Abstract: A method includes forming a plurality of first semiconductor mesa structures at a first semiconductor substrate. The first semiconductor substrate has a first conductivity type. The method further includes forming a plurality of second semiconductor mesa structures at a second semiconductor substrate. The second semiconductor substrate has a second conductivity type. The method further includes providing a glass substrate between the first semiconductor substrate and the second semiconductor substrate. The method includes connecting the first semiconductor substrate to the second semiconductor substrate so that at least a portion of the glass substrate is located laterally between the first semiconductor mesa structures of the plurality of first semiconductor mesa structures and the second semiconductor mesa structures of the plurality of second semiconductor mesa structures.

Abstract: A thermoelectric apparatus includes a first and a second assemblies, at least a first and a second heat conductors. The first assembly includes a first and a second substrates, and several first thermoelectric material sets disposed between the first and second substrates. The first substrate has at least a first through hole. The second assembly includes a third and a fourth substrates, and several second thermoelectric material sets disposed between the third and fourth substrates. The fourth substrate has at least a second through hole. Each of the first and second thermoelectric material sets has a p-type and an n-type thermoelectric element. The first and second heat conductors respectively penetrate the first and second through holes. Two ends of the first heat conductor respectively connect the second and fourth substrates, while two ends of the second heat conductor respectively connect the first and third substrates.

Abstract: A thermoelectric conversion module includes: a first substrate having water permeability and thermal conductivity; a thermoelectric conversion element provided on the first substrate; a heat insulator having water permeability provided around the thermoelectric conversion element on the first substrate; and a second substrate disposed on the thermoelectric conversion element and the heat insulator and having water permeability and thermal conductivity.

Abstract: A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers.

Abstract: A single thermoelectric device designed to operate both as an igniter and flame detector for gas burners is described. Ignition is performed via heating, by Joule effect, of a conductor which can have, preferably, catalytic activity on the combustion while the flame is detected by means of a “hot” thermal state via the seeback effect. Both functions are obtained via control of a circuit for delivery of the power and detection and amplification of the electrical signal correlated to the flame.

Abstract: A combined thermocouple and thermopile capable of producing multiple EMF signals. The combined thermocouple and thermopile construction is particularly adapted for use as an electric generator capable of producing multiple EMF signals and able to respond faster to changes to the presence or absence of a pilot or gas burner flame. The conductors of the thermopile are comprised of dissimilar metals joined at each end to form hot and cold thermocouple junctions. The thermopile may provide multiple EMF signals when a third wire lead is affixed to a cold junction between either end of the array. The array of thermocouples is formed in a circle and enclosed in a metal sleeve or jacket.

Abstract: A thermopile construction adapted for use as an electric generator capable of producing multiple EMF outputs in response to heat as from a pilot flame. A cluster of hot and cold thermocouple junctions are arrayed within a housing. The hot junction of one of the thermocouples, located at the beginning of the array, extends beyond the other hot junctions for greater sensitivity to changes in temperature as from a pilot flame and surrounding radiating surfaces. While being a part of the array, the longer thermocouple also has extension wires at the cold junction thereof to deliver the EMF of that couple alone to a control device requiring a small EMF. One such wire serves also as one of two leads for delivering the EMF of the entire array to an electromechanical device that requires a larger EMF. Additional extension wires can be added to obtain intermediate EMF values.

Abstract: In a photoelectric conversion device having numerous crystalline semiconductor grains deposited on a substrate, the substrate includes an aluminum layer or an aluminum alloy layer, an intermediate layer, and a base material layer, in which the intermediate layer is arranged such that it is composed mainly of one or a plurality of elements selected from among nickel, titanium, chromium, and cobalt. With the constitution as above, it is possible to suppress reaction between the aluminum electrode layer and the base material layer, thereby maintaining the high adhesiveness of the aluminum electrode layer. A photoelectric conversion device with high reliability and high conversion efficiency is therefore realized.

Abstract: A thermopile detector is disclosed consisting of a semiconductor supporting rim which is doped across all of the rim. The rim supports a series of polycrystalline silicon and metal thermocouples. The fully doped semiconductor area serves as an etch stop for a single-sided etch which eliminates the need for front-to-back alignment of the device. The semiconductor doped rim also serves as a good thermal conductor for supporting the cold junctions. The hot junctions of the thermocouples may be supported by a thin dielectric membrane spanning the device and the cold junctions are formed on the doped rim. The thin dielectric window provides thermal isolation between the semiconductor rim and the center of the window where the hot junctions are located. The thermocouple material layers may be stacked to enable greater thermocouple density on the device. Refractory metals may be employed as the thermocouple metal, to increase sensitivity.

Abstract: An improved thermopile construction particularly adapted for use as an electric generator for producing a signalin response to heat from a pilot flame. Groups of elongated elements of dissimilar metals are assembled or arrayed in a circle within a metal sleeve to produce a pilot generator. The first group of elements is arrayed against the inside wall of the metal sleeve and the second group of elements is assembled radially inwardly from the first group. Respective ends of the elements of the first group and the second group are joined with the opposite end of the respective end of the element of the second group being joined to the opposite end of the next adjacent element of the first group. Individual elements of each group have a cross-sectional configuration to provide for optimum heat transfer between the sleeve and elements of the first group and to provide for assembly of the elements of the second group in a circle of smaller diameter.