Abstract: A coaxial thermocouple includes a wire, an insulation layer surrounding the wire, a sheath surrounding the insulation layer, and an electrical junction formed between the wire and the sheath and at one longitudinal end of the coaxial thermocouple, the electrical junction including a swaged end with an outer diameter of the sheath reducing in diameter along a longitudinal length of the coaxial thermocouple until the sheath contacts the wire within the insulation layer. The wire includes a first material and the sheath includes a second material where the first material includes one of molybdenum (Mo) or niobium (Nb) and the second material includes the other of molybdenum (Mo) or niobium (Nb).

Abstract: The subject of the present invention relates to a device that can be applied to the surface of a ceramic matrix composites (CMC) in such a way that the CMC itself will contribute to the extraordinarily large thermoelectric power. The present invention obtains greater resolution of temperature measurements, which can be obtained at exceedingly high temperatures.

Abstract: A sensor assembly comprising a sensing element with at least one electrical lead extending therefrom. A tube encloses the sensing element and material surrounds the at least one electrical lead and defines a space around the at least one electrical lead so that when temperature gradients create push and pull, the at least one electrical lead moves within the space. The sensor assembly may further comprise a sleeve connected to the tube and surrounding the material. The sleeve may have an intermediate bent portion that the at least one electrical lead passes through, with a braided supply line connected to the leads, the braided supply line being arranged and configured within the bent portion to absorb movement of the two leads from temperature gradients. The lead can also extend through the sleeve forming a sinusoidal shape within the sleeve for absorbing movement resulting from temperature gradients.

Abstract: A device and methods for use thereof in low-temperature thermal scanning microscopy, providing non-contact, non-invasive localized temperature and thermal conductivity measurements in nanometer scale ranges with a temperature resolution in the micro-Kelvin order. A superconductive cap mounted on the tip of an elongated support probe is electrically-connected to superconductive leads for carrying electrical current through the cap. The critical superconducting current of the leads is configured to be greater than the critical current supported by the cap, and the cap's critical current is configured to be a function of its temperature. Thus, the temperature of the cap is measured by measuring its critical superconducting current. In a related embodiment, driving a current greater than the critical current of the cap quenches the cap's superconductivity, and permits the cap to dissipate resistive heat into the sample being scanned.

Abstract: An improved thermocouple includes a drawn coaxial thermocouple wire pair having a more precise “hot” junction at which a first and second metallic material electrically connect with each other for measuring temperature. Adapted for use with an electrophysiologic catheter, the improved thermocouple comprising an elongated body having a proximal end and a distal end. The body includes a core of a first metallic material, a first coaxial layer of ceramic material, and a second coaxial layer of a second metallic material. The thermocouple further includes a solder cap on the distal end, the solder cap electrically connecting the core and the second layer at the distal end. A method of manufacturing includes drawing the body through a die, and applying solder on a distal end of the body to electrically connect the two metallic materials at the distal end.

Abstract: An assembly for measuring a temperature of a fluid flowing through a tubing section is provided. The assembly can include the tubing section that can include a reduced-width portion. The reduced-width portion can traverse a circumference of the tubing section. The assembly can also include a temperature measurement component in thermal communication with an inner diameter of the tubing section. A temperature of a fluid flowing through the tubing section can be detected using the temperature measurement component.

Abstract: A container for molten metal is provided with a temperature measuring device arranged in an opening of a container wall. The temperature measuring device has a protective sheath, which projects into the container and which is closed at its end arranged in the container. A temperature measuring element is arranged in an opening of the protective sheath. The protective sheath is composed of a mixture of a heat-resistant metal oxide and graphite, and the closed end is spaced at least 50 mm from the container wall.

Abstract: An arrangement for mounting at least one electrical component to a portion of an aftertreatment module, the arrangement including; at least one standoff member coupled between the electrical component and the portion of the aftertreatment module, and an enclosure substantially surrounding at least three sides of the electrical component.

Abstract: Improved, highly accurate microwire sensors (10) include a microwire assembly (14) including at least one primary, temperature-sensing microwire (16) encased within a closed-ended, stress-absorbing protective tube (12). Preferably, the sensor assembly (14) includes a plurality of microwires, e.g., a primary temperature-sensing microwire (16), a reference microwire (18), and a calibration microwire (20). The sensors (10) may be embedded within a heat-treatable or curable material (24) to monitor the temperature of the material (24) over a selected temperature range, e.g., during a pre- and/or post-curing temperature range. The tube (12) is formed of material which does not appreciably magnetically bias the microwire assembly (14), and substantially prevents forces exerted on the tube (12) from distorting the sensor assembly (14).

Abstract: A thermoelectric device includes first and second legs extending continuously between first and second heat sources. The first and second legs respectively include first and second conducting elements and third and fourth conducting elements. The first and third conducting elements are adjacent and separated by an insulator. The second and fourth conducting elements are adjacent and separated by an insulator. The device also includes selection means enabling formation of a first thermocouple from the first and second conducting elements and formation of a second thermocouple from the third and fourth conducting elements.

Abstract: A thermoelectric structure includes a graphene layer and a thermoelectric body disposed on the graphene layer, in which the thermoelectric body includes a thermoelectric film including a thermoelectric material, and a quantum dot disposed in the thermoelectric film.

Abstract: A thermoelectric conversion module and a thermoelectric conversion apparatus in which a thermoelectric conversion element can be flexibly attached to heat sources having various shapes in high density are provided. The thermoelectric conversion module includes a first thermoelectric conversion element configured of a cylindrical thermoelectric conversion material having a hollow portion and a second thermoelectric conversion element configured of a thermoelectric conversion material having a different conductive type from that of the first thermoelectric conversion element and fixed in the hollow portion.

Abstract: The present invention provides a thermoelectric conversion element module and a manufacturing method thereof capable of easily realizing a high-density array and securing connection reliability. The module includes a thermoelectric conversion element group made up of P-type elements and N-type elements alternately arranged in a first direction and a heat-resistant insulating member filling the periphery of the thermoelectric conversion materials, wherein the P-type elements and the N-type elements are connected via connection electrodes on a side portion of the group along the first direction, and connection electrodes at other parts of the group along a second direction crossing the first direction. The module is manufactured by forming a connection electrode layer that extends to the side portion of the group on the surface of the group and cutting this connection electrode layer between the thermoelectric conversion elements along the first direction and the second direction.

Abstract: A thermoelectric module includes an inner circumferential surface and an outer circumferential surface each being assigned to a respective hot side or cold side and forming an intermediate space therebetween, a geometric axis and at least one sealing element. The sealing element at least partially forms the inner circumferential surface or is separated from the hot side or cold side disposed there only by an electric insulation layer. The sealing element seals the intermediate space at least with respect to the cold side and has at least one electric conductor connecting at least one thermoelectric element disposed in the thermoelectric module to at least one other electric conductor disposed outside the thermoelectric module. A vehicle having the thermoelectric module is also provided.

Abstract: There is provided a high-sensitivity organic semiconductor radiation/light sensor and a radiation/light detector which can detect rays in real time. In the high-sensitivity organic semiconductor radiation/light sensor, a signal amplification wire 2 is embedded in an organic semiconductor 1. Carriers created by passage of radiation or light are avalanche-amplified by a high electric field generated near the signal amplification wire 2 by means of applying a high voltage to the signal amplification wire 2, thus dramatically improving detection efficiency of rays. Hence, even rays exhibiting low energy loss capability can be detected in real time with high sensitivity.

Abstract: Embodiments of the invention provide a thin film thermoelectric cooler. The cooler may have a high packing density that provides good cooling performance. The cooler may be formed by forming a first set of cooling elements, depositing a conformal insulating layer on the first set, then forming a second set of cooling elements between the first set of elements.

Abstract: Energy harvesting devices are disclosed. An illustrative embodiment of the energy harvesting devices includes a fastening device, a first thermally-conductive element engaging the fastening device, a thermoelectric device disposed in thermal contact with the first thermally-conductive element and a second thermally-conductive element disposed in thermal contact with the thermoelectric device.

Abstract: A millivoltage generator is provided in which a rod formed of a first metal extends in spaced relationship within a tubular sheath of a second metal, the rod being welded to the sheath at one end to form a conductive junction and held in place in the sheath by an epoxy seal proximate the other end of the rod which prevents moisture from collecting inside the sheath. The space between the sheath and the rod is filled with an insulating material. Preferably, a wire connector is fixed to the end of the rod which extends through and beyond the epoxy seal. It is also preferred that a bushing be welded to the outside of the sheath proximate the epoxy seal and that the bushing be externally threaded to facilitate mounting of the millivoltage generator. A second metal rod welded to the bushing extends from the bushing parallel to the first metal rod and beyond the epoxy seal. Another wire connector is fixed to the second metal rod to facilitate electrical connection of the millivoltage generator.

Abstract: A nanoscale force sensing device includes a probe having a tip with multiple isolated channels which can receive different materials. The device may be either straight or cantilevered and may be mounted to permit detection of surface forces while performing other functions at the same time.

Abstract: A Seebeck effect thermal sensor is formed in an integrated fashion with a power-dissipating device such as a power MOSFET. The integrated device generates a temperature difference between a relatively cold peripheral area and a relatively warm central area, the temperature difference having a known relationship to electrical operating conditions of the device. A structure for a power MOSFET includes two side-by-side arrays of source/drain diffusions. The Seebeck sensor has warm junctions at the central area and cold junctions at the peripheral area, and generates an electrical output signal having a known relationship to the temperature difference between the peripheral and central areas to provide an indication of the electrical operating conditions of the device. One Seebeck sensor includes alternating metal and polysilicon traces, wherein the polysilicon traces lie between source and drain diffusions of a power MOSFET just as do active polysilicon gates.

Abstract: The invention provides a temperature sensor on the basis of a thermocouple constituted by two different metals. The first metal is provided in the form of an electrically insulated wire, having a blank uninsulated portion. The second metal is constituted by a jacket member enclosing the insulated wire. The jacket member is in electrical contact with the insulated wire via the blank uninsulated portion to thereby form a measuring junction. As a feed line, an electrically insulated copper wire is provided whose free end has a blank portion. The first wire is wound around the copper wire and projects over the free end thereof. The jacket member extends over the blank uninsulated portion of the carrier wire and is in electrical contact therewith. Due to the fact that the same material is chosen for the jacket member and for the carrier wire, i.e. copper, the carrier wire can be used as electrical feed line.

Abstract: A method and apparatus for measuring and characterizing microscopic thermoelectric material samples using scanning microscopes. The method relies on concurrent thermal and electrical measurements using scanning thermal probes, and extends the applicability of scanning thermal microscopes (SThMs) to the characterization of thermoelectric materials. The probe makes use of two thermocouples to measure voltages at the tip and base of a cone tip of the probe. From these voltages, and from a voltage measured across the sample material, the Seebeck coefficient, thermal conductivity and resistance of the sample material can be accurately determined.

Abstract: A novel microtubing and a method of manufacture is provided. The resulting microtubing has at least two thermoelements separated by a resin layer except in defined areas where the insulating resin layer is selectively removed. The resulting microtube provides improved performance, reduced size, increased flexibility, and can be efficiently manufactured.

Abstract: A semiconductor component comprising a layer of semiconductor material that is doped region-by-region in alternating fashion for positive and negative electrical conductivities. This layer is arranged perpendicular to layer surfaces between thermally conductive layers in such a way that the junctions between two successive regions having different electrical conductivities are electrically insulated outwardly, and are alternately in thermal contact with one of the thermally conductive layers and are thermally insulated from the respective other thermally conductive layer.

Abstract: A tapered, nonconductive structure (10) having a hollow core (18) and a conical tip (14) includes a metal wire (16) within the core (18). The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the tip (14) form a point thermocouple contact with the wire. The tip (14) may be fabricated, for example, by placing a metal wire (16) within a tube (12), and heating and pulling the tube (12) to produce two tapered micropipettes. Thereafter, a thin metal or semiconductor film (24) is evaporated onto the outer surface.

Abstract: A microprobe for thermoelectric microscopic measurements comprises a probe body (11), which consists of a doped or intrinsically conductive semiconductor material and has at least one thermoelectric contact surface (19). The probe body (11) can carry a metal or semiconductor layer (17), which is separated from the probe body (11) by an insulating layer (16) except in the area of the thermoelectric contact surface (19). A process for the production of a microprobe for thermoelectric microscopic measurements is also given.

Abstract: A small bimetallic thermocouple probe device for use in scanning atomic force microscopy is mass produced by etching and oxidatively sharpening silicon points on a standard silicon wafer. The sharpened points are oxidized and the first thermocouple metal layer is deposited and patterned. The intermetal dielectric layer is deposited and removed in the area of the tip of the probe by a simple double spin photoresist process having a drying cycle between the two spins. The exposed tips have the dielectric etched, and the second thermocouple metal is deposited and patterned. The finished thermocouples are produced by etching the silicon from the back side of the wafer to free up the cantilevered structure which the probe are constructed upon. With such a procedure, large numbers of tiny, low thermal mass scanning atomic force microscope thermocouple probes may be inexpensively manufactured.

Abstract: The present invention provides a structure and a method of fabricating a thermoelectric Cooler directly on the backside of a semiconductor substrate. The thermoelectric (TE) cooler (thermoelectric cooler) disperses heat from an integrated circuit (IC) that is formed on the front-side of the silicon substrate. Spaced first bonding pad holes 28 are formed in the backside of a substrate that expose bonding pads 24. Second holes 32 are formed between the spaced first bonding pad holes 28. A first insulating layer 34 is formed over the backside of the substrate, but not over the bonding pad 24. A metal layer is formed lining the first bonding pad holes 28. A polysilicon layer 46 is formed over the surface of the backside of the substrate in the second holes. The polysilicon layer is implanted thereby forming alternating adjacent N and P doped sections 46p 46n in the second holes. The adjacent N and P doped polysilicon sections 46n 46p are electrically connected to the bonding pads 24 by the metal layer 38.

Abstract: The present invention relates to a cantilever for separately observing a temperature profile of a surface of a sample and the topography thereof. The cantilever of the present invention comprises a support, a flexible plate one end of which is supported by the support, and a probe provided at the tip of the flexible plate, in which a thermocouple is provided in the probe.

Abstract: Nanometer holes can be reliably and repeatedly defined in the tips of cantilevered probes and used in various types of scanning multiprobe microscopy by defining the hole within a layer disposed on the tip using focused electron or ion beams. The drilling of the hole on the apex of the tip and is stopped just as soon as the hole is defined through an overlying insulating layer under which lies a metallic or semiconductor layer at the apex. The hole is then backfilled with another metallic or semiconductor layer so that an active electrical junction is formed between the two layers through the hole in the insulating layer. The hole may be defined in conductive layers in various combinations with oxide layers, other metal layers and semiconductor materials to define Schottky diodes, thermocouple junctions, near-field optical detectors, and atomic force tips.

Abstract: A thermoelectric device fabricated of at least two dissimilar thermoelements and at least one of the thermoelements has a conductor in parallel therewith increasing the Figure of Merit. The thermoelements are also surrounded by a conductor along the leg lengths thereby simplifying the manufacturing process.

Abstract: An apparatus and method for producing electricity from heat. The present invention is a thermoelectric generator that uses materials with substantially no electrical resistance, often called superconductors, to efficiently convert heat into electrical energy without resistive losses. Preferably, an array of superconducting elements is encased within a second material with a high thermal conductivity. The second material is preferably a semiconductor. Alternatively, the superconducting material can be doped on a base semiconducting material, or the superconducting material and the semiconducting material can exist as alternating, interleaved layers of waferlike materials. A temperature gradient imposed across the boundary of the two materials establishes an electrical potential related to the magnitude of the temperature gradient. The superconducting material carries the resulting electrical current at zero resistivity, thereby eliminating resistive losses.

Abstract: Apparatus is disclosed in which a pair of elongated solid cylindrical metal conductors mounted with their central axes mutually parallel are connected at their ends to form a closed electrical circuit path, there being heat sinks at spaced positions along their length which serve as heat transfer means setting up a temperature gradient along the lengths of the conductors. A strong electrical current flow in the conductors creates a circumferential magnetic field in the metal directed at right angles to the heat flow and this, by the Nernst Effect, produces a radial electric field gradient in the metal coupled with the transient accumulation of stored electrical energy. The apparatus disclosed serves for the experimental testing of energy conversion and storage by thermoelectric processes occurring in the metal and the ultimate utilization of the technology involved.

Abstract: The detection device includes at least one thermocouple (10) arranged aligned with the bottom head of the vessel of the nuclear reactor, having a first branch (9) made of a first metallic material and at least one second branch (11) made of a second metallic material, different from the first material, welded to a point on the first branch constituting a hot junction of the thermocouple (10). The first branch (9) of the thermocouple has the form of an elongate hollow section. The device furthermore includes means for analyzing the measurements taken by the thermocouples (10).

Abstract: An n-type thermoelectric material composed mainly of an iron-silicite compound represented by a chemical formula of FeSi.sub.2+z in which -0.1<z<0.1. The thermoelectric material further comprising Co as an n-type dopant and Ge as an additive. The iron-silicon compound is composed substantially of a low temperature phase (.beta.-phase).

Abstract: Nanometer holes can be reliably and repeatedly defined in the tips of cantilevered probes and used in various types of scanning microscopy by voltaicly defining the hole within a conductive layer disposed on the tip. The field strengths of the apex of the tip are sufficient to cause evaporation of the metal or conductive material from the apex onto an opposing sample substrate. The hole opens on the apex of the tip and is self-limited by the inherent threshold voltage strength required for vaporization, which voltage strength falls off rapidly from the tip. The hole may be defined in conductive layers in various combinations with oxide layers, other metal layers and semiconductor materials to define Schottky diodes, thermocouple junctions, near-field optical detectors, and atomic force tips. As a result, two or more physical interactions may be simultaneously exploited between the fabricated tip and the scanned sample from which a scanned image may be produced.

Abstract: A method of forming printed circuits on an insulating film comprising the steps of forming a panel plating layer, plating the circuits onto the panel plating layer, applying a film to the plated panel plating layer and chemically removing the panel plating layer. In addition, the printed circuit is impressed into the film so as to form a planar surface and a protective film is placed over the film and impressed circuit. The method of making a thermocouple by this process is also disclosed.

Abstract: A multi-channel remote-temperature-sensing system has a reference temperature assembly for the reference junctions of a plurality of temperature sensors for determining temperatures at remote points. The assembly comprises an array of components each adapted to make thermal contact with a reference junction of a remote-temperature-sensing thermocouple, an absolute reference thermometer situated within the array for measuring an absolute reference temperature, a thermocouple for sensing a temperature difference between the absolute reference thermometer and a component of the array, and data processing means for calculating the temperature of the component of the array from the absolute reference temperature and the temperature difference.

Abstract: A temperature sensor using a thermocouple, optimum for measurement of temperature of an object heated to a high temperature such as the tip of a soldering iron. Comprising a thermocouple formed by mutually bonding dissimilar metal materials, the junction of the dissimilar metal materials of thermocouple is covered with a good conductive metallic sleeve, and the measuring part is formed. Therefore, if an object high temperature contacts with the measuring part, the metal materials composing the thermocouple are not directly heated, and heat conduction to the metal materials is also excellent. Therefore, oxide coating due to heating rarely occurs in the measuring part, and the measuring performance of high precision may be maintained for a long period.

Abstract: A thermocouple element (10) for use in high-pressure, high temperature fluid applications having a cylindrical body portion (12) formed from a first metal and a cap (14) formed from a dissimilar metal. The cap is fused to the body such that the junction (18) forms an axial thermocouple junction. A plurality of grooves (13, 20) is formed in the cap and body to reduce the mass of material adjacent the junction for rapid conduction heat transfer from the fluid being monitored.

Abstract: Apparatus is provided for investigating surface structures irrespective of the materials involved. A fine scanning tip is heated to a steady state temperature at a location remote from the structure to be investigated. Thereupon, the scanning tip is moved to a position proximate to, but spaced from the structure. At the proximate position, the temperature variation from the steady state temperature is detected. The scanning tip is scanned across the surface sturcture with the aforesaid temperature variation maintained constant. Piezo electric drivers move the scanning tip both transversely of, and parallel to, the surface structure. Feedback control assures the proper transverse positioning of the scanning tip and voltages thereby generated replicate the surface structure to be investigated.

Abstract: The invention is an improved theroelement which comprises a graphite/boron carbide thermocouple, the arms of which are constructed as a tube and a rod, arranged concentrically inside the tube, which are electrically connected at one end. One of the arms of the thermocouple consists essentially of boron carbide formed from self bonding boron carbide by pressureless sintering. Prefabricated sleeves of high-purity, boron-oxide-free hexagonal boron nitride are used between the arms of the thermocouple as spacers. Only the end of the arm of the thermocouple constructed as a rod is secured in an electrically conductive connecting piece and the arm is freely mobile in the direction towards the cold junction.

Abstract: A renewable, elongated thermocouple probe having a first elongated thermocouple element and a second elongated thermocouple element surrounding the first element. Electrical insulation material is positioned between opposed surfaces of the first and second thermocouple elements to electrically insulate the elements from each other. A temperature sensing tip is provided at one end of the probe by grinding the end of the probe with an abrasive material to provide an electrically conductive connection in the form of metallic particles to define a conduction path between the first and second thermocouple elements and over the insulating material. The opposite end of the probe can be connected with a thermocouple reference junction in a conventional manner.

Abstract: A thermocouple device for detecting a flame. The device includes an outer thermocouple element having an excellent corrosion resistance and a large thermoelectromotive force, an inner thermocouple element, which is inserted into the outer thermocouple element, having a large thermoelectromotive force, and a junction layer securing end portions of the inner and outer thermocouple element. The junction layer is formed with a soldering material so as to avoid the formation of an alloy of the element materials that would have a poor corrosion resistance normally formed by welding.

Abstract: A measuring system has a pair of sensors with the response time of one sensor lagging the response time of the other. The output of each sensor is sampled periodically and the outputs for two successive samples are compared to calculate the actual value of the parameters based upon the change in the two outputs.

Abstract: A thermoelectric element having two annular components of dissimilar thermoelectric materials and a working junction therebetween and providing radial current flow.

Abstract: The thermocouple has a sheath attached to an outer thermocouple element of a pair of coaxial thermocouple elements between hot and cold junctions of the thermocouple elements with the sheath extending away from the hot junction.

Abstract: A length of metallic wire is positioned inside a length of metallic tube in approximate axial alignment with the tube. A short sleeve is placed around the end of the wire. The sleeve is a different metal from the tube. The difference between the thermoelectric coefficients of the sleeve metal and the wire metal is larger than the difference between the thermoelectric coefficients of the tube metal and the wire metal. The tube metal is more resistant of oxidation than the sleeve metal.

Abstract: An improved hot junction construction for thermocouples is provided by means of a tight fitting internal tube positioned over the outer end of the thermocouple wire prior to its fusion with the tip tube. The internal tube is formed of an alloy, such as an iron alloy containing chromium and nickel, such that the components thereof form a metal solution with the components of the thermocouple wire, which may be of a nickel-containing alloy such as copper-nickel alloy, and the external tube formed, for example, of an iron-chromium alloy. When the outer ends of the wire, internal tube and tip tube are fused, a hot junction is produced which is substantially free of pores, gaseous inclusions and stresses.