Abstract: A method of crystallizing a semiconductor thin film moves a laser beam emitted by a pulse laser in a first direction to irradiate the semiconductor tin film with the laser beam for scanning. The laser beam is split into a plurality of secondary laser beams of a width smaller than the pitch of step feed, respectively having different energy densities forming a stepped energy density distribution decreasing from the middle toward the opposite ends thereof with respect to the direction of step feed. The energy density of the first secondary laser beam corresponding to the middle of the energy distribution is higher than a threshold energy density, i.e., the minimum energy density that will melt the semiconductor thin film to make the same amorphous, and lower than a roughening energy density, i.e.

Abstract: The invention relates to taking advantage of increasing the boiling point of a material by increasing pressure within the processing chamber, which will then push the optical ablation limit to a higher optical fluence (laser intensity). A method in accordance with the invention of planarizing a metallic film on a semiconductor wafer employing laser energy comprises: a) injecting an inert gas into a laser planarization chamber to provide a desired pressure within the chamber which is above 1 Torr; and b) selectively applying laser energy to the metallic film within the chamber containing the inert gas and maintained at a pressure greater than 1 Torr. Increasing pressure within the chamber in this manner will raise the boiling temperature of the particular metallic film without a corresponding significant increase in the melting temperature of the metallic film.

Abstract: A process for manufacturing a bipolar semiconductor device having self-aligned contact regions. The process avoids the need for a masking step for the application of interconnecting contacts by providing a dielectric material having a low melting point over the emitter region of the semiconductor. The dielectric material is heated to its melting point such that it covers and encapsulates the emitter. Conductive contact material is then subsequently provided using the self-alignment feature of the melted dielectric which isolates the base from the contacts.

Abstract: An improved method and apparatus for crystallizing amorphous or polycrystalline material is disclosed. In this invention, a material which is to be crystallized is formed on a substrate and single crystalline seed material is disposed in contact and/or adjacent to or with at least a portion of the material which is to be crystallized. A layer of material which serves as a "wetting agent" is then formed over the material to be crystallized. The structure thus formed is subjected to a heat treatment which melts the material being crystallized and when the material solidifies its crystalline structure is substantially epitaxial based on the seed material. The "wetting agent" layer serves to prevent deleterious balling up of the material during crystallization.

Abstract: A silicon substrate having a controlled oxygen content is sliced to form a wafer. The backside surface of the wafer is mechanically damaged for external gettering, polished, and subjected to heat for annealing to reduce strain and defects near the surface. The surface is then etched and the epitaxial layer formed by first growing an epitaxial layer, removing a substantial portion thereof, and then regrowing the layer to the required thickness. Immediately prior to device processing, an oxide layer is formed by heating the wafer, removing a portion of the epitaxial layer, and placing the wafer in an oxygen atmosphere. After a preselected time period in the oxygen atmosphere, the temperature is gradually reduced.