Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.

Abstract: A method for the manufacturing of an object. The method includes receiving a desired alloy composition for the object, depositing a plurality of foils in a stack to form the object, applying heat to the stack at a first temperature to bond the plurality of foils to each other, and applying heat to the stack at a second temperature to homogenize the composition of the stack. The homogenized stack has the desired alloy composition.

Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.

Abstract: Disclosed is a semiconductor package comprising a semiconductor chip, an external connection member on the semiconductor chip, and a dielectric film between the semiconductor chip and the external connection member. The semiconductor chip includes a substrate, a front-end-of-line structure on the substrate, and a back-end-of-line structure on the front-end-of-line structure. The back-end-of-line structure includes metal layers stacked on the front-end-of-line structure, a first dielectric layer on the uppermost metal layer and including a contact hole that vertically overlaps a pad of an uppermost metal layer, a redistribution line on the first dielectric layer and including a contact part in the contact hole and electrically connected to the pad, a pad part, and a line part that electrically connects the contact part to the pad part, and an upper dielectric layer on the redistribution line.

Abstract: A method for manufacturing at least a part of a timepiece is disclosed. The method comprises a first step of assembling flat layers together to from a substantially flat multilayer structure, Wherein at least a first layer of said layers is designed to form one flexible blade in the timepiece. Then, the multilayer structure is deployed in a direction substantially normal to the flat layers. Then at least one mass is fixed to the flexible blade, the mass being more rigid than the flexible blade.

Abstract: A composition of a nickel based alloy mixture which can be used for welding via especially liquid metal deposition or as a powder bed of an additive manufacturing method. A metallic powder mixture includes (in wt %): a cobalt (Co) or nickel (Ni) based super alloy with a content of 20% to 60%, a NiCoCrAlY-composition with a content of 70% to 30% and a metallic braze material with a content between 10% to 5%. The melting point of the braze material is at least 10K lower than the melting point of the nickel or cobalt based superalloy.

Abstract: A method of forming a high strength copper alloy. The method comprises heating a copper material including from about 2 wt. % to about 20 wt. % manganese by weight of the copper material to a temperature above 400° C., allowing the copper material to cool to a temperature from about 325° C. to about 350° C. to form a cooled copper material, and extruding the cooled copper material with equal channel angular extrusion to form a cooled copper manganese alloy.

Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.

Abstract: This free-cutting copper alloy contains 75.0 %-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.

Abstract: A method includes determining a vibration characteristic of a shrouded turbine blade, which includes an airfoil attached to a shroud. A corner of the shrouded turbine blade can be removed after determining the vibration characteristic.

Abstract: A copper alloy sputtering target is formed by a copper alloy including the content of Ca being 0.3 to 1.7% by mass, the total content of Mg and Al being 5 ppm or less by mass, the content of oxygen being 20 ppm or less by mass, and the remainder is Cu and inevitable impurities. A manufacturing method of a copper alloy sputtering target comprises steps of: preparing a copper having purity of 99.99% or more by mass; melting the copper so as to obtain a molten copper; controlling components so as to obtain a molten metal having a predetermined component composition by the addition of Ca having a purity of 98.5% or more by mass into the molten copper and by melting the Ca; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.

Abstract: A multi-component braze filler alloy comprising at least 70% by weight MarM509A superalloy with the remainder MarM509B superalloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. It is shown that generally higher braze temperatures lead to improved results including the possibility of re-welding such a brazed component, resulting in a re-repaired brazed component capable of continued commercial service.

Abstract: A multi-component braze filler alloy comprising 60-70% by weight CM247 superalloy and BRB braze alloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. The substrate/braze interface may be subsequently weld-repaired without de-melting and migrating the braze alloy from the interface. The weld zone and surrounding area are solidification crack resistant. After the alloy composition is brazed to the base substrate the component may be returned to service. Thereafter the component remains repairable by welding or re-brazing, if needed to correct future in-service defects.

Abstract: A method of brazing including melting a surface region (26) of a substrate (12, 14, 22) and contacting a braze material (10) with the melted surface region, the braze material including a plurality of braze fillers (16) and a plurality of carbon structures (18). The method further includes subjecting the braze material to an amount of energy effective to melt the braze fillers but not the carbon structures, and cooling the braze material to form a brazement (28, 32) including the carbon structures within at least a portion of the substrate. The brazement includes a gradient (30) of the carbon structures, wherein a concentration of the carbon structures increases in a direction away from an interior of the substrate.

Abstract: A method for producing an aluminum alloy heat exchanger includes applying a coating material prepared by mixing an Si powder, a flux powder, and a binder to a surface of a multiport flat refrigerant tube, assembling an aluminum alloy bare fin with the multiport flat refrigerant tube, and brazing the multiport flat refrigerant tube and the aluminum alloy bare fin to obtain an aluminum alloy heat exchanger, the multiport flat refrigerant tube being formed of an aluminum alloy extruded material that includes 0.5 to 1.7 mass % of Mn, less than 0.10 mass % of Si, and less than 0.

Abstract: A method of manufacturing coated components, e.g., for use in downhole drilling, which may limit, during the manufacturing process, the formation of microfissures and other performance-inhibiting characteristics in the abrasion resistant coating. The method may include applying an abrasion resistant coating composition to a substrate. The abrasion resistant coating composition and at least the surface of the substrate may be heated to effect metallurgical bonding of the abrasion resistant coating composition with the substrate. The substrate may then be austempered under process conditions selected to limit the volume of expansion of the substrate during austempering to less than about 0.8%.

Abstract: A nickel base repair alloy comprises a blend of about 40 to 60 wt % of a first nickel based braze alloy containing boron, about 15 to 35 wt % of a first nickel based filler material, and the remainder consisting of a blend of a second nickel based filler material and a low melting eutectic braze nickel based alloy.

Abstract: A method includes depositing a metal seal material onto a first component of a protective module. The method also includes placing a second component of the protective module into contact with the metal seal material. The components of the protective module define a cavity configured to hold one or more devices. The method further includes heating the metal seal material to create a metal seal between the components of the protective module. In addition, the method includes depositing an outer metal material over and in contact with the metal seal. Heating the metal seal material to create the metal seal could include performing an anneal process with a peak temperature of about 150° C. to about 200° C. The method could optionally include alloying part of the metal seal with part of the outer metal material to create alloyed regions between the components of the protective module.

Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Abstract: The present invention relates to an automotive clad sheet product comprising a core layer and at least one clad layer wherein the core comprises an alloy of the following composition in weight %: Mg 0.45-0.8, Si 0.45-0.7, Cu 0.05-0.25, Mn 0.05-0.2, Fe up to 0.35, other elements (or impurities) <0.05 each and <0.15 in total, balance aluminum; and the at least one clad layer comprises an alloy of the following composition in weight %: Mg 0.3-0.7, Si 0.3-0.7, Mn up to 0.15, Fe up to 0.35, other elements (impurities) <0.05 each and <0.15 in total, balance aluminum. The clad automotive sheet product provides excellent hemmabtlity which does not substantially change over time and yet also provides a good age-hardening response after bake hardening.

Abstract: The present concept is a method of cladding and fusion welding of superalloys and includes the steps of firstly application of a composite filler powder that consists of 5-50% by weight brazing powder which includes melting point depressants, and 50-95% by weight high temperature welding powder, to a superalloy base material. Secondly there is simultaneous heating of the base material and the composite filler powder by a welding heat source that is movable relative to the base material. There is heating to a temperature that will fully melt the brazing powder and at least partially melt the high temperature welding powder and also melt a surface layer of the base material, thereby forming a weld pool. Thirdly upon solidification and cooling of the weld pool, there is coalescence between the weld bead and the base material.

Abstract: It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 ?m and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.

Abstract: A clad material for a cooler is provided by executing production of a tensile strain of 3 to 10% or rolling at a finish rolling ratio of 10 to 25%, and optionally performing a heat treatment for 1 to 8 hours at a temperature within a range from 150 to 400° C., on a clad raw material having a three layer structure of a core material, a first brazing filler metal layer that covers one side (the surface on the side of a cooling water passage) of this core material, and a second brazing filler metal layer that covers the other side (the surface on the opposite side from the cooling water passage). Specific ranges are prescribed for certain properties before and after brazing.

Abstract: A method for controlling the beta-tin crystal orientation in solder joints is provided. The method is suitable for joining metallization pads using a solder containing tin and silver. By adjusting the silver content in the solder within a specific range of equal to or more than 2.5 wt. % and less than 3.2 wt. %, the [001] axes of beta-tin crystals in the solder is aligned to be in the direction parallel with a solder/metallization pad interface substantially. Electromigration-induced solder deformations and metallization pad consumption can be significantly reduced when solder joints have such a microstructure. Additionally, the undesired Ag3Sn plates in the solder matrix can be avoided accordingly.

Abstract: In a brazing repair material 3 which is charged into a repairing portion of base material 1 in which a failure such as a crack 2 and corrosion is generated, diffusion heat treatment is carried out, the brazing repair material 3 is integrally bonded to the repairing portion to repair the repairing portion, the brazing repair material 3 comprises a mixture of non-molten alloy powder having a composition similar to that of the base material 1 and molten alloy powder which is melted at a temperature of the diffusion heat treatment, and the molten alloy powder is brazing repairing alloy consisting of 0.001 to 0.05 mass % of C, 2 to 5 mass % of Si, 10 to 25 mass % of Cr, 15 to 25 mass % of Co, 1 to 5 mass % of B, and balance of Ni, and excluding Al. With this configuration, a part having a failure such as a crack can restore original characteristics like the inherent base material.

Abstract: Problem To improve the electromigration (EM) resistance of a solder joint. Solution The present invention provides a unique structure for an interfacial alloy layer which is able to improve the electromigration (EM) resistance of a solder joint, and a unique method of forming this structure. More specifically, in this unique structure, a controlled interfacial alloy layer is provided on both sides of a solder joint. In order to form this structure, aging (maintenance of high-temperature conditions) is performed until an interfacial alloy layer of Cu3Sn has a thickness of at least 1.5 ?m.

Abstract: A ternary near eutectic alloy of Ni, Ti, Cr is described having a relatively low melting temperature of approximately 1230 deg. C. or less, suitable for fusing cracks in turbine blades and vanes without substantial risk of cracking during the repair process. Such an alloy is suitable for low temperature joining or repair of turbine blades since it contains the same components as typical turbine blades and vanes without foreign elements to lower the melting point of the repaired material or adversely affect the mechanical properties of the repaired component. Exclusion of boron eliminates the formation of brittle boron compounds, detrimental to the properties of the repair or seam.

Abstract: An amorphous, ductile brazing foil is produced with a composition of FeaNibCrcSidBeMofPg with 25?a?50 atomic %; 30?b?45 atomic %; 5<c?15 atomic %; 4?d?15 atomic %; 4?e?15 atomic %; 0?f?5 atomic %; 0?g?6 atomic %; and any impurities, wherein 10?d+e+g?28 atomic % with a+b+c+d+e+f+g=100. Excellent brazing joints can be produced with these brazing foils.

Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Abstract: The invention relates to a sandwich material for brazing comprising a core layer of a first aluminum alloy and a barrier layer of a second aluminum alloy characterized by that: the first alloy, constituting the core layer contains (in weight %): 0.8-2% Mn, ?1.0% Mg, 0.3-1.5% Si, ?0.3% Ti, ?0.3% Cr, ?0.3% Zr, ?1.3% Cu, ?0.5% Zn, ?0.2% In, ?0.1% Sn and ?0.7% (Fe+Ni), the balance consisting of Al and ?0.05% of each of the unavoidable impurities, and that the second alloy, constituting the barrier layer contains (in weight %): ?0.2% Mn+Cr, ?1.0% Mg, ?1.5% Si, ?0.3% Ti, ?0.2% Zr, ?0.3% Cu, ?0.5% Zn, ?0.2% In, ?0.1% Sn and ?1.5% (Fe+Ni), the balance consisting of Al and ?0.05% of each of the unavoidable impurities, The invention also concerns a method for the manufacture of the sandwich material, a brazed product, such as a heat exchanger comprising the sandwich material and the use of the brazed product at high and low temperatures.

Abstract: Disclosed herein are iron-based alloys having a structure comprising fine-grained ferritic matrix and having a 60+ Rockwell C surface, wherein the ferritic matrix comprises <10 ?m Nb and W carbide precipitates. Also disclosed are methods of welding comprising forming a crack free hardbanding weld overlay coating with such an iron-based alloy. Also disclosed are methods of designing an alloy capable of forming a crack free hardbanding weld overlay, the methods comprising the step determining an amorphous forming epicenter composition, determining a variant composition having a predetermined change in constituent elements from the amorphous forming epicenter composition, and forming and analyzing an alloy having the variant composition.

Abstract: Disclosed herein are iron-based alloys having a microstructure comprising a fine-grained ferritic matrix and having a 60+ Rockwell C surface, wherein the ferritic matrix comprises <10 ?m Nb and W carbide precipitates. Also disclosed are methods of welding comprising forming a crack free hardbanding weld overlay coating with such an iron-based alloy. Also disclosed are methods of designing an alloy capable of forming a crack free hardbanding weld overlay, the methods comprising the steps of determining an amorphous forming epicenter composition, determining a variant composition having a predetermined change in constituent elements from the amorphous forming epicenter composition, and forming and analyzing an alloy having the variant composition.

Abstract: A method of reducing whisker growths includes identifying a solder connection to be treated. The solder connection may contain one or more whisker growths. A heat source is applied at a defined temperature to the solder connection for a defined period of time sufficient to melt at least a portion of the one or more whisker growths. The heat source is removed from the solder connection prior to the melting of the solder connection.

Abstract: An amorphous, ductile brazing foil is produced with a composition of FeaNibCrcSidBeMofPg with 25?a?50 atomic %; 30?b?45 atomic %; 5<c?15 atomic %; 4?d?15 atomic %; 4?e?15 atomic %; 0?f?5 atomic %; 0?g?6 atomic %; and any impurities, wherein 10?d+e+g?28 atomic % with a+b+c+d+e+f+g=100. Excellent brazing joints can be produced with these brazing foils.

Abstract: The invention discloses a novel method to prepare the Ni(Sn, Sb)3 skutterudite compound. Skutterudite compounds are thermoelectric materials, which can transform heat into electric energy. Besides, the Ni(Sn, Sb)3 compound is also an anode material of Li ion battery. The solid state diffusion method is used to prepare the Ni(Sn1-x, Sbx)3 compound. Compared to traditional physical or chemical processes, the method disclosed in the invention is simpler and operates at a lower temperature. By the method according to the invention, the composition of the Ni(Sn, Sb)3 compound can be adjusted to fulfill variety requirements for different applications. It is noteworthy that the invention can prepare ternary compounds. In comparison with the frequently used binary compounds such as Ni3Sn4 or Cu6Sn5, the invention can produce materials with better performance.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: A composite knife blade includes a cutting-edge piece of a first alloy, a back piece of a second alloy different from the first alloy, the cutting-edge piece and the back piece are brazed together at a serpentine joint. The cutting-edge piece has a high Rockwell hardness value, as compared to a hardness of the back piece. A method of manufacture of the knife blade includes fine blanking the back piece of from a sheet of the second alloy, laser cutting the cutting-edge piece from a sheet of the first alloy, and brazing the first piece to the second piece to form a composite blade. The composite blade is then cooled from the brazing temperature to an austenizing temperature of the cutting-edge piece, and quenched, to harden the cutting-edge piece.

Abstract: Manufacturing a plate heat exchanger calls for punching plates, each of which having at least one projection in the form of a hollow truncated cone, cleaning surfaces of the plates, composing a plate assembly by mounting the projection of one plate into opening of an adjacent plate. A predetermined gap between adjacent surfaces of the plates is maintained, a channel for passing a heat carrier is formed. A soldering paste solution based on copper hydrocarbonate and nickel salts is prepared, into which the plate assembly is immersed, the applied solution is dried. The plate assembly is placed into a high-temperature through-type conveyor furnace with a protective medium containing free hydrogen. Two temperature zones are provided along the way of movement of the plate assembly. The plate assembly is annealed in the first temperature zone and then soldered and covered with the copper-based alloy in the second temperature zone.

Abstract: The present invention is directed to a process for repairing cracks in a turbine engine component. The process comprises the steps of providing a component, preferably formed from a single crystal nickel based material, with at least one crack, applying a repair alloy composition containing a single crystal nickel based alloy, a first nickel based braze alloy and a second nickel based braze alloy to the crack(s), and subjecting the component with the applied repair alloy composition to a thermal cycle to diffuse the repair alloy composition into the crack(s).

Abstract: A method of providing boiler tubes with a variably ribbed interior surface. A suitably dimensioned spindle with a channel having a desired pattern on the exterior surface of the spindle is wrapped by a wire-like member in the channel so as to form thereon a reverse image of the desired, patterned tube ribbing. A brazing metal paste is applied on the exterior surface of the wire-like member and the spindle is inserted into a tube to be ribbed. The wire-like member is released from the spindle to allow the wire-like member to conform to the inner surface of the tube, and the tube is heated to the melting temperature of the brazing metal paste so that the wire-like member bonds to the inner surface of the tube, and the metal tube is then cooled.

Abstract: One embodiment of the present invention is a unique method for brazing an assembly. Another embodiment is a unique method of heat treating an object. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for heat treating and/or brazing. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.

Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract: A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 4.7 and 10.9 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract: A method of assembling aluminum alloy products, such as sheets, strips or tubes, by means of fluxless brazing, where the absence of flux is made possible by using a prior treatment resulting in formation of a conversion layer on the surface of the products. The treatment involves using a solution containing K+ and F? ions and at least one acid in a quantity such that the pH of the solution is less than 3. The inventive method enables effective flux was brazing in industrial conditions, such as a for the production of heat exchangers used in motor vehicles.

Abstract: A method of producing or repairing single-crystalline turbine or engine components by the following steps: heating of braze filler metal to a temperature which is greater than or equal to the melting temperature of the braze filler metal; introducing the molten mass of the braze filler metal produced through the heating process into a crack formed in the turbine or engine component, or into the gap formed between two turbine or engine components, or into a damaged area of a turbine or engine component; and non-isothermal control or regulation of the temperature of the braze filler metal or turbine or engine component during an epitaxic solidification process of the braze filler metal.

Abstract: Methods are provided for repairing an engine component. In an embodiment, a method includes forming at least one layer of a first braze alloy mixture including about 40% by weight of a first base alloy material and about 60% by weight of a first braze alloy material, over a structural feature of the component. The first braze alloy material includes chromium, cobalt, tungsten, tantalum, aluminum, hafnium, carbon, boron, and a balance of nickel. A second braze alloy mixture is disposed over the at least one layer of the first braze alloy mixture, the second braze alloy mixture including between about 50% and about 60% by weight of a second base alloy material, and between about 40% and about 50% by weight of a second braze alloy material. The component is then subjected to heat treatment, and may be further subjected to machining, coating and final inspection.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.