Processes Patents (Class 136/201)
  • Publication number: 20120060889
    Abstract: A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 15, 2012
    Applicant: FERROTEC (USA) CORPORATION
    Inventors: Robert W. Otey, David A. Kaminski
  • Publication number: 20120060885
    Abstract: Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.
    Type: Application
    Filed: May 4, 2011
    Publication date: March 15, 2012
    Inventors: Tarek Makansi, Steve Wood, John L. Franklin, Mark N. Evers
  • Patent number: 8127758
    Abstract: An aerospace platform includes a structure having a cavity and a light-transmissive portion that exposes the cavity to sunlight. The aerospace platform further includes a fluid heating system. The fluid heating system includes a fluid-carrying, thermally absorptive structure within the cavity, and a solar collector for collecting light transmitted through the light-transmissive portion and focusing the collected light onto the absorptive structure. The thermally absorptive structure has a high surface absorptivity that retains thermal energy when exposed to solar irradiance and heats fluid contained therein.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: March 6, 2012
    Assignee: The Boeing Company
    Inventors: Shailesh Atreya, Michael F. Stoia, Tina R. Stoia, Russell K. Jones
  • Publication number: 20120048322
    Abstract: In various embodiments of the present invention, a device for converting incident radiation to electrical energy is provided. The device includes a Thermoelectric Generator (TEG) and a Photovoltaic Cell (PV) to convert the incident radiation to electrical energy. The device further includes a first component for focusing the incident radiation to the TEG and the PV. The incident radiation includes light waves of infrared wavelengths, and light waves of the visible light spectrum and Ultraviolet (UV) waves. The TEG converts the heat generated due to the light waves of infrared wavelength into electricity, and the PV converts energy of the light waves of the visible light spectrum and UV waves into electricity.
    Type: Application
    Filed: June 15, 2010
    Publication date: March 1, 2012
    Inventors: Uttam Ghoshal, Ayan Guha
  • Publication number: 20120042922
    Abstract: The graphite structure includes a plurality of domains of graphite where a layer body of graphene sheets is curved in domelike, wherein the plurality of domains are arranged in plane, and the domains adjacent each other are in contact with each other.
    Type: Application
    Filed: November 1, 2011
    Publication date: February 23, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Daiyu Kondo, Shintaro Sato, Taisuke Iwai
  • Publication number: 20120042921
    Abstract: The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode.
    Type: Application
    Filed: December 2, 2010
    Publication date: February 23, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk Kim, Sung Ho Lee, Young Soo Oh, Tae Kon Koo
  • Publication number: 20120031449
    Abstract: A method for converting heat to electric energy is described which involves thermally cycling an electrically polarizable material sandwiched between electrodes. The material is heated by extracting thermal energy from a gas to condense the gas into a liquid and transferring the thermal energy to the electrically polarizable material. An apparatus is also described which includes an electrically polarizable material sandwiched between electrodes and a heat exchanger for heating the material in thermal communication with a heat source, wherein the heat source is a condenser. An apparatus is also described which comprises a chamber, one or more conduits inside the chamber for conveying a cooling fluid and an electrically polarizable material sandwiched between electrodes on an outer surface of the conduit. A gas introduced into the chamber condenses on the conduits and thermal energy is thereby transferred from the gas to the electrically polarizable material.
    Type: Application
    Filed: October 13, 2011
    Publication date: February 9, 2012
    Applicant: THE NEOTHERMAL ENERGY COMPANY
    Inventors: Ahmet Erbil, David F. Walbert
  • Patent number: 8110736
    Abstract: The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has electrically conductive and is provided on the electrode member, and a heat uniforming member that has electrically conductive and is provided on the elastic member; a thermoelectric element that is made of a thermoelectric material having thermoelectric effect and arranged on the first electrode so as to contact the heat uniforming member; and a second electrode arranged on the thermoelectric element.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: February 7, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naokazu Iwanade, Naruhito Kondo, Osamu Tsuneoka, Kazuki Tateyama, Takahiro Sogou
  • Publication number: 20120024332
    Abstract: A thermoelectric material in a shape for forming part of a thermoelectric module, the thermoelectric material is coated with a protective layer to prevent degradation by humidity, oxygen, chemicals or thermal stress.
    Type: Application
    Filed: March 30, 2010
    Publication date: February 2, 2012
    Applicant: BASF SE
    Inventors: Madalina Andreea Stefan, Kerstin Schierle-Arndt, Guenther Huber, John Stuart Blackburn, Ivor Wynn Jones, Francis Stackpool, Stephen Heavens
  • Publication number: 20120024335
    Abstract: The present invention provides a multi-layered thermoelectric device and a method of manufacturing the same. The method for manufacturing a multi-layered thermoelectric device includes the steps of: forming a P-type semiconductor and an N-type semiconductor in a sheet type by mixing thermoelectric semiconductor materials at a preset component ratio; cutting the sheets according to a preset specification of the thermoelectric device; stacking sheets which are made by mixing the thermoelectric semiconductor materials at a preset component ratio and are cut into the same size for each of them; and forming a final thermoelectric device by compressing the stacked sheets. By using the method, scattering phenomenon due to a short wavelength of phonon occurs at a boundary of each layer, which results in active scattering of phonon. Therefore, it is possible to expect an effect of improving a thermoelectric figure of merit of a thermoelectric device.
    Type: Application
    Filed: November 16, 2010
    Publication date: February 2, 2012
    Inventors: Sung Ho LEE, Yong Suk Kim, Young Soo Oh, Tae Kon Koo, Sung Kwon Wi
  • Publication number: 20120017963
    Abstract: In a thermoelectric module comprising a series of p and n type semiconductors connected in series by conductive contacts, the conductive contacts are in contact with a substrate of moderate to high thermal conductivity that is electrically insulated from the conductive contacts by a resistive surface layer comprising a ceramic material.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 26, 2012
    Applicant: BASF SE
    Inventors: Madalina Andreea Stefan, Kerstin Schierle-Arndt, Guenther Huber, Frank Haass, John Stuart Blackburn, Ivor Wynn Jones, Francis Stackpool, Stephen Heavens
  • Publication number: 20120017964
    Abstract: An apparatus, system, and method for a thermoelectric generator. In some embodiments, the thermoelectric generator comprises a first thermoelectric region and a second thermoelectric region, where the second thermoelectric region may be coupled to the first thermoelectric region by a first conductor. In some embodiments, a second conductor may be coupled to the first thermoelectric region and a third conductor may be coupled to the second thermoelectric region. In some embodiments, the first conductor may be in a first plane, the first thermoelectric region and the second thermoelectric region may be in a second plane, and the second conductor and the third conductor may be in a third plane.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 26, 2012
    Inventors: Muhammad M. Hussain, Hossain M. Fahad, Jhonathan P. Rojas
  • Publication number: 20120017962
    Abstract: Electrical energy is generated in a device that includes an integrated circuit which produces thermal flux when operated. A substrate supports the integrated circuit. A structure is formed in the substrate, that structure having a semiconductor p-n junction thermally coupled to the integrated circuit. Responsive to the thermal flux produced by the integrated circuit, the structure generates electrical energy. The generated electrical energy may be stored for use by the integrated circuit.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 26, 2012
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventors: Thomas Skotnicki, Stephane Monfray
  • Publication number: 20120012147
    Abstract: A current source and method of producing the current source are provided. The current source includes a metal source, a buffer layer, a filter and a collector. An electrical connection is provided to the metal layer and semiconductor layer and a magnetic field applier may be also provided. The source metal has localized states at a bottom of the conduction band and probability amplification. The interaction of the various layers produces a spontaneous current. The movement of charge across the current source produces a voltage, which rises until a balancing reverse current appears. If a load is connected to the current source, current flows through the load and power is dissipated. The energy for this comes from the thermal energy in the current source, and the device gets cooler.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Inventor: Toomas KRIISA
  • Publication number: 20120006376
    Abstract: A thermally stable diffusion barrier for bonding skutterudite-based materials with metal contacts is disclosed. The diffusion barrier may be employed to inhibit solid-state diffusion between the metal contacts, e.g. titanium (Ti), nickel (Ni), copper (Cu), palladium (Pd) or other suitable metal electrical contacts, and a skutterudite thermoelectric material including a diffusible element, such as antimony (Sb), phosphorous (P) or arsenic (As), e.g. n-type CoSb3 or p-type CeFe4?xCoxSb12 where the diffusible element is Sb, to slow degradation of the mechanical and electrical characteristics of the device. The diffusion barrier may be employed to bond metal contacts to thermoelectric materials for various power generation applications operating at high temperatures (e.g. 673 K or above). Some exemplary diffusion barrier materials have been identified such as zirconium (Zr), hafnium (Hf), and yttrium (Y).
    Type: Application
    Filed: June 15, 2011
    Publication date: January 12, 2012
    Applicant: California Institute of Technology
    Inventors: JEAN-PIERRE FLEURIAL, Thierry Caillat, Su Chih Chi
  • Publication number: 20120000501
    Abstract: A connection structure for elements includes a first plate having an electrode layer formed on one surface of the first plate, an element connected to the electrode layer at one surface of the element and a second plate connected to the other surface of the element. A connection method for the above elements comprises the steps of: disposing the element on upper surface of the electrode layer of the first plate through solder and the second plate on upper surface of the element through conductive paste and heating the solder and the conductive paste simultaneously for melting the solder and calcining the conductive paste.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 5, 2012
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Naoto MORISAKU, Hirokuni AKIYAMA
  • Publication number: 20110315181
    Abstract: A method for converting heat to electricity by exploiting changes in spontaneous polarization that occur in electrically polarizable materials is described. The method uses an internally generated field to achieve poling during cycling. The internal poling field is produced by retaining residual free charges on the electrodes at the appropriate point of each cycle. The method obviates the need for applying a DC voltage during cycling and permits the use of the electrical energy that occurs during poling rather than an external poling voltage which detracts from the net energy produced per cycle. The method is not limited to a specific thermodynamic cycle and can be used with any thermodynamic cycle for converting heat to electricity by thermally cycling electrically polarizable materials. The electrical energy generated can be used in various applications or stored for later use. An apparatus for converting heat to electricity is also described.
    Type: Application
    Filed: September 8, 2011
    Publication date: December 29, 2011
    Applicant: NEOTHERMAL ENERGY COMPANY
    Inventors: Ahmet Erbil, David F. Walbert
  • Publication number: 20110303257
    Abstract: A unit thermionic electric converter. The unit thermionic electric converter includes a case having a first end portion and a second end portion; a working fluid disposed inside the case; a solid electrolyte dividing the inside of the case; a first electrode disposed on a surface of the solid electrolyte; and a second electrode disposed on another surface of the solid electrolyte; wherein the first end portion and the second end portion are alternately heated by a heat source.
    Type: Application
    Filed: December 15, 2010
    Publication date: December 15, 2011
    Inventors: Ju-Yong Kim, Byung-Joo Chung, Tae-Yoon Kim
  • Patent number: 8076569
    Abstract: A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: December 13, 2011
    Assignee: MTPV, LLC
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Publication number: 20110300420
    Abstract: A temperature controlled battery pack assembly includes a housing defining a battery chamber and including thermal insulation surrounding at least a portion of the battery chamber. At least one battery cell is contained in the battery chamber. The thermal insulation inhibits thermal transfer between the at least one battery cell and the surrounding environment. A thermal bridge conductor is disposed in the battery chamber and engages the at least one battery cell. The battery pack assembly further includes a thermoelectric cooler device having an inner surface and an outer surface. The thermoelectric cooler device is operable to actively transfer heat between the inner and outer surfaces using the Peltier effect. A heat sink device is in contact with or connected to the outer surface to enable thermal conduction between the outer surface and the heat sink device.
    Type: Application
    Filed: June 2, 2010
    Publication date: December 8, 2011
    Inventor: Robert William Johnson, JR.
  • Publication number: 20110297202
    Abstract: A thermoelectric material including: a nanostructure; a discontinuous area disposed in the nanostructure, and an uneven portion disposed on the nano structure.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 8, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Jun-ho LEE, Dong-mok WHANG, Jong-woon LEE
  • Publication number: 20110290294
    Abstract: The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.
    Type: Application
    Filed: September 2, 2010
    Publication date: December 1, 2011
    Inventor: Seung Seoup Lee
  • Publication number: 20110290293
    Abstract: Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module.
    Type: Application
    Filed: August 31, 2010
    Publication date: December 1, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO.
    Inventors: Yong Suk Kim, Sung Ho Lee, Tae Kon Koo, Yong Soo Oh
  • Publication number: 20110290295
    Abstract: Certain example embodiments provide techniques for improving the output of hybrid systems comprising photovoltaic (PV) and thermoelectric (TE) modules in conjunction with super-insulating, yet optically transmissive, vacuum insulated glass (VIG) unit technologies. More particularly, certain example embodiments relate to hybrid systems including hydrogenated microcrystalline silicon (mc-Si), hydrogenated amorphous silicon (a-Si), bulk hetero junction solar cell, and/or the like, that may be used together with a TE generator, that achieves high operational PV and TE efficiencies under ambient conditions. In that regard, certain example embodiments effectively partition the solar spectrum in order to yield an increased conversion efficiency of a PV-TE hybrid system with a solar cell operating at ambient temperature.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 1, 2011
    Applicant: Guardian Industries Corp.
    Inventor: Vijayen S. Veerasamy
  • Publication number: 20110284049
    Abstract: In order to achieve a thermoelectric transducer exhibiting a higher conversion efficiency and an electronic apparatus including such a thermoelectric transducer, a thermoelectric conversion device is provided, including a semiconductor stacked structure including semiconductor layers stacked with each other, the semiconductor layers being made from different semiconductor materials, in which a material and a composition of each semiconductor layer in the semiconductor stacked structure are selected so as to avoid conduction-band or valence-band discontinuity.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 24, 2011
    Applicant: FUJITSU LIMITED
    Inventor: Taisuke Iwai
  • Publication number: 20110284048
    Abstract: A multi-layer superlattice quantum well thermoelectric material comprising at least 10 alternating layers has a layer thickness of each less than 50 nm, the alternating layers being electrically conducting and barrier layers, wherein the layer structure shows no discernible interdiffusion leading to a break-up or dissolution of the layer boundaries upon heat treatment at a temperature in the range from 50 to 150° C. for a time of at least 100 hours and the concentration of doping materials in the conducting layers is 1018 to 1023 cm?3 and in the barrier layers is 1013 to 1018 cm?3.
    Type: Application
    Filed: March 28, 2011
    Publication date: November 24, 2011
    Applicants: Hi - Z Technology, Inc., BASF SE
    Inventors: Frank HAASS, Norbert B. ELSNER, Laverne Elsner, Saeid GHAMATY, Daniel KROMMENHOEK
  • Publication number: 20110277801
    Abstract: The invention relates to a device for converting thermal energy into electrical energy with at least one thermocouple, which thermocouple comprises two thermoelectric branches (A, B) electrically connected in series, and the thermocouple has a first passage surface (F1) and a second passage surface (F) for the heat flow (Q) and for the electrical current (7, 7?). In this connection, the value of the first passage surface (F1) is less than 5% of the value of the second passage surface (F).
    Type: Application
    Filed: November 11, 2009
    Publication date: November 17, 2011
    Inventors: Herbert Karl Fuchs, Reinhold Koebrunner
  • Publication number: 20110271995
    Abstract: A thermoelectric module includes: thermoelectric semiconductor elements; printed metal conductors for interconnecting the semiconductor elements; and at least one base support for the printed conductors, the base support including a metal matrix composite.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 10, 2011
    Inventors: Franz Wetzl, Martin Rittner, Matthias Leonhardt, Antje Winkelmann
  • Publication number: 20110275165
    Abstract: A thermoelectric conversion module includes a pair of heat transfer plates, p-type semiconductor blocks and n-type semiconductor blocks arranged between the heat transfer plates, and terminal electrodes formed respectively on inner surfaces of the heat transfer plates and connecting the semiconductor blocks in series. The heat transfer plates include holes reaching from an outer surface to the terminal electrodes, and grooves each formed between the terminal electrodes and communicating between the adjacent holes. If a disconnection occurs, for example, a pin of a tester is brought into contact with the terminal electrode via the hole to specify a disconnected portion, and the terminal electrodes are electrically connected by injecting conductive paste into the holes in the disconnected portion as well as the groove.
    Type: Application
    Filed: July 19, 2011
    Publication date: November 10, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Suzuki, Takuya Nishino
  • Publication number: 20110258995
    Abstract: A module for a thermoelectric generator includes first and second ends, at least one inner tube and one outer tube disposed around the outside of the inner tube and at least one thermoelectric element disposed between the inner and outer tubes. The inner and outer tubes are each electrically insulated from the at least one thermoelectric element. At least one electrically conductive first contact is provided on each of the first and second ends, for electrically conductively connecting the at least one thermoelectric element to an electrical conductor. The module can conduct a fluid or coolant flow through the module from the first end to the second end. An electrical conductor, a thermoelectric generator, a motor vehicle and a method for producing a module, are also provided.
    Type: Application
    Filed: May 24, 2011
    Publication date: October 27, 2011
    Applicant: EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH
    Inventors: SIGRID LIMBECK, ROLF BRÜCK
  • Publication number: 20110252774
    Abstract: The present invention relates to a heat transfer device, more preferably for an exhaust system of a combustion engine, preferentially of a motor vehicle, with at least one warm tube for conducting a fluid emitting heat, with at least one cold tube for conducting a fluid absorbing heat and with at least one thermoelectric generator for generating electric energy from a temperature difference, wherein a thermoelectric generator each is arranged between a warm tube and a cold tube. The efficiency of the heat transfer device is improved if the respective thermoelectric generator is in contact with the respective tube via a heat conducting material and if the respective heat conducting material is configured as shaped body.
    Type: Application
    Filed: April 15, 2011
    Publication date: October 20, 2011
    Applicant: J. Eberspaecher GmbH & Co., KG
    Inventors: Arnulf Spieth, Anika Burkle, Ming Dong, Jörg Oesterle, Angela Hettel
  • Publication number: 20110247668
    Abstract: A thermoelectric system includes a first thermoelectric element including a first plurality of segments in electrical communication with one another. The thermoelectric system further includes a second thermoelectric element including a second plurality of segments in electrical communication with one another. The thermoelectric system further includes a heat transfer device including at least a first portion and a second portion. The first portion is sandwiched between the first thermoelectric element and the second thermoelectric element. The second portion projects away from the first portion and configured to be in thermal communication with a working medium.
    Type: Application
    Filed: April 6, 2011
    Publication date: October 13, 2011
    Applicant: BSST, LLC
    Inventors: Lon E. Bell, Douglas Todd Crane
  • Publication number: 20110240080
    Abstract: A method of controlling the temperature of a thermoelectric generator (TEG) in an exhaust system of an engine is provided. The method includes determining the temperature of the heated side of the TEG, determining exhaust gas flow rate through the TEG, and determining the exhaust gas temperature through the TEG. A rate of change in temperature of the heated side of the TEG is predicted based on the determined temperature, the determined exhaust gas flow rate, and the determined exhaust gas temperature through the TEG. Using the predicted rate of change of temperature of the heated side, exhaust gas flow rate through the TEG is calculated that will result in a maximum temperature of the heated side of the TEG less than a predetermined critical temperature given the predicted rate of change in temperature of the heated side of the TEG. A corresponding apparatus is provided.
    Type: Application
    Filed: April 2, 2010
    Publication date: October 6, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATION, INC.
    Inventors: Gregory P. Prior, Michael G. Reynolds, Joshua D. Cowgill
  • Patent number: 8026567
    Abstract: A thermoelectric structure for cooling an integrated circuit (IC) chip comprises a first type superlattice layer formed on top of the IC chip connected to a first voltage, and a second type superlattice layer formed on the bottom of the IC chip connected to a second voltage, the second voltage being different from the first voltage, wherein an power supply current flows through the first and second type superlattice layer for cooling the IC chip.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: September 27, 2011
    Assignee: Taiwan Semiconductor Manufactuirng Co., Ltd.
    Inventors: Shih-Cheng Chang, Hsin-Yu Pan
  • Publication number: 20110226303
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Application
    Filed: June 1, 2011
    Publication date: September 22, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Publication number: 20110220164
    Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement.
    Type: Application
    Filed: November 27, 2009
    Publication date: September 15, 2011
    Inventors: Ayan Guha, Uttam Ghoshal, James Borak
  • Publication number: 20110220165
    Abstract: A thermoelectric device includes: a first region; a second region; and a thermoelectric body disposed between the first region and the second region, where the thermoelectric body includes a vacancy.
    Type: Application
    Filed: March 10, 2011
    Publication date: September 15, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Gyeong S. HWANG
  • Publication number: 20110220163
    Abstract: Improved thermoelectric assemblies are disclosed, wherein layers of heterostructure thermoelectric materials or thin layers of thermoelectric material form thermoelectric elements. The layers are bound together with agents that improve structural strengths, allow electrical current to pass in a preferred direction, and minimize or reduce adverse affects, such a shear stresses, that might occur to the thermoelectric properties and materials of the assembly by their inclusion.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 15, 2011
    Applicant: ZT PLUS
    Inventor: Lon E. Bell
  • Patent number: 8018053
    Abstract: One example discloses a heat transfer device that can comprise a semiconductor material having a first region and a second region. The first region and the second region are doped to propel a charged carrier from the first region to the second region. The heat transfer device can also comprise an array of pointed tips thermoelectrically communicating with the second region. A heat sink faces the array, and a vacuum tunneling region is formed between the pointed tips and the heat sink. The heat transfer device further can further comprise a power source for biasing the heat sink with respect to the first region. The first region defines an N-type semiconductor material and the second region defines a P-type semiconductor material.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: September 13, 2011
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Harvey C. Nathanson, Robert M. Young, Joseph T. Smith, Robert S. Howell, Archer S. Mitchell
  • Patent number: 8013235
    Abstract: A thermoelectric device, an intermediate, a module, and a method for manufacturing the same are provided, wherein productivity is high, material costs are comparatively low, and there is a low environmental load. A thermoelectric device, wherein a block body has at least one P and N piece made of P-type and N-type materials, which are alternately sandwiched between insulation layers, wherein the adjacent P and N piece boundary portions are welded together, with the P and the N piece of the block body being electrically connected in a zigzag manner, and a plurality of block bodies are arranged in parallel, the block bodies adjacent to each other being bridged by an electrode to extend the electrical connection in the series; an intermediate using such a thermoelectric device; and a thermoelectric module using the intermediate are provided. In this case, as the P-type and N-type materials, any material preferably used for thermoelectric pairs can be used.
    Type: Grant
    Filed: May 30, 2005
    Date of Patent: September 6, 2011
    Assignee: Universal Entertainment Corporation
    Inventor: Koh Takahashi
  • Publication number: 20110209739
    Abstract: The disclosure provides a thermoelectric composite sandwich structure with an integrated honeycomb core and method for making. The thermoelectric composite sandwich structure comprises two prepreg composite face sheets and an integrated honeycomb core assembled between the face sheets. The honeycomb core comprises a plurality of core elements bonded together with a core adhesive. Each core element has a first side substantially coated with a negative Seebeck coefficient conductive material having a plurality of first spaced gaps, and each core element further has a second side substantially coated with a positive Seebeck coefficient conductive material having a plurality of second spaced gaps. The honeycomb core further comprises a plurality of electrical connections for connecting in series the first side to the second side. A temperature gradient across the honeycomb core generates power.
    Type: Application
    Filed: February 27, 2010
    Publication date: September 1, 2011
    Applicant: The Boeing Company
    Inventors: Liam S. Cavanaugh Pingree, Noel T. Gerken
  • Patent number: 8003002
    Abstract: A thermoelectric material of the p-type having the stoichiometric formula Zn4Sb3, wherein part of the Zn atoms optionally being substituted by one or more elements selected from the group comprising Sn, Mg, Pb and the transition metals in a total amount of 20 mol % or less in relation to the Zn atoms is provided by a process involving zone-melting of a an arrangement comprising an interphase between a “stoichiometric” material having the desired composition and a “non-stoichiometric” material having a composition deviating from the desired composition. The thermoelectric materials obtained exhibit excellent figure of merits.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: August 23, 2011
    Assignees: Aarhus Universitet, Deutsches Zentrum für Luft- und Raumfahrt Advanced Technology Marketing
    Inventors: Bo Brummerstedt Iversen, Britta Lundtoft, Mogens Christensen, Dieter Platzek
  • Publication number: 20110197942
    Abstract: For the thin-film thermo-electric generator and fabrication method of this invention, a P-type thermo-electric thin-film layer, an insulating thin-film layer and a N-type thermo-electric thin-film layer is deposited on a substrate to form a three-layer PN junction, multiple three-layer PN junctions in series are available, an insulating thin-film layer is provided between every to serial three-layer PN junctions, and electrodes are extracted from the substrate and the outermost thin-film layer of the last three-layer thin-film PN junctions.
    Type: Application
    Filed: December 9, 2009
    Publication date: August 18, 2011
    Applicant: SHENZHEN UNIVERSITY
    Inventors: Ping Fan, Dongping Zhang, Zhuangghao Zjemg, Guangxing Liang
  • Publication number: 20110197941
    Abstract: An energy conversion device may include at least one hot source chamber (255, 355) configured to receive a hot fluid, at least one cold source chamber (275, 375) configured to receive a coolant, and a plurality of thermoelectric elements (272, 273, 773) in thermal communication with the at least one hot source chamber (255, 355) and at least one cold source chamber (275, 375), the thermoelectric elements being configured to create an electric potential when exposed to a temperature gradient. The at least one hot source chamber (255, 355) can be configured to perform catalytic conversion of the hot fluid received therein. The at least one hot source chamber (255, 355) and the at least one cold source chamber (275, 375) may be formed from a material having a relatively low coefficient of thermal expansion.
    Type: Application
    Filed: October 23, 2009
    Publication date: August 18, 2011
    Inventors: Thierry Luc Alain Dannoux, Paulo Gaspar Jorge Marques
  • Patent number: 7972877
    Abstract: A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit substrate having a third surface and a corresponding fourth surface are provided. The second surface and the third surface respectively have a plurality of electrodes. Then, a plurality of N-type semiconductor materials and a plurality of P-type semiconductor materials alternatively arranged on the electrodes are formed. Then, the first circuit substrate and the second circuit substrate are assembled. The two type semiconductor materials are located between the electrodes of the first circuit substrate and the second circuit substrate. The two type semiconductor materials are electrically connected to the first circuit substrate and the second circuit substrate through the electrodes. Finally, an LED chip is arranged on the first surface and electrically connected to the first circuit substrate.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: July 5, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Ji Dai, Chun-Kai Liu, Chih-Kuang Yu
  • Publication number: 20110155202
    Abstract: The subject invention pertains to thermoelectric power generation. According to certain embodiments, a stack of silicon-micromachined chips can be connected to form a cylindrical heat exchanger that enables a large, uniform temperature difference across a radially-oriented thermopile. Each layer in the stack can comprise two thermally-isolated concentric silicon rings connected by a polyimide membrane that supports patterned thermoelectric thin films. The polyimide membrane can be formed by selectively etching away the supporting silicon, resulting in thermally-isolated inner and outer rings. In operation, hot gas can flow through a finned central channel, and an external cross flow can enhance heat transfer to ambient to keep the outer surfaces cool. The resulting temperature gradient across the thermopile generates a voltage potential across the open ends due to the Seebeck effect.
    Type: Application
    Filed: September 11, 2009
    Publication date: June 30, 2011
    Applicant: University of Florida Research Foundation, Inc.
    Inventors: David Patrick Arnold, Israel Boniche, Christopher David Meyer, Sivaraman Masilamani
  • Publication number: 20110154558
    Abstract: The invention relates to method for manufacturing a thermoelectric generator, comprising the steps of replicating a structure into a flexible substrate (4) for providing a set of cavities (4a); providing an initiator (2a) in the cavities for growing respective piles (6, 7) of thermoelectric materials; growing the respective piles of thermoelectric materials from said initiator; providing electrical connection between the respective piles of thermoelectric materials for forming thermocouples of the thermoelectric generator. The invention further relates to a wearable thermoelectric generator and a garment comprising the same.
    Type: Application
    Filed: June 2, 2009
    Publication date: June 30, 2011
    Applicants: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO, Stichting IMEC Nederland
    Inventors: Maria Peter, Erwin Rinaldo Meinders, Ruud Vullers
  • Publication number: 20110146741
    Abstract: A thermoelectric conversion module includes: p-type semiconductor blocks, each including a p-type thermoelectric conversion material, a first column portion and a first coupling portion that projects in a horizontal direction from an end of the first column portion; and n-type semiconductor blocks, each including an n-type thermoelectric conversion material, a second column portion and a second coupling portion that projects in a horizontal direction from an end of the second column portion, wherein the first coupling portions of the p-type semiconductor blocks are respectively coupled to the other ends of the second column portions of the n-type semiconductor blocks, and the second coupling portions of the n-type semiconductor blocks are respectively coupled to the other ends of the first column portions of the p-type semiconductor blocks, and the p-type semiconductor blocks and the n-type semiconductor blocks are alternately arranged and coupled to each other in series.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 23, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Masaharu Hida, Kazunori Yamanaka
  • Publication number: 20110146740
    Abstract: A thermoelectric device (100, 220) includes a plurality of conductor portions (120-124) including a first angled side portion (134) and a second angled side portion (135). The thermoelectric device (100, 220) also includes a plurality of conductor members (170-174) including a first angled side section (181) and a second angled side section (182). A plurality of P-type thermoelectric members (210-213) interconnect corresponding ones of the first angled side portions (134) with the first angled side sections (181). A plurality of N-type thermoelectric members (200-204) interconnect corresponding ones of the second angled side portions (135) with the second angled side sections (182). Electric flow through the plurality of conductor portions (120-124) and the plurality of conductor members (170-174) passes along a first predefined curvilinear path and a heat flux passes along a second predefined curvilinear path.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Brian St. Rock, Scott F. Kaslusky
  • Publication number: 20110146743
    Abstract: The present invention relates to an exhaust system for a combustion engine, more preferably of a road vehicle, with at least one exhaust gas-conducting component having a ring-shaped closed inner wall in circumferential direction, whose inner side is exposed to the exhaust gas. The energetic efficiency of the combustion engine can be improved with at least one thermoelectric generator which converts heat into electric energy and which is arranged on an outer side of the inner wall.
    Type: Application
    Filed: November 12, 2010
    Publication date: June 23, 2011
    Applicant: J. Eberspacher GmbH & Co. KG.
    Inventors: Jörg Oesterle, Rolf Jebasinski, Thomas Nording, Georg Wirth