Abstract: A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

Abstract: A crimp tool calibration system for crimping a prepared wire into a corresponding contact wire barrel includes a computer, a positioner having a memory chip storing positioner data, and a tool frame. The tool frame includes a head having a receiving port therethrough, and configured for the positioner to be removably engaged with the receiving port during a crimping operation. The tool frame also includes a plurality of crimping dies positioned around a periphery of the receiving port, an adjustment device to adjust a crimp depth, and a positioner interface coupled to the tool frame. The positioner interface includes a tool memory for storing tool data, a reader, and a transmitter, where the reader is configured to read the positioner data stored on the memory chip of the positioner, and the transmitter is configured to transmit the positioner data and the tool data to the computer.

Abstract: A magnetic stylet includes a core element and a distal region. The core element may include a proximal end coupled to a tab, the proximal end having a first diameter, a transition region, and a distal region extending from the transition region to a distal end. The distal region may have a second diameter less than the first diameter. The distal section may include the transition region and the distal region of the core element, a magnetic element, a polymer member, and a closure element. The magnetic element may be positioned distal of the transition region of the core element. The polymer member may be circumferentially disposed about the distal region of the core element, the continuous permanent magnetic element, and at least a portion of the transition region of the core element. The closure element may be an epoxy that forms a rounded end distal of the polymer member.

Abstract: A device for bending wire that includes a pin extending from an upper surface of a plate, a shaft extending through a center aperture of the plate and terminating in a bend head, a sleeve rotatably disposed around the shaft, a first motor for rotating the plate about the shaft, and a second motor configured to move the plate between extended, retracted and intermediate positions along the shaft. The plate positioned in the extended position and rotating causes the first pin to travel in front of a wire aperture of the bend head. The plate positioned in the intermediate and the retracted positions and rotating causes the first pin to travel underneath the wire aperture. The plate positioned in the retracted position causes the plate to engage with the sleeve such that rotation of the plate causes rotation of the sleeve.

Abstract: A core wire deformation jig and a method for deforming a plurality of core wires which are exposed from an end of a multi-core cable for a further working step. The jig includes a first clamping unit for clamping the core wires aligned on the arranging plane in a first clamping direction intersecting the arranging plane, a separation pin for separating the core wires, wherein the separation pin is inserted between the core wires in a insertion direction parallel to the first clamping direction, and a second clamping unit for providing bends to the core wires by clamping the core wires in a second clamping direction parallel to the arranging plane and intersecting the plurality of core wires and applying a pressure on the core wires, with the separation pin inserted between the core wires.

Abstract: A film cutting apparatus includes: a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface; a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a film is provided; a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a film is provided; at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate; a first elastic member between the first die plate and the punch plate; a second elastic member between the punch plate and the second die plate; and an elevator configured to press the first die plate.

Abstract: A component feeder including a feeding mechanism configured to intermittently feed taped components in a feeding direction at a specified feeding pitch to a supply position; first lead cutting mechanism configured to, for separating the component positioned at the supply position from the carrier tape, in a case in which the component has three leads, cut two of the leads Leo that are on an outer side of the three leads at a given position such that a length by which the two leads protrudes from the component main body is a first length; and second lead cutting mechanism configured to, before the cutting of the two leads by the first lead cutting mechanism, cut a single lead that is at a center of the three leads positioned forward of the supply position in the feeding direction to a second length that is shorter than the first length.

Abstract: The present invention is directed towards an automated bending device for bending a strip of material into a desired shape. The device is either a single or dual bending tool with interchangeable rotating bending dies which allows for a faster transition from a break bend to a radius bend using air cylinders for positioning of the tools.

Abstract: A chuck apparatus includes a nozzle with a first end configured to engage a device under test (DUT), and a clamp extending around a portion of the nozzle proximate the first end. The clamp includes a recess to receive the DUT, and an engagement surface in the recess to engage the DUT. The chuck apparatus also includes a spring that biases a surface of the clamp toward the first end of the nozzle. A method includes translating a chuck to engage a nozzle with a DUT, further translating the chuck to engage and self-align an engagement surface of a spring mounted clamp with the DUT, further translating the chuck to seat the DUT in the spring mounted clamp, translating the chuck with the DUT to a contactor and translating the chuck with the DUT to engage conductive features of the DUT with conductive probes of the contactor.

Abstract: A robotic system including a robot and an end effector cuff connected to the robot. The end effector cuff has a body and includes at least one fluid inlet, at least one fluid port fluidly connected to the at least one fluid inlet, at least one fluid valve fluidly connected to the at least one fluid port and housed within the body of the end effector cuff, and an electronic control unit operably coupled to the robot and housed within the body of the end effector cuff. The robotic system also includes an end effector connected to the end effector cuff.

Abstract: An improvement to a lead forming system that provides quick changeover without complete disassembly. By removing a pair of fasteners securing a pair of die inserts, a spring pack in an upper die unit can be freely rotated and interchanged or modified. The spring pack has a plurality of chamfers that allow the spring pack to rotate within the die pack until a narrower side is presented for removal. Straightforward access to the cutting units is afforded when the spring pack is removed. Risk of damage to various components of the lead forming system is minimized and the precision and accuracy of the new setup is increased because the system was minimally disassembled. A method for removing the spring pack in the upper die unit is fully disclosed.

Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.

Abstract: A feed mechanism for feeding a filament through a print head assembly in an FDM printer. The feed mechanism includes a first oval-shaped track having a plurality track elements extending around the first track and a second oval-shaped track having a plurality of track elements extending around the second track, where the first and second tracks counter-rotate. A space is defined between the first and second tracks that receives the filament in a manner so that the track elements that are in the space contact the filament, where rotation of the first and second tracks in opposite directions causes the filament to be driven through the space and onto the print head.

Abstract: A radial press is provided, the radial press having a frame structure, a pressing tool, a drive unit, and a press control. The pressing tool comprises a plurality of pressing elements which are disposed uniformly concentrically around a press axis and have pressing surfaces. During the appropriate activation of the drive unit, the pressing elements can be moved synchronously as required towards or away from the press axis. To this end, at least two measured value recorders, which are connected for signal transmission purposes to a comparator associated with the press control, are disposed on the pressing tool at positions spaced apart from one another in the direction of the press axis (A). When the comparative value, generated by the comparator, of the measured values provided by the measured value recorders exceeds a tolerance range stored in the press control, an activation of the signal output unit is triggered.

Abstract: A lead trimming module and system provides automated means for trimming leads of a mounted electrical component. A controller executes a programmable lead trimming algorithm and correspondingly controls a movement apparatus, such as an XYZ gantry robot, and mounted lead trimming module for selectively trimming lead protrusions to a programmed lead length.

Abstract: A transporting apparatus configured to transport an object to a storage container includes: a transporting rod having one end configured to connect to the object, the transporting rod extending in a transporting direction of the object; a transporting portion that moves the transporting rod in the transporting direction of the object; and a contact sensor portion provided on an outer wall of the transporting rod and configured to sense contact between the transporting rod and the storage container.

Abstract: An apparatus for manufacturing components from a fiber-reinforced composite material by a generative layer construction process including a control device and a tool head fastened to a carrier arm movable via the carrier arm in three spatial directions. The tool head comprises a feed device configured to feed to the tool head a semi-finished layer comprising reinforcing fibers impregnated with a curable plastic material. A shaping device, via movement of the tool head, applies a force to shape the semi-finished layer. A curing device introduces energy into the semi-finished layer, the energy curing the plastic material in the semi-finished layer. The control device controls the movement of the tool head as well as the operations of the feed device, the shaping device and the curing device wherein semi-finished layers are repeatedly fed, shaped, cured and stacked one on top of another to construct the component layer by layer.

Abstract: A computer numerical control (cnc) bending machine used to bend and then cut a specific programmed profile from a long length of cable comprising: a base, a carriage, a bend head and a saw; the carriage includes a spindle to rotate the cable, the carriage is also able to transport the cable in a linear fashion; the bend head comprises a clamp and a wiper roller and a bend die; after a last bend is formed, the clamp and wiper roller are retracted away from the bend die; the carriage is then able to then transport the cable forward away from the saw, the spindle is then able to rotate the cable out of the plane of the bend, the carriage is then able to transport the cable back toward the saw; the saw is then able to sever the cable such that a last leg length adjacent to the last bend which is shorter than the fixed distance between the saw and the bend die.

Abstract: A processing apparatus for semiconductor work pieces and related methodology is disclosed and which includes a processing chamber having an internal cavity, and which has a plurality of rotatable processing stations positioned therein and wherein the rotatable processing stations each process a semiconductor work piece.

Abstract: A computer numerical control (cnc) bending machine used to bend and then cut a specific programmed profile from a long length of cable comprising: a base, a carriage, a bend head and a saw; the carriage includes a spindle to rotate the cable, the carriage is also able to transport the cable in a linear fashion; the bend head comprises a clamp and a wiper roller and a bend die; after a last bend is formed, the clamp and wiper roller are retracted away from the bend die; the carriage is then able to then transport the cable forward away from the saw, the spindle is then able to rotate the cable out of the plane of the bend, the carriage is then able to transport the cable back toward the saw; the saw is then able to sever the cable such that a last leg length adjacent to the last bend which is shorter than the fixed distance between the saw and the bend die.

Abstract: A method for forming a wave form for a stent includes moving a first forming portion of a first forming member across an axis along which a formable material is provided in a first direction substantially perpendicular to the axis to engage and deform the formable material while engaging the formable material with a first forming portion of the second forming member. The method includes moving the first forming portion of the first forming member and the first forming portion of the second forming member across the axis in a second direction that is substantially opposite the first direction to draw and form the formable material over the first forming portion of the second forming member, disengaging the first forming member from the formable material, and moving the first forming member to position a second forming portion of the first forming member to face the formable material.

Abstract: A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.

Abstract: A method for forming a wave form for a stent includes moving a first forming portion of a first forming member across an axis along which a formable material is provided in a first direction substantially perpendicular to the axis to engage and deform the formable material while engaging the formable material with a first forming portion of the second forming member. The method includes moving the first forming portion of the first forming member and the first forming portion of the second forming member across the axis in a second direction that is substantially opposite the first direction to draw and form the formable material over the first forming portion of the second forming member, disengaging the first forming member from the formable material, and rotating the first forming member to position a second forming portion of the first forming member to face the formable material.

Abstract: The chainsaw guide bar straightener has a flat table having a length of about ? of the nominal length of a chainsaw guide bar, and a clamp on one corner of the table. The clamp is used for pressing the guide bar down against the table along a diagonal of the guide bar, for better measuring deformation in the guide bar. In another aspect, the chainsaw guide bar straightener has a pair of spaced apart anvil posts mounted to the frame thereof. These anvil posts define an open space there between. The chainsaw guide bar straightener further includes an hydraulic cylinder mounted to the machine frame. The hydraulic cylinder has a rod end head being movable along a working axis extending between the anvil posts and being centered with the open space, for straightening a chainsaw guide bar that is positioned between the rod end head and the anvil posts.

Abstract: A feeder installing attachment includes: a main body portion including attachment side fitting parts provided on a lower surface thereof and having an installing compatibility with first feeder side fitting parts provided on a lower surface of a first tape feeder; and second feeder installing slots formed on an upper surface of the main body portion and engaging with second feeder side fitting parts provided on a lower surface of a second tape feeder having a standard width smaller than that of the first tape feeder. In a state where the attachment is mounted, an array pitch of the second feeder installing slots is smaller than an array pitch of the base side installing slots, and becomes an array pitch corresponding to the standard width of the second tape feeder.

Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.

Abstract: Monofilament metal saw wire for a wire saw, wherein the saw wire being provided with a plurality of crimps. The crimps are arranged in at least two different planes, such that, when measured, between measuring rods of a micrometer, over a length comprising crimps in at least two different planes, a circumscribed enveloping D diameter of the saw wire is between 1.05 and 1.50 times a diameter d of the saw wire itself.

Abstract: An apparatus for the processing of wire and/or tubular components includes a base member and at least two wire/tube processing modules. The modules can be releasably engaged with each other and the base member in which engagement mechanically and electrically couples the modules and the base member. The base member includes an operator interface enabling operation to any linked module.

Abstract: A technique which can assemble a mandrel having a substantially cylindrical shape and being dividable into plurality of segments, which is used for manufacturing, for example, a fuselage of an aircraft, with high position accuracy and an easy manner. In a segment fastening step, a segment which is a fastened target is fastened to a specified fastening portion which is one of a plurality of fastening portions set along a pair of support rings placed to face each other. In a rotation step, before the segment fastening step, the support rings are rotated so that the specified fastening portion is located at an uppermost portion of the support rings. In the segment fastening step, the segment which is the fastened target is placed between the support rings and lifted vertically up to a height corresponding to the specified fastening portion and then fastened to the support rings.

Abstract: A device for manufacturing wire coils includes: at least two rotationally supported drums which are mounted at a predefined distance from one another, the at least two drums each having at least one bending peg mounted on a lateral surface of the corresponding drums and protruding essentially perpendicularly, a movable wire guiding device winding the wire around the bending pegs protruding from the at least two drums to produce at least one wire winding. The wire guiding device aligns the wire between two bending pegs under a predefinable elastic tension and winds the wire under tension around the corresponding bending peg due to a rotational movement.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: A lead pin correction device includes a holding unit holding an electronic device having lead pins; a pressing unit pressing the electronic device held by the holding unit in an extending direction of the lead pins; and a correction fixture including holes having a shape corresponding to a shape of the lead pins after correction. Further, the shape of the lead pins is corrected so as to fit the shape of the holes by inserting the lead pins into the holes by pressing the electronic device with the pressing unit while distal ends of the lead pins are inserted into the holes, the electronic device being held by the holding unit.

Abstract: A highly reliable rectifying device of a vehicle alternator capable of improving the vibration resistance of a diode. A connection lead 33d of a diode 33 included in a rectifying device includes a linear part 33f extended in parallel from a metallic base 33b, and a bent part 33g bent 90° or more substantially like an arc from the linear part 33f. The bending radius R of the bent part 33g is set to a value larger than a separation distance w in a horizontal direction between the terminal of the linear part 33f and the distal part of the connection lead 33d.

Abstract: A device (10, 10?) and method for crimping an implant (20), which can assume either a compressed state or an expanded state, at least over a portion of the length thereof. An crimping device is attained according to the invention in that a hollow-cylindrical and/or hollow-conical, preferably braided wire netting is provided, in the inner volume (14, 14?) of which the implant (20) in the expanded state can be placed, at least via a section thereof, wherein, upon application of a tensile force on at least one end in the longitudinal direction, and/or upon application of a compressive force in the radial direction, the wire netting simultaneous undergoes extension and a reduction of the inner diameter (d, d?) such that the implant (20) can be transformed, at least along a section thereof, from the expanded state into the compressed state.

Abstract: A cable bolt comprising a plurality of flexible steel filaments formed around a central member, the cable bolt having spaced bulbous portions along the length of the bolt each bulbous portion defining a cavity containing a segmented ring that surrounds the central member to engage the filaments of the bulbous portion.

Abstract: An end treatment portion 1a which treats ends Wa and Wb of an electric wire W and a transfer portion 7 which transfers the electric wire W are provided; a discharge portion 6, which discharges the electric wire W which is subjected to an end treatment by the end treatment portion 1a and transferred by the transfer portion 7, is also provided; the discharge portion 6 includes a discharge beam 11 for securing the electric wire W in a predetermined arrangement pattern; a calculation portion 20, which controls a securing treatment for securing the electric wire W to the discharge beam 11 in the discharge portion 6, is provided; and the predetermined arrangement pattern is set by the calculation portion 20 based on a content of processing the electric wire W at a subsequent process.

Abstract: A self-aligning memory alloy wire actuator has a memory alloy wire having first and second ends with at least one terminal coupled to one end of the memory alloy wire. The terminal includes two wings and an extended piece connected in the shape of a T. The two wings are disposed on opposite sides of the extended piece and perpendicular to the extended piece. Each wing comprises top and bottom surfaces, a front surface, and an outside end. The top surfaces of the two wings lie on a common top plane and the front surfaces of the two wings lie on a common front plane. The memory alloy wire is coupled to the extended piece of the terminal.

Abstract: A pin regulator for an electronic component includes a base seat, a regulating member rotatably connected on the base seat, and a driving module assembled on the base seat. The base seat defines a latching groove, and a sidewall of the latching groove defines a plurality of regulating slots to receive the pins of the electronic component therein. The driving module is rotatably connected to the regulating member to engage the regulating member in the latching groove.

Abstract: A guidewire comprising an elongate guide member dimensioned for insertion within a body vessel of a subject is disclosed. The guide member defines a longitudinal axis and has trailing and leading end segments. The leading end segment has a reduced cross-sectional dimension relative to a cross-sectional dimension of the trailing end segment. The leading end segment includes at least one finger thereon. A first transverse dimension of the finger is greater than a corresponding first transverse dimension of the leading end segment in contact therewith.

Abstract: An end treatment portion 1a which treats ends Wa and Wb of an electric wire W and a transfer portion 7 which transfers the electric wire W are provided; a discharge portion 6, which discharges the electric wire W which is subjected to an end treatment by the end treatment portion 1a and transferred by the transfer portion 7, is also provided; the discharge portion 6 includes a discharge beam 11 for securing the electric wire W in a predetermined arrangement pattern; a calculation portion 20, which controls a securing treatment for securing the electric wire W to the discharge beam 11 in the discharge portion 6, is provided; and the predetermined arrangement pattern is set by the calculation portion 20 based on a content of processing the electric wire W at a subsequent process.

Abstract: A lead forming apparatus has a function of bending leads of a semiconductor device having leads into a gull wing shape. The lead forming apparatus includes: a lead bending die, as a lower die, allowing thereon placement of the semiconductor device and accepting the leads in the bending leads; a lead bending punch, as an upper die, descending towards the lead bending die so as to move the leads of the semiconductor device towards the lead bending die, to thereby bend the leads into a gull wing shape; and a first stopper specifying the bottom dead center of the lead bending punch, so as to ensure a distance not smaller than thickness of the leads between the bottom surface of the lead bending punch and the top surface of a portion, allowing thereon placement of the leads, of the lead bending die.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Provided is that a lead-forming die includes an upper die and a lower die disposed so as to oppose the upper die; a supporting unit for semiconductor package, provided on an upper face of the lower die; a moving unit provided on a lower face of the upper die and movable in a direction that the upper die and the lower die oppose each other; a plurality of shafts supported by the moving unit so as to axially move with respect thereto; a presser provided above the supporting unit for semiconductor package, and at a lower end portion of the shaft; and a locking device that stops a movement of the shaft, provided between the upper die and the moving unit.

Abstract: An endoscopic instrument according to the present invention includes: a wire disposed in a flexible sheath and capable of freely projecting relative to the flexible sheath, the distal end of the wire expanding in radius to form a loop section or a basket section upon being projected from the sheath; and a fixture cylinder for fixing the inserted proximal end of the wire, wherein the fixture cylinder is provided with a wire-radius-increasing-direction-regulating section for regulating the direction in which the radius of the wire increases; and a wire-fixing section, disposed in the vicinity of the proximal end relative to the wire-radius-increasing-direction-regulating section, for fixing the wire.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

Abstract: Disclosed is an apparatus for forming a wire to include coil segments useable in a dynamoelectric machine, the apparatus including a plurality of forming structures simultaneously moveable along an axis into a coil segment forming configuration, with at least a number of the plurality of forming structures being configured to hold a wire, and at least one actuating device associated with at least a number of the plurality of forming structures and configured to simultaneously move the number of the plurality of forming structures into the coil segment forming configuration.

Abstract: A cable bulbing apparatus having a frame (1) and securing means (3) for holding at least a portion of a cable bolt (4) with respect to the frame (1). The apparatus also includes a bulbing assembly (5) which is releasably engagable with the cable bolt (4). The assembly (5) is movable relative to the frame (1) to enable one or more bulbs to be formed along the cable bolt length.

Abstract: A lead forming apparatus has a function of bending leads of a semiconductor device having leads into a gull wing shape. The lead forming apparatus includes: a lead bending die, as a lower die, allowing thereon placement of the semiconductor device and accepting the leads in the bending leads; a lead bending punch, as an upper die, descending towards the lead bending die so as to move the leads of the semiconductor device towards the lead bending die, to thereby bend the leads into a gull wing shape; and a first stopper specifying the bottom dead center of the lead bending punch, so as to ensure a distance not smaller than thickness of the leads between the bottom surface of the lead bending punch and the top surface of a portion, allowing thereon placement of the leads, of the lead bending die.