Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.

Abstract: The invention relates to a copper alloy, composed of (in wt %): 51.8 to 84.0% Cu, 15.5 to 36.0% Zn, 0.35 to 3.0% Sn, 0.12 to 1.5% Fe, 0.02 to 1.0% P, optionally also 0.1 to 2.0% Al, optionally also 0.05 to 0.7% Si, optionally also 0.05 to 2.0% Ni, optionally also respectively 0.1 to 1.0% Mn, Co, optionally also respectively 0.01 to 1.0% As, Sb, and unavoidable contaminants, wherein more than 95% of the structure consist of ?-mixed crystal, in which at least iron phosphides and/or iron are embedded as deposition particles, which can be used for metallic articles in breeding organisms living in seawater.

Abstract: A copper alloy subjected to a thermo-mechanical treatment and composed of (in wt %) 15.5 to 36.0% Zn, 0.3 to 3.0% Sn, 0.1 to 1.5% Fe, optionally 0.001 to 0.4% P, optionally 0.01 to 0.1% Al, optionally 0.01 to 0.03% Ag, Mg, Zr, In, Co, Cr, Ti, Mn, optionally 0.05 to 0.5% Ni, the remainder being copper and unavoidable contaminants, wherein the microstructure of the alloy is characterized in that the proportions of the main texture orientations are at least 10 vl % copper orientation, at least 10 vl % S/R orientation, at least 5 vl % brass orientation, at least 2 vl % Goss orientation, at least 2 vl % 22RD-cube orientation, at least 0.5 vl % cube orientation, and finely distributed iron-containing particles are contained in the alloy matrix.

Abstract: A copper alloy trolley wire includes: 0.12 mass % to 0.40 mass % of Co; 0.040 mass % to 0.16 mass % of P; 0.005 mass % to 0.70 mass % of Sn; and the balance including Cu and unavoidable impurities, wherein precipitates have an average grain size of equal to or greater than 10 nm, and the number of precipitates having a grain size of equal to or greater than 5 nm is 90% or greater of the total number of observed precipitates, and a heat resistance HR defined by HR=TS1/TS0×100 in which TS0 is an initial tensile strength and TS1 is a tensile strength after holding the copper alloy trolley wire at 400° C. for 2 hours, is equal to or greater than 90%.

Abstract: A copper alloy wire of the present invention consists of a precipitation strengthening type copper alloy containing Co, P, and Sn, wherein an average grain size of precipitates observed through cross-sectional structure observation immediately after performing an aging heat treatment is equal to or greater than 15 nm and a number of precipitates having grain sizes of equal to or greater than 5 nm is 80% or higher of a total number of observed precipitates, and the copper alloy wire is subjected to cold working after the aging heat treatment.

Abstract: What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002?Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, an average crystal grain diameter of ? phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 ?m, and the copper alloy includes a precipitate containing P and one or more elements selected from Fe and Ni.

Abstract: An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained.

Abstract: A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry.

Abstract: A Cu—Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 105 number/mm2.

Abstract: A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}?3.0??(1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

Abstract: What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002?Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, an average crystal grain diameter of ? phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 ?m, and the copper alloy includes a precipitate containing P and one or more elements selected from Fe and Ni.

Abstract: There is provided a current collector copper foil of negative electrode for lithium ion secondary battery, including: at least 0.15 wt % or more and 0.40 wt % or less of Cr; and Cu as a remaining portion, wherein a Cr solid solution index Z is in a range of 0.05?Z?0.3 and represented by the following formula: Z=(RM?RS)/(RP?RS) . . . (1), wherein RM indicates an actually measured conductivity R (% IACS) of a negative battery current collector copper foil, and RS indicates a calculated value (% IACS) of conductivity R of the negative electrode current collector copper foil 10 in a case that a total content of Cr is solid-soluted, and conductivity RP indicates a calculated conductivity R (% IACS) of the negative electrode current collector copper foil 10 in a case that the total content of Cr is separated.

Abstract: The invention provides Cu—Ni—Si—Co alloys having excellent strength, electrical conductivity, and press-punching properties. In one aspect, the invention is a copper alloy for electronic materials, containing 1.0 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, and 0.30 to 1.2 mass % of Si, the balance being Cu and unavoidable impurities, wherein the copper alloy for electronic material has a [Ni+Co+Si] content in which the median value ? (mass %) satisfies the formula 20 (mass %)???60 (mass %), the standard deviation ? (Ni+Co+Si) satisfies the formula ? (Ni+Co+Si)?30 (mass %), and the surface area ratio S (%) satisfies the formula 1%?S?10%, in relation to the compositional variation and the surface area ratio of second-phase particles size of 0.1 ?m or greater and 1 ?m or less when observed in a cross section parallel to a rolling direction.

Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).

Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.

Abstract: A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine copper alloy wire is 3% or more and 20% or less.

Abstract: A method for producing beryllium-copper containing at least Be and Cu, includes holding the beryllium-copper for a predetermined solid solution time in a solid solution temperature range in which the Be is dissolved into the Cu, cooling the beryllium-copper at a cooling speed at which the Be remains dissolved in the Cu, applying plastic strain to a cooled beryllium-copper over multiple times in a processing temperature range in which the Be is not precipitated, and holding the beryllium-copper for a predetermined age hardening time in a precipitation temperature range in which the Be is precipitated.

Abstract: A copper alloy material according to the present invention is characterized in that the same comprises: Ni between 2.8 mass % and 5.0 mass %; Si between 0.4 mass % and 1.7 mass %; S of which content is limited to less than 0.005 mass %; and the balance of the copper alloy material is composed of copper and unavoidable impurity, wherein a proof stress is stronger than or equal to 800 MPa, and the same is superior in bending workability and in stress relaxation resistance.

Abstract: The invention includes a copper-comprising sputtering target. The target is monolithic or bonded and contains at least 99.99% copper by weight and has an average grain size of from 1 micron to 50 microns. The copper-comprising target has a yield strength of greater than or equal to about 15 ksi and a Brinell hardness (HB) of greater than about 40. The invention includes copper alloy monolithic and bonded sputtering targets consisting essentially of less than or equal to about 99.99% copper by weight and a total amount of alloying element(s) of at least 100 ppm and less than 10% by weight. The targets have an average grain size of from less than 1 micron to 50 microns and have a grain size non-uniformity of less than about 15% standard deviation (1-sigma) throughout the target. The invention additionally includes methods of producing bonded and monolithic copper and copper alloy targets.

Abstract: The present invention provides Cu—Ni—Si system alloys for electronic material that with the addition of other alloy elements minimized, simultaneously exhibits enhanced electric conductivity, strength, bendability and stress relaxation performance. There are provided Cu—Ni—Si system alloys comprising 1.2 to 3.5 mass % Ni, Si in a concentration (mass %) of ? to ¼ of Ni concentration (mass %) and the balance Cu and impurities whose total amount is 0.05 mass % or less, the Cu—Ni—Si system alloys having its configuration of crystal grains and width of a precipitate-free zone regulated so as to fall within appropriate ranges by controlling solution treatment conditions, aging treatment conditions and degree of a reduction ratio. Thus, there can be provided copper alloys strip of 55 to 62% IACS electric conductivity and 550 to 700 MPa tensile strength, being free from cracking at 180° bending test of 0 radius and exhibiting a stress relaxation ratio, as measured on heating at 150° C. for 1000 hr, of 30% or less.

Abstract: An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained.

Abstract: A copper-based deposited alloy strip for a contact material has a maximum value of a difference not larger than 100 MPa among three of tensile strengths, that are a tensile strength in a rolling direction thereof, a tensile strength in a direction crossing the rolling direction with an angle of 45 degrees, and a tensile strength in a direction crossing the rolling direction with an angle of 90 degrees. A process for producing the copper-based deposited alloy strip for a contact material includes the steps of: performing a solution heated treatment on a copper alloy strip; and performing an aging heat treatment on the copper alloy strip.

Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr, and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) of (hkl)plane measured with respect to a rolled surface is 2.0 or more.

Abstract: An object of the present invention is to provide a strengthened alpha brass having a good balance between high offset yield strength and formability without deteriorated stress relaxation resistance in comparison with conventional brass and a manufacturing method of the strengthened alpha brass. In order to achieve this object, a strengthened alpha brass having a composition of 63 wt % to 75 wt % copper, incidental impurities and the balance zinc; the strengthened alpha brass which is obtained by using a starting plate material subjected to a re-crystallization annealing to have a grain size from 1-micron meter to 2-micron meter followed by cold rolling in 5% to 40% reduction, then the plate material is low temperature annealed at a temperature equal to or higher than the temperature at which a 0.2% offset yield strength exhibits a maximum value to adjust the 0.2% offset yield strength ([Sigma]0.2: MPa) to be equal to or higher than 90% of its maximum value is adopted. The strengthened alpha brass has a 0.

Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.

Abstract: The invention includes a copper-comprising sputtering target. The target is monolithic or bonded and contains at least 99.99% copper by weight and has an average grain size of from 1 micron to 50 microns. The copper-comprising target has a yield strength of greater than or equal to about 15 ksi and a Brinell hardness (HB) of greater than about 40. The invention includes copper alloy monolithic and bonded sputtering targets consisting essentially of less than or equal to about 99.99% copper by weight and a total amount of alloying element(s) of at least 100 ppm and less than 10% by weight. The targets have an average grain size of from less than 1 micron to 50 microns and have a grain size non-uniformity of less than about 15% standard deviation (1-sigma) throughout the target. The invention additionally includes methods of producing bonded and monolithic copper and copper alloy targets.

Abstract: A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 ?m.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: A process is provided for forming an age hardened wire for use as an electrical conductor, which wire is formed from a copper base alloy consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy, with the nickel and beryllium being present in the copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0. The process comprises the steps of providing a copper base alloy material consisting of from 1.25 to 3.6 wt % nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy, which nickel and beryllium are present in the copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0, cold working the material in a single step; and age hardening the cold worked material in a single step to form a wire in a cold worked and aged hardened condition having an electrical conductivity of at least about 60% IACS.

Abstract: The invention relates to a copper alloy having high recrystallization temperature and good conductivity used in brazed heat exchangers which alloy consists of 0.1 to 0.3% in weight chromium. The invention also relates to a method for the manufacturing of the alloy which method consists of the following steps: casting, cold working, annealing and another cold working before brazing.

Abstract: Superior bendability in a copper alloy and further strength improvement ensures characteristics which are sufficiently superior in view of essential qualities of strength of titanium-copper. 2.0 to 4.0 mass % of Ti, 0.01 to 0.50 mass % of one or more than one kind of element from among Fe, Co, Ni, Cr, V, Zr, B, and P as the third element group are contained, and not less than 50% of the total content of these elements is made to exist as second-phase particles.

Abstract: A method for producing metallic strips having a high-grade cube texture based on nickel, copper, aluminum, silver or alloys of these metals including austenitic iron-nickel alloys makes it possible to obtain, during a subsequent annealing process and with lower total degrees of forming, a recrystallization cube layer of a quality equal to that of one obtained using customary roll forming and produces a better quality cube texture with comparable total degrees of forming. To this end, a forming method is provided during which the materials are formed by cold drawing before their recrystallization annealing thereby rendering them high-grade. The tools used for this include: a) non-driven roll devices with an axially parallel flat pair of rolls or turk's head arrangements with two pairs of rolls or; b) fixed drawing jaws that are slanted toward one another. The strips produced according to the invention can be used, for example, as a coating support for producing strip-shaped high-temperature superconductors.

Abstract: The yield strength of UNS C17460 BeCu alloy can be significantly enhanced without compromising electrical conductivity or bend formability by age hardening the alloy during manufacture using two separate heat treatment steps and cold rolling the alloy for enhancing age hardening response between these two heat treatment steps rather than before age hardening begins as in current technology.

Abstract: The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate rolled at any reduction ratio is heated at different temperature levels, and strength and conductivity of the plate after the annealing are measured for each annealing temperature so as to establish the conductivity-annealing temperature curve and strength-annealing temperature curve as the correlations between annealing temperature and strength and between annealing temperature and conductivity, then, an optimum annealing temperature required to provide a desired conductivity or strength is determined by extrapolating the above-described conductivity-annealing temperature curve or strength-annealing temperature curve at the desired conductivity or strength, and the plate prepared at any reduction ratio is annealed at the optimum annealing temp

Abstract: A high strength copper alloy is made of a prescribed material composed of Cu and inevitable impurities as well as titanium (Ti) at 0.1 to 4 weight percent, wherein it is possible to further include at least one of Ag, Ni, Fe, Si, Sn, Mg, Zn, Cr, and P at a prescribed weight percent ranging from 0.01 to 2 in total. In a manufacturing method, the material is subjected to cold rolling, precipitation treatment, and additional cold rolling sequentially, wherein the reduction rate of the additional cold rolling is set to 3% or more, and the total reduction rate of the cold rolling and the additional cold rolling ranges from 15% to 50%, so that a ratio of yield strength versus tensile strength is set to 0.9 or more. In addition, it is possible to perform stress relaxation annealing after the additional cold rolling upon heating of the material for a prescribed time.

Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.

Abstract: A process for making a copper base alloy comprises the steps of casting a copper base alloy containing tin, zinc, iron and phosphorous and forming phosphide particles uniformly distributed throughout the matrix. The forming step comprises homogenizing the alloy at least once for at least one hour at a temperature from 1000 to 1450° F., rolling to final gauge including at least one process anneal for at least one hour at 650 to 1200° F. followed by slow cooling, and stress relief annealing at final gauge for at lest one hour at 300 to 600° F.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 &mgr;m or less; and a 0.2% proof stress expressed by “b” of 800 N/mm2 or more. The alloy further comprises a bending radius ratio (bending radius/sheet thickness) not causing cracking as expressed by “a” by a W-bending test in a transverse direction to a rolling direction, wherein “a” and “b” satisfy a≦0.

Abstract: An object is to improve machinability and polishability of a brass material prepared through cold working, particularly in a brass pipe material. Before cold working, by having an &agr; phase making heat treatment step for increasing an area ratio of an &agr; phase, cold ductility can be ensured at the time of cold working. Also, after cold working, by having a &bgr; phase making heat treatment step for increasing an area ratio of a &bgr; phase, a brass material excellent in machinability and polishability can be provided.

Abstract: Processes for producing articles with stress-free edges which comprise slitting a copper or copper alloy sheet to provide strips of the copper material, heating the strips in a furnace at a temperature of 200-250° C. under a protective atmosphere, and cooling the strips to room temperature, the strips so produced being useful to make stamped articles.

Abstract: A brass for forging which has an apparent Zn content of 37 to 50 wt % and contains 0.5 to 7 wt % Sn. The brass has a microstructure of at least an &agr; phase and a &ggr; phase at a temperature of 300 to 550° C. and has crystal grain sizes which are made fine. A process for preparing brass involving making the crystal grain size of brass material fine and plastic working the brass material at 300 to 550° C.

Abstract: The present invention relates to copper base alloys containing tin, phosphorous, iron, and zinc and having phosphide particles uniformly distributed through the alloy matrix, which phosphide particles include fine and coarse phosphide particles. The alloy is produced using a process which comprises casting a copper base alloy consisting essentially of tin in an amount greater than about 1.5 wt. % up to 4.0 wt. %, phosphorous from 0.01 to 0.20 wt. %, iron from 0.01 to 0.80 wt. %, zinc in an amount greater than 1.0 wt. % up to 8.0 wt. %, and the balance essentially copper; homogenizing at least once for at least one hour at from 1000° F. to 1450° F.; rolling to final gauge including at least one process anneal for at least one hour at 650° F. to 1200° F. followed by slow cooling, preferably at a rate in the range of 20° F. to 200° F. per hour; and stress relief annealing at final gauge for at least one hour at 300° F. to 600° F.

Abstract: Processes for producing articles with stress-free edges which comprise slitting a copper or copper alloy sheet to provide strips of the copper material, heating the strips in a furnace at a temperature of 200-250° C. under a protective atmosphere, and cooling the strips to room temperature, the strips so produced being useful to make stamped articles.

Abstract: A structure of a two-phase steel is controlled by subjecting a steel containing C: 0.05-0.80 mass % to a strain work in a true strain quantity of not less than 0.1 at a temperature zone of &agr;-phase or &ggr;-phase and then applying a magnetic field of 0.1-20 T thereto within a temperature range forming a two-phase zone of &agr;-phase and &ggr;-phase.

Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Abstract: A copper alloy having improved resistance to cracking due to localized plastic deformation and the process of making it. The alloy consists essentially of: from 0.7 to 3.5 weight percent nickel; from 0.2 to 1 weight percent silicon; from 0.05 to 1 weight percent tin; from 0.26 to 1 weight percent iron; and the balance copper and unavoidable impurities. The copper alloy has a local ductility index of greater than 0.7 and a tensile elongation exceeding 5%. Cobalt may be substituted for iron, in whole or in part, on a 1:1 basis by weight. The alloy is precipitation hardenable and useful for electronic applications, including without limitation, connectors.

Abstract: A process for producing a fcc metal consisting of copper having random orientations comprising cross rolling which is performed to achieve a total draft of at least 20% with the rolling axis being offset at 15° or more in each pass to a total offset of at least 90°, and subsequent full annealing which is accompanied by recrystallization, the fcc metal satisfying the following relationships: I(200)/I(111)≦2.3 and I(220)/I(111)≦1.0, where I(111), I(200) and I(220) are the integral intensities of the (111), (200) and (220) faces, respectively, of crystal faces as measured by X-ray diffractiometry.

Abstract: A method for forming supports for use in electronic components. A plate of copper-based alloy including from 0.1 to 1.0% by weight nickel, and from 0.005 to 0.1% by weight of phosphorus is melted and cast. The alloy includes fine precipitates of nickel phosphides throughout the copper matrix. The plate is subjected to a series of deformation operations including, rolling and intermediate annealing at a temperature in the range of 400.degree. to 600.degree. C., with the annealing temperature being maintained for two to four hours, thereby maximizing the production of fine precipitates of nickel phosphides within the alloy. After alloy formation, the plate is coated with a layer of nickel, cut into a desired shape, and secured to an electronic component.