Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

Abstract: A method of producing a brass is disclosed. The alloy contains trace amounts of iron, manganese or aluminum. Phosphorous is added to a zinc, copper melt and combined with the iron, manganese and aluminum to form intermetallics. Additional phosphorous is added so the melt contains between about 0.08 to 0.15% phosphorous. A low lead brass alloy is provided. The alloy has tin in the range of 0.15% to 0.35%.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.

Abstract: A copper alloy material for an electric/electronic part, having a composition comprising Co 0.5 to 2.0 mass % and Si 0.1 to 0.5 mass %, with the balance of Cu and inevitable impurities, in which a copper alloy of a matrix has a grain size of 3 to 35 ?m, a precipitate composed of Co and Si has a particle size of 5 to 50 nm, the precipitate has a density of 1×108 to 1×1010 number/mm2, and the copper alloy material has a tensile strength of 550 MPa and an electrical conductivity of 50% IACS or more.

Abstract: A bronze alloy having a metallographic structure which has a fine multilayer structure constituted of a layer of ?-form copper and a layer of a copper-tin intermetallic compound and includes an eutectoid phase comprising, dispersedly precipitated therein, fine metal grains containing at least bismuth (fine bismuth grains, etc.). The proportion of the lamellar eutectoid phase is 10-70% by area. From the standpoint of composition, the bronze alloy comprises copper and tin as main components and contains nickel, bismuth, and sulfur as additive elements, the nickel content being 0.5-5.0 mass %, the bismuth content being 0.5-7.0 mass %, and the sulfur content being 0.08-1.2 mass %. The tin content preferably is 8-15 mass %. The alloy may further contain lead in a proportion of 4 mass % or lower. The bronze alloy is used as a sliding surface of a sliding member (e.g., a hydraulic cylinder block).

Abstract: An copper alloy material for electric/electronic components containing Co by 0.2 to 2 mass % and Si by 0.05 to 0.5 mass % and having a remaining component composed of Cu and unavoidable impurities, characterized in that its grain size is 3 to 35 ?m and size of precipitate containing the both of Co and Si is 5 to 50 nm, electric conductivity is 50% IACS or more, tensile strength is 500 MPa or more and bending workability (R/t) is 2 or less.

Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.

Abstract: The electrical conductivity of a wrought processed, high strength, age hardened Be—Cu alloy is enhanced by overaging the alloy in manufacture.

Abstract: A copper-based deposited alloy strip for a contact material has a maximum value of a difference not larger than 100 MPa among three of tensile strengths, that are a tensile strength in a rolling direction thereof, a tensile strength in a direction crossing the rolling direction with an angle of 45 degrees, and a tensile strength in a direction crossing the rolling direction with an angle of 90 degrees. A process for producing the copper-based deposited alloy strip for a contact material includes the steps of: performing a solution heated treatment on a copper alloy strip; and performing an aging heat treatment on the copper alloy strip.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: The invention refers to batch casting, semi-continuous casting or continuous casting and rolling of copper, providing the addition of lead or refining the melt copper or the melt microalloyed copper to a lead content equal to or higher than 200 weight ppm. This minimizes the number of pores and defects, decreasing the number of incidences or breaks during casting and in service. However, it does not reduce the electrical conductivity. The addition of lead allows the cast and roll of copper microalloyed with elements such as S, Se, As, Sb, Bi, Sn, Zn, Ni, Fe, Ag and Te, in concentrations of the order of tens of weight ppm. The copper microalloys manufactured in this way have annealing temperatures and strain strengths higher than those obtained from the equivalent tough-pitch copper or the equivalent microalloyed copper with lead content lower than 15-20 weight ppm.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous &ggr;′ phase precipitate at the grain boundaries, ductile fracture behavior during tensile testing, high strength, excellent wear and corrosion resistance, superior bearing properties, and contains from about 8-16 wt. % nickel, from about 5-8 wt. % tin, and a remainder copper.

Abstract: An Ni-free white copper alloy of formula CuaZnbTic or CuaZnbTicXd wherein X is at least one element selected from the group consisting of Al, Sn, Ag and Mn, b, c and d are, in mass %, 0.5≦b≦30, 1≦c≦7 and 0.1≦d≦4, and a is the balance, with unavoidable elements, and also a producing method therefor, comprising: preparing a material alloy for the above white copper alloy; heating the alloy to 700 to 885° C.; and cooling the alloy. The Ni-free white copper alloy has a strength and excellent hardness comparable to those of nickel silver, as well as excellent workability, corrosion resistance and whiteness in addition to ductility, and is free from an Ni allergy problem because of containing no nickel, and moreover tends not to cause needle detectors to malfunction.

Abstract: The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: Large sections of solution annealed, precipitation hardenable alloys which are resistant to internal cracking yet fully hardenable can be produced if, during rapid quenching, the temperature of the section is allowed to stabilize immediately above the alloy's solvus temperature before the section is rapidly quenched. Preferably, the temperature of the section is allowed to stabilize a second time, this time at an elevated temperature not so high that significant phase changes occur, before the section is cooled to ambient.

Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Abstract: A high strength, highly electrically conductive copper-based alloy and method for producing the alloy are provided, with the alloy containing boron in the range of 0.0-2.9 at. %, magnesium in a range of about 2.8-7.6 at. %, tin in a range of about 2.1-4.3 at. %, and the balance copper and unavoidable impurities. The method for producing the high-strength, highly conductive alloy includes solution heat treating or annealing the material to dissolve the solute elements into a solid solution including the copper, rapidly quenching the material to freeze the solute elements in solid solution, and aging the material at a temperature in a range of about 400-475° C. to precipitation harden the alloy material.

Abstract: A treatment process is provided for a copper-beryllium alloy comprising from about 0.2% to about 0.7% beryllium, no greater than 3.5% of cobalt and/or nickel, no greater than 0.5% of titanium and/or zirconium and at least 90% copper, wherein the alloy has been cold worked to a ready-to-finish gauge, comprising the steps of annealing the cold worked ready-to-finish gauge copper-beryllium alloy at a temperature from about 1500.degree. F. to about 1685.degree. F., cold working the annealed copper-beryllium alloy to reduce its gauge to a range of from about 20% to about 60%, and age hardening the copper-beryllium alloy at a temperature of from about 700.degree. F. to about 950.degree. F. for about 1 to about 7 hours. The alloy is characterized by satisfactory levels of strength and electrical conductivity as well as enhanced levels of formability, particularly in the direction parallel to the direction of rolling the alloy.

Abstract: Copper wire coated with a layer of zinc is heated to a temperature (T.sub.1) sufficient for the formation of a brass phase .beta., and the temperature is maintained until complete diffusion of the zinc. The thickness of the zinc covering can be chosen in such a way that once the zinc is completely diffused, the wire consists of a brass phase .beta. in its periphery and of copper in its central part. The wire is then heated to a temperature (T.sub.2) necessary for the formation of brass phase .alpha., and the central copper part of the wire is transformed into brass phase .alpha..

Abstract: A bulk magnetoresistance effect material of a composition represented by the general formula: T.sub.100-A M.sub.A (wherein T is at least one element selected between Cu and Au; M is at least one element selected from the group consisting of Co, Fe, and Ni; and A is in the range: 1.ltoreq.A.ltoreq.50 by atomic percent) is prepared by casting a molten mixture of the above composition, and subjecting the resulting casting to homogenization and further to heat treatment. The bulk magnetoresistance effect material is high in the rate of change in the electrical resistance thereof, i.e., shows a large magnetoresistive effect and can be obtained in such bulk form in arbitrary shapes adaptable for various uses. Using the material, various types of magnetoresistive elements are obtained.

Abstract: A method of enhancing the appearance of a polished surface of an artifact is provided in which the artifact is formed from a non-ferrous alloy, in particular, but not exclusively, a precious metal alloy, chosen to exhibit a martensitic and a parent phase structure. The surface, or relevant part thereof, is polished in one of the phases, usually the parent phase, followed by heat treatment to effect a phase transformation, generally to the martensitic phase. This phase change causes a visible surface effect to the polished surface which may be described as a spangle effect.

Abstract: A tubular blank made of an age-hardening copper alloy is annealed and quenched; whereupon a mandrel of the final shape and size of the interior cavity of the mold to be made is inserted; whereupon the blank is forced onto the mandrel primarily by drawing, but also rolling, forging, electrodynamically or hydrostatically shaping, or a combination thereof is considered.

Abstract: Process for the preparation of a substantially homogeneous alpha phase copper-nickel-tin alloy comprising copper and 4-18% by weight of nickel and 3-13% by weight of tin, comprising atomizing a molten alloy having the before-indicated composition and collecting atomized particles on a collecting surface in such a way that solid collected material is obtained having a temperature, of at least 700.degree. C., followed by quick cooling of the collected material to a temperature below 300.degree. C.The alloy thus obtained may be hardened, preferably after shaping, by spinodal decomposition.