With Ageing, Solution Treating (i.e., For Hardening), Precipitation Hardening Or Strengthening Patents (Class 148/683)
  • Patent number: 11162183
    Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent physical properties at a low temperature, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery shows little change in the physical properties, such as tensile strength and elongation, of a copper foil even at a low temperature and thereby exhibits excellent cycle properties at the low temperature. The electrolytic copper foil for a secondary battery is produced from a plating solution, containing total organic carbon (TOC), cobalt, iron and zinc, by using a drum and coated with a negative electrode active material, wherein the ratio between the TOC, cobalt, iron and zinc contained in the electrolytic copper foil follows the following formula 1: TOC/(cobalt+iron+zinc)=1.0-1.2.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 2, 2021
    Assignee: ILJIN MATERIALS CO., LTD.
    Inventors: Sun Hyoung Lee, Tae Jin Jo, Seul-Ki Park, Ki Deok Song
  • Patent number: 8641838
    Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: February 4, 2014
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hiroshi Kaneko, Kiyoshige Hirose, Koji Sato
  • Publication number: 20130319584
    Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
    Type: Application
    Filed: February 10, 2012
    Publication date: December 5, 2013
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Yoshio Abe, Naotake Hirano
  • Patent number: 8361255
    Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: January 29, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hiroaki Takano, Yoshiki Yamamoto, Koichi Kotoku, Chingping Tong
  • Patent number: 8211249
    Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: July 3, 2012
    Assignees: NGK Insulators, Ltd., Osaka University
    Inventors: Tetsuo Sakai, Naokuni Muramatsu, Koki Chiba, Naoki Yamagami
  • Patent number: 7628872
    Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.
    Type: Grant
    Filed: June 11, 2004
    Date of Patent: December 8, 2009
    Assignee: Ningbo Powerway Alloy Material Co., Ltd.
    Inventors: Ming Zhang, Siqi Zhang, Jihua Cai, Haorong Lou, Xiao Xie
  • Publication number: 20090257909
    Abstract: A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 ?m to 2 ?m, the intermetallic compound B has a compound diameter of 0.05 ?m to less than 0.3 ?m, and the intermetallic compound C has a compound diameter of more than 0.001 ?m to less than 0.05 ?m.
    Type: Application
    Filed: September 12, 2007
    Publication date: October 15, 2009
    Inventors: Kuniteru Mihara, Tatsuhiko Eguchi
  • Patent number: 7544259
    Abstract: An element such as Cr is caused to dissolve sufficiently in a base-material metal (Cu) in a solid solution state at a high temperature and a material in a supersaturated condition is obtained by performing quenching. After that, a strain is applied to this material and this material is subjected to aging treatment at a low temperature simultaneously with or after the application of this strain. As a result of this, it is possible to obtain a copper alloy having properties desirable as an electrode material, for example, a hardness of not less than 30 HRB, an electrical conductivity of not less than 85 IACS %, and a thermal conductivity of not less than 350 W/(m·K).
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: June 9, 2009
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Mitsuhiro Funaki, Hiroki Baba, Shinya Ohyama, Toshiyuki Horimukai
  • Patent number: 7485200
    Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: February 3, 2009
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Masahiko Ishida, Junichi Kumagai, Takeshi Suzuki
  • Patent number: 6679956
    Abstract: A process for making a copper base alloy comprises the steps of casting a copper base alloy containing tin, zinc, iron and phosphorous and forming phosphide particles uniformly distributed throughout the matrix. The forming step comprises homogenizing the alloy at least once for at least one hour at a temperature from 1000 to 1450° F., rolling to final gauge including at least one process anneal for at least one hour at 650 to 1200° F. followed by slow cooling, and stress relief annealing at final gauge for at lest one hour at 300 to 600° F.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: January 20, 2004
    Assignee: Waterbury Rolling Mills, Inc.
    Inventor: Ashok K. Bhargava
  • Publication number: 20020090315
    Abstract: Spinodal decomposition of Cu alloy, which contains from 0.5 to less than 5.0% of Ti, is suppressed and a low hardness dispersion of Hv 40 or less is obtained over a sheet surface. In addition, an isotropy in terms of tensile strength in the vertical direction over the sheet surface is improved such that it is 50N/mm2 or less. In the hot-rolling of the alloy, it is cooled at a cooling speed of not less than 200K (200° C.)/second at least in a temperature range of between 773K (500° C.) and 573K (300° C.).
    Type: Application
    Filed: October 26, 2001
    Publication date: July 11, 2002
    Inventor: Michiharu Yamamoto
  • Patent number: 6190468
    Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900° to 1500° F., (ii) warm worked at greater than about 30% strain at a strain rate {acute over (&egr;)} greater than or equal to about (2.210×107)/exp[(2.873×104)/(T+459.4°)], where T is in ° F., at the temperature, (iii) annealed at a temperature between 1375° and 1500° F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480° and 660° F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: February 20, 2001
    Assignee: Brush Wellman, Inc.
    Inventor: Edward B. Longenberger
  • Patent number: 6136104
    Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: October 24, 2000
    Assignee: Kobe Steel, Ltd.
    Inventors: Motohisa Miyafuji, Hirofumi Arai, Koya Nomura
  • Patent number: 5798008
    Abstract: A method for producing copper alloy materials for molds for continuous steel casting and molds as produced by the method. The molds are highly resistant to thermal fatigue and are hardly cracked. To produce the materials, cast ingots of a copper-based chromium-zirconium alloy comprising from 0.2 to 1.5% by weight of Cr and from 0.02 to 0.2% by weight of Zr are heated at between 900.degree. C. and 1000.degree. C. for 30 minutes or longer and then rolled, while hot, at a reduction ratio of 60% or more to be at 850.degree. C. or higher at which the hot rolling is finished , and immediately after the hot rolling, these are rapidly cooled to 400.degree. C. or lower at a cooling rate of 10.degree.C./sec or more, and then aged at between 400.degree. C. and 520.degree. C. for from 1 hour to 5 hours.
    Type: Grant
    Filed: July 15, 1996
    Date of Patent: August 25, 1998
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keishi Nogami, Masato Koide, Takashi Morimoto, Yutaka Koshiba
  • Patent number: 5653826
    Abstract: A high strength steel composition comprising ferrite and martensite/banite phases, the ferrite phase having primarily vanadium and mobium carbide or carbonitride precipitates, is prepared by a first rolling above the austenite recrystallization temperature; a second rolling below the anstenite recrystallization temperature; a third rolling between the Ar.sub.3 and Ar.sub.1 transformation points, and water cooling to below about 400.degree. C.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 5, 1997
    Assignee: Exxon Research and Engineering Company
    Inventors: Jayoung Koo, Michael John Luton
  • Patent number: 5651844
    Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900.degree. to 1500.degree. F., (ii) warm worked at greater than about 30% strain at a strain rate greater than or equal to about (2.210.times.10.sup.7)/exp[(2.873.times.10.sup.4)/(T+459.4.degree.)], where T is in .degree. F., at the temperature, (iii) annealed at a temperature between 1375.degree. and 1500.degree. F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480.degree. and 660.degree. F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.
    Type: Grant
    Filed: August 7, 1996
    Date of Patent: July 29, 1997
    Assignee: Brush Wellman Inc.
    Inventor: Edward B. Longenberger
  • Patent number: 5445687
    Abstract: A hot working material of corrosion resistant copper-based alloy having a metal composition of 61.0 weight percent to less than 63.0 weight percent copper, 1.0 weight percent to 3.5 weight percent lead, 0.7 weight percent to 1.2 weight percent tin, 0.2 weight percent to 0.7 weight percent nickel, 0.03 weight percent to 0.4 weight percent iron, 0.02 weight percent to 0.10 weight percent antimony, and 0.04 weight percent to 0.15 weight percent phosphorus, with the balance composed of zinc and inevitable accompanying impurities. The alloy is subjected to hot working and subsequent heat treatment at 500.degree. C. to 600.degree. C. for 30 minutes to 3 hours and sufficient that the alloy has an .alpha. single-phase structure and addition elements are dispersed uniformly in the entire structure.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: August 29, 1995
    Assignees: Toyo Valve Co., Ltd., Sanbo Shindo Kogyo Co., Ltd.
    Inventors: Tosuke Sukegawa, Yoshihito Shimoda, Hisashi Tan, Takahiro Tsuji, Keiichiro Oishi
  • Patent number: 5322575
    Abstract: A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and annealing, in which process an ingot is prepared by melting and casting an alloy containing 1.0-3.0 wt % Ni, 0.02-0.15 wt % P. 0.5-2.0 wt. % Sn and, as an optional component, 0.01-2.0 wt % Zn, with the balance being Cu and incidental impurities, and with the ratio of weight percentages of Ni to P being within the range of 10-50%.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: June 21, 1994
    Assignees: Dowa Mining Co., Ltd., Yazaki Corporation, Nihon Bell Parts Co., Ltd.
    Inventors: Takayoshi Endo, Kenji Takenouchi, Mikio Nishihata, Toshio Asano, Akira Sugawara