Noble Metals (i.e., Silver(ag), Gold(au), Osmium(os), Iridium(ir), Platinum(pt), Ruthenium(ru), Rhodium(rh), Palladium(pd)) Or Alloy Base Thereof Patents (Class 148/678)
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Publication number: 20040033352Abstract: The present invention relates to a method for preparing oriented anisotropic particles comprising the steps of providing at least one anisotropic particle, dispersing the one anisotropic particle(s) in a medium, and freeze drying the dispersion of anisotropic particle(s) and the medium. In another embodiment, the present invention relates to an oriented anisotropic material comprising at least one anisotropic particle dispersed in a medium and thereafter freeze dried. Another embodiment relates to an article comprising an oriented anisotropic material and at least one matrix, wherein the oriented anisotropic material comprises a freeze dried anisotropic material.Type: ApplicationFiled: August 15, 2002Publication date: February 19, 2004Applicant: Eastman Kodak CompanyInventors: Dennis J. Massa, Thomas N. Blanton, Debasis Majumdar
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Patent number: 6663728Abstract: A gold-free platinum material that is dispersion-strengthened by small, finely dispersed particles of base metal oxide. The base metal is either 0.01-0.5 wt. % Sc or a mixture/alloy of Sc and at least one metal from the group consisting of Zr, Y, and Ce with a total base metal content of 0.05-0.5 wt. %.Type: GrantFiled: September 4, 2001Date of Patent: December 16, 2003Assignee: W.C. Heraeus GmbH & Co. KGInventors: Harald Manhardt, David Francis Lupton, Wulf Kock
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Publication number: 20030164214Abstract: The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subjected to heat treatment for five minutes to ten hours at 200° C. to 270° C., and subsequently the foil-form soldering metal is slit. Thus, the heat treatment of the Au—Sn soldering metal before slitting enables continuous slitting of the Au—Sn foil-form soldering metal in room temperature and facilitates the production of a ribbon-form soldering metal.Type: ApplicationFiled: December 13, 2002Publication date: September 4, 2003Inventor: Ken-ichi Miyazaki
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Patent number: 6562158Abstract: A method of making jewelry comprising formulating a platinum alloy of at least 95 weight percent platinum, 1 to 5 weight gallium and palladium in an amount of less than about 3 weight percent, heat treating this alloy to increase the Vickers hardness by at least 20% but to not greater than a Vickers hardness of 350.Type: GrantFiled: September 10, 2001Date of Patent: May 13, 2003Inventor: Steven Kretchmer
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Patent number: 6531039Abstract: An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average grain size of less than 100 &mgr;m.Type: GrantFiled: February 21, 2001Date of Patent: March 11, 2003Assignee: Nikko Materials USA, Inc.Inventor: Stephen J. Kohut
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Publication number: 20020129879Abstract: A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The film is heated in a temperature range of 70-100° C. for at least five minutes, wherein the fine-grained microstructure is converted into a stable large-grained microstructure. In another embodiment, the plated film is stored, after the step of depositing, at a temperature not greater than −20° C., wherein the fine-grained microstructure is stabilized without grain growth for the entire storage period.Type: ApplicationFiled: January 16, 2002Publication date: September 19, 2002Inventors: Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto, S. Kathleen Reese
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Patent number: 6413649Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.Type: GrantFiled: March 6, 1998Date of Patent: July 2, 2002Assignee: The Morgan Crucible Company plcInventors: David J. Kepniss, Toshimasa Oyama
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Patent number: 6406561Abstract: A “one-step” method of forming diffused noble metal-aluminide coatings with or without minor incorporations of Si, Cr, Mn, Hf, La, and Y, is disclosed. With the inventive method, two or more powdered metals or metal alloys are applied and diffused into the metal substrate together, using a sequential multi-stage heating process. This method contrasts with the prior art technology where metals were applied and diffused into the substrate separately.Type: GrantFiled: July 16, 1999Date of Patent: June 18, 2002Assignee: Rolls-Royce CorporationInventors: George E. Creech, Subhash K. Naik, Paul S. Korinko
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Patent number: 6372363Abstract: Novel heat treatment techniques for improving and optimizing the hydrogen permeability of thin palladium-copper alloy foil membranes and, in particular, Pd/40%Cu alloy membranes.Type: GrantFiled: April 24, 2000Date of Patent: April 16, 2002Assignee: Walter Juda Associates, Inc.Inventor: Charles Krueger
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Patent number: 6277218Abstract: A probe card treatment method, which is applicable on a probe card comprising multiple probe needles, is described. A thermal treatment is conducted on the probe card by placing the probe card in a closed heating device, wherein the temperature of the thermal treatment is enough to restore the elasticity and the planarity of the probe needles without softening the probe card. The probe card and the probe needles thereon are then rapidly cooled by cool air such that the elasticity of the probe needles is retained and the lifetime of the probe needles is extended.Type: GrantFiled: October 13, 1999Date of Patent: August 21, 2001Assignees: Promos Technologies Inc., Mosel Vitelic Inc., Siemens AktiengesellschaftInventors: Chin-Fa Tai, Cindy Chen, Kelly Liao
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Publication number: 20010008157Abstract: A device having electrical contacts formed from an alloy having improved wear resistance is provided, the alloy being particularly useful in microrelay devices formed by MEMS technology. In one embodiment, the alloys are chosen to allow sufficient precipitation hardening to improve wear resistance, but keep precipitation below a level that would unacceptably reduce electrical conductivity. This is achieved by using alloying materials that have very limited or no solid solubility in the noble metal matrix, e.g., less than 4 wt. % solid solubility. In a second embodiment, an alloy contains a noble metal matrix and insoluble, dispersoid particles having no solubility in the matrix, these dispersoid particles offering a similar strengthening mechanism.Type: ApplicationFiled: December 6, 2000Publication date: July 19, 2001Inventors: David John Bishop, Sungho Jin, Jungsang Kim, Ainissa G. Ramirez, Robert Bruce Van Dover
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Publication number: 20010004048Abstract: A method for manufacturing a metal composite strip for the production of electrical contact components. A film made of tin or a tin alloy is first applied onto an initial material made of an electrically conductive base material. A film of silver is then deposited thereonto. Copper or a copper alloy is preferably used as the base material. The tin film can be applied in the molten state, and the silver film by electroplating. Furthermore, both the tin film and the silver film can be deposited by electroplating. A further alternative provides for manufacturing the tin film in the molten state and the silver film by cathodic sputtering. The diffusion operations which occur in the coating result in a homogeneous film of a tin-silver alloy. This formation can be assisted by way of a heat treatment of the composite strip.Type: ApplicationFiled: January 30, 2001Publication date: June 21, 2001Inventors: Udo Adler, Klaus Schleicher
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Patent number: 6248190Abstract: A body compatible stent is formed of multiple filaments arranged in two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core (24) and a case (26) surrounding the core (24). The core is formed of a radiopaque and relatively ductile material, in particular gold or a gold alloy. The outer case (26) is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case (26), while the core (24) enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core (24) is inserted into a tubular case (26) of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold-working steps.Type: GrantFiled: June 15, 1999Date of Patent: June 19, 2001Assignee: SciMed Life Systems, Inc.Inventor: Jonathan S. Stinson
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Patent number: 6242106Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.Type: GrantFiled: May 5, 1999Date of Patent: June 5, 2001Assignee: W. C. Hereaeus GmbH & Co. KGInventors: Günter Herklotz, Lutz Schräpler, Christoph Simons, Jürgen Reuel, Y. C. Cho
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Patent number: 6187119Abstract: A process for the production of an alloy based on gold, the titer of gold being between 8 and 22 karats, comprises three phases. In the first phase, copper and titanium are subjected to fusion forming a first fused product. In the second phase, the metallic product obtained in the first phase is fused with the other components of the alloy, including silver and zinc, except gold, and in the third phase, the metallic product obtained in the second phase is fused with gold. The alloy is free of nickel and cobalt and may contain other elements in small amounts such as silicon, boron, indium, iridium and ruthenium. The amount of titanium at the most is 1%.Type: GrantFiled: June 9, 1998Date of Patent: February 13, 2001Assignee: Silmar S.p.A.Inventor: Silverio Cerato
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Patent number: 6176945Abstract: Disclosed herein is a method of coating a substrate with a zinc dialkyldithiophosphate (ZDDP) material, comprising the steps of selecting a substrate which is reactive with said ZDDP material; providing an atmosphere containing said ZDDP material at a predetermined concentration; exposing said substrate to said atmosphere for a sufficient period of time and at a sufficient temperature, so as to cause said ZDDP material to form a layered substrate having a layer of a ZDDP derivative material thereon; and annealing said layered substrate.Type: GrantFiled: April 1, 1999Date of Patent: January 23, 2001Assignee: University of Western OntarioInventors: G. Michael Bancroft, Masoud Kasrai, Arthur Bzowski, Marina Suominen Fuller, Kathy De Jong
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Patent number: 6129997Abstract: A method is provided for manufacturing a welded shaped body of platinum material dispersion-hardened by finely divided small particles of base metal oxide, especially such a body provided with at least one inside wall, such as a tube. The base metal oxide is one or more oxides of the elements yttrium, zirconium and cerium. The method includes shaping and welding of at least one part, especially a sheet, of an alloy of platinum and base metal, to a preform body, e.g. a tube. The preform body is then subjected to heat treatment in an oxidizing medium until the minimum degree of oxidation of the base metal reaches 75 wt %. The preform body is then formed into the desired product.Type: GrantFiled: March 10, 1999Date of Patent: October 10, 2000Assignee: W. C. Heraeus GmbH & Co. KGInventors: Franz Braun, Wulf Kock, David Francis Lupton
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Patent number: 6103028Abstract: A new method of creating thin free-standing pin hole-free hydrogen-selective palladium-bearing membranes that comprises thinning cold-rolled membranes by chemical etching or electrochemically electrolyzing of at least one membrane surface, and novel membranes produced thereby and including membranes with selected portions only thereof so thinned.Type: GrantFiled: February 18, 1999Date of Patent: August 15, 2000Assignee: Walter Juda Associates, Inc.Inventors: Walter Juda, Charles W. Krueger, R. Todd Bombard
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Patent number: 6077366Abstract: A process for producing a hard high purity gold alloy comprising (a) casting a high purity gold alloy consisting essentially of from 50 to 3000 ppm Gd and balance being gold, the gold having a purity of at least 99.7%, (b) solution treating the alloy at a temperature above 700.degree. C., and (c) aging the alloy at a temperature of 150 to 350.degree. C.Type: GrantFiled: October 6, 1997Date of Patent: June 20, 2000Inventor: Kazuo Ogasa
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Patent number: 6063213Abstract: A method of manufacturing a high-purity gold alloy for making an electronic member, a dental member or a decorative member. The method includes subjecting a high-purity gold alloy having a Gd content of 1 to 49.9 ppm contained in 99.98 weight % or more gold to a solution heat treatment in which the elements of the high-purity gold alloy are uniformly dispersed at a temperature higher than a solubility curve and then rapidly cooled, and then to an age hardening treatment, before or after a working process for working the high-purity gold alloy into a desired line shape or other desired shape. The age hardening treatment can be performed if the working process is not carried out.Type: GrantFiled: December 8, 1998Date of Patent: May 16, 2000Inventor: Kazuo Ogasa
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Patent number: 6045635Abstract: A high-purity hard gold alloy containing 50 ppm or more of Gd and one or more of other additional elements in Au having a purity of 99.7% by weight or more, such that a total content of the additional elements is 100 to 3000 ppm. The high-purity gold alloy can be hardened to a level approximately equivalent to that of 18-karat gold at a relatively low working ratio, and the high-purity gold alloy thus hardened is not extremely softened by a heat treatment performed as a post-treatment, such as brazing or welding.Type: GrantFiled: January 25, 1999Date of Patent: April 4, 2000Inventor: Kazuo Ogasa
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Patent number: 6036741Abstract: A process comprises forming ruthenium tetroxide by blowing ozone-containing gas into crude ruthenium powder while hypochlorous acid is being added to the powder, allowing a hydrochloric acid solution to absorb the ruthenium tetroxide, evaporating the solution to dryness, and roasting the RuOCl.sub.3 crystals thus obtained in a hydrogen atmosphere. Thus a high-purity ruthenium material for thin film deposition, typically sputtering targey, is obtained which contains less than 1 ppm each of alkali metal elements, less than 1 ppm each of alkaline earth metal elements, less than 1 ppm each of transition metal elements, less than 10 ppb each of radioactive elements, a total of less than 500 ppm of carbon and gaseous ingredient elements, the material having a purity of ruthenium of at least 99.995% excluding the gaseous ingredient elements.Type: GrantFiled: July 16, 1998Date of Patent: March 14, 2000Assignee: Japan Energy CorporationInventors: Yuichiro Shindo, Tsuneo Suzuki
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Patent number: 6024807Abstract: The present invention aims at improving the catalytic activity of the metallic platinum deposited on the substrate of the counterelectrode (i.e., the cathode), so as to obtain a high value of the catalytic activity on the reduction reaction of triiodide to iodide essentially independent of the nature of the solvent used in the electrolyte. To that effect, the manufacturing process according to the invention is characterized in that said metallic platinum is deposited in the form of a plurality of spheroidal microcrystallite clusters each having a size of less than about 100 nanometers, dispersed over the surface of said substrate, and in that said deposited metallic platinum is submitted to a thermal treatment, carried out at a temperature in the range of about 375.degree. to 400 C., so as to enhance the catalytic properties of the platinum on the oxido-reduction of iodine and triiodide 3I.sub.2 +2e.fwdarw.2I.sub.3 in the redox system iodine/iodide.Type: GrantFiled: March 24, 1998Date of Patent: February 15, 2000Assignee: Ecole Polutechnique Federale de LausanneInventors: Nicholas Pappas, Michael Gratzel
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Patent number: 5961753Abstract: A method for increasing the toughness of a platinum-based binary alloy system through heat treatment. An additional embodiment concerns a method whereby the material is first annealed and then heated appropriately to achieve an increase in tensile strength without a decrease in ductility. By selecting a binary composition within its defined miscibility gap and heat treating it for a prolonged period of time at a temperature that is within the miscibility gap but below the recrystallization temperature, an increased tensile strength and ductility is obtained with respect to the initial conditions of the composition. An exemplary embodiment concerns platinum-iridium alloys, particularly those compositions where iridium is present at either 20% or 25%. One particular application of this method concerns the manufacuture of corkscrew fixation devices used in the biomedical industry.Type: GrantFiled: January 28, 1998Date of Patent: October 5, 1999Assignee: Johnson Matthey Inc.Inventor: Edwin Alfred Crombie, III
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Patent number: 5846352Abstract: A platinum alloy containing 1 to 9 percent gallium and minor amounts of property enhancing additives, eg. up to 3% Pd. This alloy can be heat-treated to a Vickers hardness that is increased by at least over 25% beyond its initial, untreated value and typically to at least over 300 HV. The heat-treatment process includes the steps of solution-treating the alloy, followed by quenching and a hardening heat-treatment to achieve the desired hardness and strength. The alloy is useful as a component of jewelry, art objects or related articles.Type: GrantFiled: November 22, 1996Date of Patent: December 8, 1998Inventor: Steven Kretchmer
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Patent number: 5837068Abstract: A bulk magnetoresistance effect material of a composition represented by the general formula: T.sub.100-A M.sub.A (wherein T is at least one element selected between Cu and Au; M is at least one element selected from the group consisting of Co, Fe, and Ni; and A is in the range: 1.ltoreq.A.ltoreq.50 by atomic percent) is prepared by casting a molten mixture of the above composition, and subjecting the resulting casting to homogenization and further to heat treatment. The bulk magnetoresistance effect material is high in the rate of change in the electrical resistance thereof, i.e., shows a large magnetoresistive effect and can be obtained in such bulk form in arbitrary shapes adaptable for various uses. Using the material, various types of magnetoresistive elements are obtained.Type: GrantFiled: January 6, 1997Date of Patent: November 17, 1998Assignee: Kazuaki Fukamichi and YKK CorporationInventors: Kazuaki Fukamichi, Noriyuki Kataoka, Yutaka Shimada, Hideki Takeda
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Patent number: 5635131Abstract: A ring setting is made from a nickel-free palladium white gold alloy that contains 7-12% by weight palladium; 50-65% by weight gold; 25-32% by weight silver; and 1-5% by weight zinc. Such ring settings are resistant to chemical or stress corrosion cracking.Type: GrantFiled: May 27, 1994Date of Patent: June 3, 1997Assignee: Hoover & Strong, Inc.Inventors: Frederick W. Klotz, Torrance D. Hoover
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Patent number: 5578177Abstract: Methods of manufacturing fully annealed metal anodes are disclosed. The methods contemplate supplying metal and heating the metal until it has obtained a molten state. The molten metal is permitted to flow into a die and transported therethrough where it is cooled until it solidifies. The flow rate of the metal through the die and the extent of cooling are selected such that a fully annealed metal anode is obtained.Type: GrantFiled: October 23, 1995Date of Patent: November 26, 1996Assignee: RFE Industries, Inc.Inventor: Gary A. Wolf
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Patent number: 5503691Abstract: A method of enhancing the appearance of a polished surface of an artifact is provided in which the artifact is formed from a non-ferrous alloy, in particular, but not exclusively, a precious metal alloy, chosen to exhibit a martensitic and a parent phase structure. The surface, or relevant part thereof, is polished in one of the phases, usually the parent phase, followed by heat treatment to effect a phase transformation, generally to the martensitic phase. This phase change causes a visible surface effect to the polished surface which may be described as a spangle effect.Type: GrantFiled: December 1, 1994Date of Patent: April 2, 1996Assignee: MintekInventors: Ira M. Wolff, Michael B. Cortie
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Patent number: 5422065Abstract: The contact material in particular for contacts in low-voltage switches consists of silver and further active components. In accordance with the invention, iron (Fe) in proportions of between 1 and 50% by weight and rhenium (Re) in proportions of between 0.01 and 5% by weight are present in combination as active components. The manufacture of the material and the fabricating of the contacts can be effected by methods of powder metallurgy with inclusion of molding or extrusion techniques, the active components being used in the form of separate powders, as fusible alloy or as mechanically alloyed powder.Type: GrantFiled: November 23, 1993Date of Patent: June 6, 1995Assignee: Siemens AktiengesellschaftInventors: Franz Hauner, Wolfgang Haufe
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Patent number: 5358585Abstract: A silver-metal oxide composite material comprising a silver matrix or silver-copper alloy matrix containing 50% by weight or less of copper, (a) from 0.5 to 25% by weight, in terms of elemental metal, of an oxide of at least one element selected from the group consisting of Mg, Al, Zr, Ca, Ce, Be, Th, Sr, Ti, Cr, Hf and Si, and, optionally, (b) from 0.01 to 5% by weight, in terms of elemental metal, of an oxide of at least one element selected from the group consisting of Bi, Pb, Cd, Zn, Sn, Sb, Mn and iron family metals; the oxide of the (a) element and, where present, the oxide of the (b) element being dispersed in the form of fine particles with a particle size of not more than about 0.1 .mu.m uniformly throughout the matrix from the surface to the core thereof; and process of producing the composite material using oxidation under the conditions in which a liquid phase and a solid phase coexist.Type: GrantFiled: March 25, 1993Date of Patent: October 25, 1994Assignees: Akira Shibata, Sumitomo Metal Mining Co., LtdInventor: Akira Shibata
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Patent number: 5338378Abstract: A dental gold alloy which is soft enough for adjustment of a patient's occlusal condition, which is age-hardenable with passage of time at temperatures encountered within a patient's oral cavity, and which has a single phase structure which imparts improved corrosion resistance, the dental gold alloy consisting essentially of 82-67% by a weight of gold; 18-33% by weight of copper; and 2-8 at % of an age-hardening accelerator which is at least one metal selected from the group consisting of gallium, aluminum and zinc, wherein the dental gold alloy has been subjected to a solution treatment by heating at 670-700.degree. C. and quenching into water.Type: GrantFiled: April 23, 1993Date of Patent: August 16, 1994Assignee: Kyushu UniversityInventors: Michio Ohta, Shigeki Matsuya, Takanobu Shiraishi, Masaharu Nakagawa
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Patent number: 5282946Abstract: A sputtering target of platinum-cobalt alloy is disclosed which contains 10 to 55% by weight of platinum; 1 to 15% by weight of a first additional element selected from the group consisting of nickel and tantalum; no more than 1.5% by weight of a second additional element selected from the group consisting of boron, titanium, lanthanum, cerium, neodymium, beryllium, calcium, zirconium, and silicon; no more than 20% by weight of chromium; and balance cobalt. A method for manufacturing the sputtering target is also disclosed. In the method, a platinum-cobalt alloy containing specific ingredients in predetermined amounts is first prepared. Then, the platinum-cobalt alloy is subjected to hot plastic working with a thickness reduction of no less than 30%. Subsequently, the alloy thus hot worked is subjected to a cold plastic working with a thickness reduction of no less than 5% at a temperature less than the recrystallization temperature of the alloy.Type: GrantFiled: June 25, 1992Date of Patent: February 1, 1994Assignee: Mitsubishi Materials CorporationInventors: Makoto Kinoshita, Jun Tamura, Masaki Morikawa, Kunio Kishida, Toshinori Ishii, Akifumi Mishima
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Patent number: 5188679Abstract: A precious metal alloy compression-spring gemstone mounting is made by casting or working a quantity of alloy to form a gemstone mounting in a desired configuration, followed by annealing and heat-treating the mounting to increase its yield strength. A stone is then placed in the mounting and is retained therein by compressive spring force.Type: GrantFiled: January 15, 1992Date of Patent: February 23, 1993Inventor: Steven D. Kretchmer
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Patent number: 5173132Abstract: This invention concerns a new spring gold alloy and heat treatment process specific to the new gold spring alloy. The heat treatment process and gold spring alloy are specifically formulated to work synergistically so as to optimize the ductility of the alloy after a first step, and resistance to deformation of the alloy after a second step of the heat treatment process.Type: GrantFiled: April 1, 1991Date of Patent: December 22, 1992Assignee: Handy & HarmanInventor: Louis P. Solomon