed within the vapor dryer chamber (12) to monitor the vapor concentration within vapor dryer chamber (12). A controller (40) is associated with the vapor monitor assembly (30) and evaluates vapor concentration measurements from the vapor monitor (38).

Abstract: A workpiece or substrate is placed in a support in a reaction chamber. A heated process liquid is sprayed onto the substrate. The thickness of the layer of process liquid formed on the substrate is controlled, e.g., by spinning the substrate. Ozone is introduced into the reaction chamber by injection into the liquid or into the reaction chamber, while the temperature of the substrate is controlled, to chemically process the substrate. The substrate is then rinsed and dried.

Abstract: A process for removing the coating and any metals from polymeric substrates such as compact discs (CDs) and digital video discs (DVDs) by applying high shear conditions to fluidized particulates of the polymeric substrate optionally in the presence of an accelerant.

Abstract: An apparatus and method for monitoring a cleaning process for a medical device. The apparatus comprises a soil detector. The soil detector is capable of detecting inorganic and/or organic soil on a medical device or in a liquid utilized in a cleaning or cleaning monitoring process or on a soil-covered standard which can serve as a surrogate indicator of cleanliness for the medical device. The method of the invention for monitoring a cleaning process for a medical device comprises the step of measuring the soil removed from a medical device with the apparatus of the invention comprising a soil detector. Preferably, the method further comprises the step of determining when the device is sufficiently cleaned so that it can be sterilized.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.

Abstract: A method for removing non-stick coatings from cookware or bakeware products is disclosed. The method includes the step of determining the angles of the primary surfaces of a pan having a coating to be removed. The method further includes the step of configuring a high-speed, multiport, rotating cleaning head to provide at least one water jet associated with each primary surface. The method further includes the step of employing the cleaning head to deliver an ultra-high pressure water jet directed at the pan while tracking the cleaning head along a plane substantially parallel to the upper surface of the pan. Using the method of the present invention, a coating may be removed from a pan in a single pass.

Abstract: The present invention discloses a method for cleaning a surface of a substrate where a silicon epitaxial layer will be formed before growing the silicon epitaxial layer in a selective epitaxial growth process. Firstly, a high temperature heating element is aligned in a silicon epitaxial layer growth chamber, disposed separated from the substrate, a cleaning gas is inserted into the chamber and is decomposed into an atom or radical state having high reactivity in a gas phase according to heat generation of the high temperature heating element, and is diffused into the substrate, whereby a substrate cleaning reaction is performed at a substrate temperature ranging from 400 to 600° C.

Abstract: The present invention concerns a process of treating an energizing electrode for use in a metal halide lamp. Lamp energizing electrodes are placed into a support container and the support container is then placed within an oven that bakes the electrodes at an elevated temperature. Hydrogen is caused to flow through the support container at a rate of from 5 to 60 liters per minute while the temperature is maintained within the oven between 2000 and 3200 degrees C. In accordance with an exemplary embodiment of the invention, the temperature is maintained within the oven at 2400 and 2600 degrees C., the dew point of the hydrogen is less than minus 40 degrees C. and the electrodes are baked for a period of 10 to 240 minutes. This process treats the electrodes in the support container and results in lamps having superior maintenance of lamp output as measured in lumens of output.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from tile sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: A method for cleaning objects in a pressure vessel with liquefied gases is provided. The gas liquefied under pressure is conducted into the pressure vessel. The temperature of the liquefied gas then, or beforehand, is lowered below the critical temperature of the gas and cleaning is performed at least primarily below the critical temperature and below the critical pressure of the gas. Carbon dioxide at temperatures between −20° C. and +20° C. is especially suitable. The mechanical interactions produced by the increased density and viscosity of the liquefied gas reinforce cleaning. Reduced solvent capacity does not influence the effectiveness of the cleaning. Textiles or components can therefore be cleaned at lower pressure and temperature.