For Single Valve Patents (Class 137/87.06)
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Patent number: 8851100Abstract: A sampling and rejection device for a boiler or steam generating system is described. The sampling and rejection device receives the condensate or fluid and allows a volume of the condensate to liquefy or the fluid to build up in the interior of the sampling and rejection device. One or more conductivity, pH, and temperature sensors or probes are positioned in the sampling and rejection device to measure the condensate. The sampling and rejection device includes a collection vessel to hold and temporarily store the condensate. The sampling and rejection device includes an outlet or a return line (to a central boiler) and a drain line. If the sensor measures undesirable conductivity, pH, or temperature in the condensate in the collection vessel, then a valve to the drain line is opened and the condensate is rejected.Type: GrantFiled: January 28, 2011Date of Patent: October 7, 2014Assignee: Automation Tech, Inc.Inventor: Kevin Petzoldt
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Patent number: 8387710Abstract: A downhole valve for insertion in a production tubing string permits recirculation of fluid pumped into the casing annulus. The valve includes a cylindrical housing defining an opening, an internal mandrel disposed within the housing, defining a central bore and defining an opening, a valve between the housing and the mandrel, wherein said valve opens to allow fluid communication from the mandrel central bore to the annulus space in response to a pressure differential between the mandrel central bore and the annular space, and biasing means for biasing the valve in a closed position. The valve may be set within a completion string by wireline techniques.Type: GrantFiled: March 5, 2009Date of Patent: March 5, 2013Assignee: Stellarton Technologies Inc.Inventors: Grant George, Geoff Steele, Jordan James
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Publication number: 20080135263Abstract: A method of combining a first fluid from a first source (1) with a second fluid from a second source (16) in a de-sired ratio, by measuring the flow rate and pressure of the first fluid (at 12 and 14) prior to combining (at 10), and determining from this the desired flow rate and pressure at which the second fluid should be added to achieve the desired ratio. The pressure and flow rate of the second fluid is measured (at 6 and 8) and provides a feedback loop to ensure that the second fluid is being added at the desired flow rate and pressure to achieve the desired ratio. The pressure and flow rate of the second fluid may be controlled by multiple pumps 2 of different power.Type: ApplicationFiled: February 3, 2006Publication date: June 12, 2008Inventor: Graham Douglas Millard
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Patent number: 7192665Abstract: A regulator for use with fuel cells, which is mounted in a pressure controller of a fuel cell system, has a first diaphragm flexible under the pressure of pilot air supplied as an oxidizing agent to a pilot chamber, a second diaphragm flexible under the pressure of a hydrogen-containing gas flowing through a fluid passage, and a rod connected to a valve head. The spring force of a first spring is set to a value greater than the spring force of a second spring. The regulator is of a normally closed type in which the valve head is seated on a valve seat when the pilot air is not supplied to the pilot chamber.Type: GrantFiled: December 1, 2003Date of Patent: March 20, 2007Assignee: Keihin CorporationInventors: Yoji Nakajima, Kazuki Ishikawa, Takashi Yoshida, Katsumi Sahoda, Kouji Miyano
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Patent number: 6622745Abstract: A waste diversion system for diverting the effluent from a manufacturing process, such as polishing the surfaces of silicon wafers, has an electrically controlled diverter valve for receiving the effluent and diverting it either to a “dirty” output for waste treatment, or to a “clean” output for recycling or other treatment. To determine whether the effluent is “dirty” or “clean”, parameter sensors are located to sense particular parameters such as turbidity, conductivity, ORP, pH, or ion content, as desired. One sensor is located to sense the parameters of effluent flowing into the diverter valve; and the other sensor is located to sense the parameters (typically, the same parameters) of the flow from the “dirty” or waste side of the diverter valve. Only when both of the sensors indicate that the effluent is “clean” is a signal provided to the diverter valve to switch it to the clean output.Type: GrantFiled: January 7, 2002Date of Patent: September 23, 2003Assignee: Projex IMS, Inc.Inventors: Craig Roland Smith, David A. White
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Patent number: 6532980Abstract: The invention relates to a method and apparatus for determining the switching pressure of a safety appliance, which is adapted to safeguard an installation against exceeding, or falling below, a gas pressure. An increasing pressure is applied to the safety appliance such that the applied increasing pressure rises in accordance with an exponential function. Due to the constant relative increase in the pressure supplied to the safety appliance, it is not necessary to take into account settings of the safety appliance. Errors resulting from incorrect settings by the user are thus prevented.Type: GrantFiled: August 22, 2001Date of Patent: March 18, 2003Assignee: Kamstrap B.V.Inventor: Jacobus F. A. Langeveld
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Publication number: 20010052359Abstract: A method of substrate temperature control for plasma processing apparatus in which a substrate which is being held on a substrate holder in a process chamber is being processed, and He gas is passed through the gap between the substrate and the substrate mounting surface during the processing of the substrate, the substrate temperature is controlled by the thermal transfer characteristics of the gas and the substrate is cooled to the prescribed temperature, and the pressure of the He gas is preset by a pressure setting part 50a, the actual pressure is measured with a pressure gauge 49, and the gas flow rate is controlled in such a way that the measured pressure becomes equal to the set pressure by a pressure control valve 46. Furthermore, the substrate temperature controllability is assessed by monitoring the gas flow rate with a substrate temperature controllability assessment part 50b.Type: ApplicationFiled: August 31, 1999Publication date: December 20, 2001Inventor: MASAYOSHI IKEDA