Abstract: Chips having subsurface structures within or adjacent a horizontal trench in bulk single crystal semiconductor are presented. Structures include three terminal devices, such as FETs and bipolar transistors, rectifying contacts, such as pn diodes and Schottky diodes, capacitors, and contacts to and connectors between devices. FETs have low resistance connectors to diffusions while retaining low overlap capacitance. A low resistance and low capacitance contact to subsurface electrodes is achieved by using highly conductive subsurface connectors which may be isolated by low dielectric insulator. Stacks of devices are formed simultaneously within bulk single crystal semiconductor. A subsurface CMOS invertor is described. A process for forming a horizontal trench exclusively in heavily doped p+ regions is presented in which porous silicon is first formed in the p+ regions and then the porous silicon is etched.

Abstract: A transfer metal configuration and fabrication process possessing increased probability of intersecting a transverse metallization level are presented, without employing an increase in actual metal thickness. The transfer metal is configured with a non-rectangular transverse cross-section such that the thickness of the electrical connect remains the same, but the transverse contact area of the exposed metal is increased. The entire transfer metal may have the same transverse cross-sectional configuration or have portions with different transverse configurations. If different configurations are employed, each portion of the transfer metal to be transversely intersected has the enhanced cross-sectional configuration. A tiered transverse configuration is presented which facilitates electrical connection of the transfer metal to a metal level on a face of a semiconductor cube structure.

Abstract: In a field intensity relaxation of the drain end of a MOSFET, a projective area is not increased with a reduced electrostatic coupling of the source or drain with the gate. The MOSFET satisfying such condition is fabricated on the SOIS film formed by processes of the lateral vapor phase epitaxial growth and the like. A U-shape low concentration impurity region is provided on a gate electrode through a gate dioxide film and high concentration impurity regions are formed at the tops of protrusions. The gate electrode is embedded in insulation films, and the transistor region is fabricated by the lateral vapor phase epitaxial growth and the like.

Abstract: A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.

Abstract: A photoelectric conversion device of the type having a photosensor region and a circuit section for processing at least an output signal from the photosensor region, wherein on a first layer formed with an electronic element constituting the circuit section, a second layer with a deposition surface is formed directly or through an interposed insulation layer, and wherein at least one of the electronic element and the photosensor is formed in a crystal layer which has grown from a single nucleus formed on a nucleus forming region on the deposition surface of the second layer, the single nucleus being sufficiently fine for making only a single crystal grow and having a sufficiently high nucleation density than that of the material of the second layer surface.

Abstract: In a field intensity relaxation of the drain end of a MOSFET, a projective area is not increased with a reduced electrostatic coupling of the source or drain with the gate. The MOSFET satisfying such condition is fabricated on the SOIS film formed by processes of the lateral vapor phase epitaxial growth and the like. A U-shape low concentration impurity region is provided on a gate electrode through a gate dioxide film and high concentration impurity regions are formed at the tops of protrusions. The gate electrode is embedded in insulation films, and the transistor region is fabricated by the lateral vapor phase epitaxial growth and the like.

Abstract: A semiconductor device has an insulated gate type transistor. The insulated gate type transistor is formed on an insulating surface of substrate.The insulated gate type transistor is formed in a single crystal layer which is grown from a single nucleus formed on nucleation region which is provided on said insulating surface, which has sufficiently greater nucleation density than material of said insulating surface and which has sufficiently small size so that only one nucleus can be grown.

Abstract: An integrated circuit is formed thereof a conductive wiring pattern. On the conductive wiring semiconductor layer is directly formed in a form of amorphous on the substrate. The amorphous semiconductor layer is annealed to form a polycrystalline structure while avoiding influence of annealing heat for the substrate. In the polycrystalline semiconductor layer is formed a semiconductor element, such as MOS transistor, MIS transistor, TFT and so forth. The semiconductor element is directly connected to the wiring pattern on the substrate.

Abstract: Disclosed is a thin film transistor used to manufacture a highly integrated SRAM or LCD and its manufacturing method, and more particularly, to a thin film transistor having a multi-layer stacked channel in order to increase the current flow during the thin film transistor's ON state by securing a enough channel width despite of the limited area. A thin film transistor on which a channel had been deposited in accordance with the present invention can be manufactured in a small area; accordingly, a highly integrated SRAM can be manufactured by decreasing the area of the unit cell of SRAM. Also, the resolution can be enhanced by decreasing the area occupied by the thin film transistor in the panel during the manufacturing process of the LCD.

Abstract: An interconnect layer (40) for interposing between two active circuit layers of a multi-chip module (50). The interconnect layer includes a layer of silicon (14) having first surface and second surfaces. A first layer of dielectric material (16) is disposed over the first surface and a second layer of dielectric material (12) disposed over the second surface. The interconnect layer includes at least one electrically conductive feedthrough (42) that is formed within an opening made through the layer of silicon. The opening has sidewalls (22) that are coated with a dielectric material (24) and an electrically conductive material for providing a topside contact (26). A second contact (28) is formed from the backside of the silicon layer after removing the substrate (10).

Abstract: Optoelectronic devices (16) are formed on a first surface (12) of a gallium arsenide substrate (10) using selective ion implantation. Signal processing devices may be formed on a second, opposite surface (14) of the substrate (10) using selective ion implantation (38) and/or selective epitaxy (22,24),(40). Vertical interconnects (34,46) are formed between the first and second surfaces (12,14). Alternatively, a gallium arsenide buffer layer (54) may be grown on the first surface (12) of the substrate (10), and the signal processing devices formed on the buffer layer (54) using selective ion implantation (58,60,62) and/or selective epitaxy (76,78,80,82). Dielectric (50) and/or conductive metal (52) layers may be formed on selected areas of the first surface (12), and the buffer layer (54) grown from exposed areas (56) of the first surface (12) over the dielectric (50) and/or metal (52) layers using lateral epitaxial overgrowth organometallic chemical vapor deposition.

Abstract: A method and the resulting product for isolating lightly doped silicon islands from each other and from a common substrate. The substrate is covered with a first heavily doped epi layer. The first layer is covered with a lightly doped second epi layer. A pair of spaced deep trenches are provided which extend from the top surface of the second layer, through the first layer and into the substrate. The interior walls of the trenches are lined with oxide. A pair of heavily doped reach-through diffusions extending from said top surface to the first layer is oriented perpendicularly to the deep trenches and fully extends between the trenches. The heavily doped reach-through diffusions and the contiguous first layer are removed by a single anisotropic etching step to yield silicon islands isolated by air except where the islands contact the oxide-lined deep trenches. The air isolation preferably is partially replaced with other dielectric material.

Abstract: A method of fabricating a surface micromachined structure is comprised of the steps of providing a semiconductor substrate having a dynamic element partially supported above the semiconductor substrate by a release layer and having a metal contact layer disposed on the dynamic element, forming a protection layer over the metal contact layer, and removing the release layer and the protection layer with an etchant that etches the protection layer at a slower rate than the release layer.

Abstract: A semiconductor device includes a semiconductor layer, an insulating layer on the semiconductor layer, including a discontinuity therein, a monocrystalline silicon layer on a portion of semiconductor layer defined by the discontinuity, a non-monocrystalline silicon layer on the monocrystalline silicon layer, and a wiring layer on the non-monocrystalline silicon layer.

Abstract: In the manufacture of MISFETs using an Si layer island having an SOI structure, the present invention provides an Si layer over an SiO.sub.2 insulation layer, having a groove passing underneath the Si layer gate region and being formed on the surface of the SiO.sub.2 insulation layer by side etching conducted from both sides of the Si layer gate region, so as to form the source and drain. Next, after the SiO.sub.2 insulation layer is formed on the exposed surface of the Si layer gate electrode, a doped polysilicon region is formed through the SiO.sub.2 insulation film in such a manner that the groove and the area surrounding the Si layer gate region are filled, thereby forming the gate electrode. Thereafter, the MISFET is completed according to ordinary FET manufacturing methods.

Abstract: A manufacturing method is provided for producing a stacked semiconductor structure including: depositing a first thick passivating layer onto the base structure; forming first stud openings in the first thick passivating layer exposing at least one active region and/or one of the polysilicon lines; depositing a first layer of a conductive material to fill the first stud openings and define first contact studs, the upper part of some of the first contact studs comprising the gate electrodes of PFET devices; planarizing the structure to make the top surface of the first contact studs coplanar with the surface of the first thick passivating layer; depositing a thick insulating layer to form the gate dielectric of PFET devices and patterning it to define contact openings to expose selected first contact studs at desired locations; depositing a layer of polysilicon; patterning the polysilicon layer to define polysilicon lands containing the first contact studs at the desired locations; selectively implanting to de

Abstract: A method of forming solid copper vias in a dielectric layer permits stacked up vias in a multi-layer multi-chip carrier. An conducting layer is deposited over a substrate and lines of a first interconnect layer formed on the substrate. An aperture formed in a photoresist layer over said lines is filled with copper by electroplating to form a solid via. The via can be polished until its top is flat. Using a photoresist mask, the conductive layer used for electroplating is removed between the lines. A dielectric layer is then formed over the lines and via. A bulge in the dielectric over the via is removed by etching through an aperture defined in a photoresist layer, which is then stripped. A second interconnect layer can be formed on the resulting structure. The foregoing steps can be iterated to build a multi-layer structure with stacked up vias.

Abstract: A method is provided for forming multiple layers of interconnection adjacent a planar surface. A first insulator layer is formed adjacent the selected planar surface. A first conductor layer is formed adjacent the first insulator layer. A second insulator is formed adjacent the first conductor layer. A first cavity and a second cavity are formed, each having sidewalls extending through said second insulator layer and said first conductor layer. The first cavity is formed wider than the second cavity. A third insulator layer is conformally deposited adjacent the second insulator layer, such that sidewall insulators are deposited on sidewalls of the first cavity and such that the second cavity is substantially filled with insulator. An etch is performed through the first cavity to expose a portion of the planar surface. A second conductor layer is conformally deposited adjacent third insulator layer such that second conductor layer extends through the first cavity to contact the planar surface.

Abstract: A permeable base transistor (30) including a metal base layer (34) embedded in a semiconductor crystal (32) to separate collector (38) and emitter (40) regions and form a Schottky barrier with each is disclosed. The metal base layer has at least one opening (37) through which the crystal semiconductor (32) joins the collector (38) and emitter (40) regions. Ohmic contacts (42,44) are made to the emitter (38) and collector (40) regions. The width of all openings (37) in the base layer (34) is of the order of the zero bias depletion width corresponding to the carrier concentration in the opening. The thickness of the metal layer (34) is in the order of 10% of this zero bias depletion width. As a result, a potential barrier in each opening limits current flow over the lower portion of the bias range.

Abstract: In a method of manufacturing a semiconductor device of the "semiconductor on insulator" type comprising at least one carrier body and a monocrystalline semiconductor body, in a major surface (2) of a monocrystalline semiconductor body (1) grooves (3) are provided having a predetermined depth. The surface provided with grooves is coated with a layer (4) of material resistant to polishing; and this layer is coated with a layer (5) of a chemomechanically polishable material having a layer thickness exceeding the groove depth, the latter layer (5) being polished to flatness and smoothness. The polished surface of the semiconductor body (1) is connected to a smooth flat major surface of a carrier body (6).

Abstract: A semiconductor circuit apparatus including several semiconductor substrates interconnected by having elevated portions of one substrate contacting the surface of the second substrate where both substrates include at least one electrical circuit. Also included is a method for forming this three dimensional integrated circuit structure by forming the elevated portions of the semiconductor substrate by applying an orientation-dependent etch and then applying an electrically conductive coating to this elevated portion. Electrically conductive bonding pads are formed on the second semiconductor substrate. These pads are selectively positioned relative to the elevated portions formed on the first semiconductor substrate. Contacts between the first and second substrate are formed by forming bonds between the elevated portions on the one substrate and the electrically conductive pads on the second substrate.

Abstract: A method for making a layer of monocrystalline, semiconducting material on a layer of insulating material is disclosed. For this, epitaxial growth is achieved in a cavity closed by layers of dielectric materials, using seeds of monocrystalline, semiconducting material of a substrate. This method thus enables a 3D integration of semiconductor components.

Abstract: A method for producing a three-dimensional type semiconductor device comprises a first semiconductor integrated circuit layer comprising active regions, insulating layers, gate electrodes, and interconnection layers; an insulating layer formed thereon; and a second semiconductor integrated circuit layer comprising active regions, insulating layers, gate electrodes and interconnection layers. Active regions in the second layer are directly coupled to an interconnection layer, and active region and a gate electrode in the first layer, which are located immediately thereunder, by interlayer interconnections through a contact hole formed straight, so that a distance of each interlayer interconnection can be reduced.

Abstract: In three-dimensional packaging of focal plane signal processing electroni the necessity of routing conductors from the face of the die to the edge of the die in the module for placement of inter-connection pads for interconnection to the next assembly presents the problem of electrical isolation of the conductors from adjacent silicon dies and their underlying silicon substrate. This problem is avoided by the use of a gold ribbon lead that is bonded to the face of each die. The ribbons function as electrically isolated conductive risers upon which inter-connection pads are placed for connection to the next assembly and as precision spacers between stacked dies during module assembly.

Abstract: A system of establishing a conductive via path between spaced interlevel conductors. Successive layers of metallization separated by a dielectric are built. The vias are opened in one step to eliminate interlevel mashing. The system employs annular pads at locations where contact may be established to another wiring level. The vias are self-aligned and taper from top metal to first level contact. The system is applicable both chip-wise and carrier-wise.

Abstract: A multilevel semiconductor integrated circuit is fabricated by providing a plurality of substrates having an epitaxial layer on one surface and a silicon oxide layer on the surface of the epitaxial layer. The substrates are sequentially stacked with the silicon oxide layers in contact and fused together. One substrate is retained as a support, and other substrates are removed by etching after the fusion of the silicon oxide layers, thereby leaving only the stacked epitaxial layers separated by silicon oxide. The stacked structure facilitates the vertical fabrication of CMOS transistor pairs sharing a common gate electrode in an epitaxial layer between the two transistors. Electrical isolation between the epitaxial layers is provided by the fused silicon oxide or by removing the silicon oxide and some of the silicon thereby forming a void between adjacent epitaxial layers. Circuit devices in the plurality of epitaxial layers are readily interconnected by forming conductive vias between the epitaxial layers.

Abstract: The present invention is directed to the construction of an integrated circuit chip, and to the method of making such a chip from a plate or wafer. In accordance with the present invention a chip is formed to have conductive edge portions disposed on an insulator surface, which portions optionally may further be expanded into a pad. The insulating material electrically isolates the conductive edge portions from the semiconductive body of the chip. The invention may be implemented in redundant fashion to effect a multiplicity of electrical connections to a set of bulk semiconductor integrated circuits formed on the wafer.Each exposed conductive portion on a chip edge and its optional surrounding conductive pad may be reliably surrounded by insulator so that electrical shorts to non-insulating regions are not experienced.

Abstract: A component of semiconductor material deposited by epitaxial growth on a substrate having a predetermined and different lattice parameter consists of an alternate succession of layers of a first type and layers of a second type deposited on the substrate. The lattice parameter of the first type of layers is substantially matched with the lattice parameter of the substrate. In the case of the second type of layers, the lattice parameter is matched and even equal to that of the first type of layers. A component having a lattice parameter equal to that of the second type of layers is formed on the last layer of the second type. Moreover, the energy gaps of the two types of layers are different.

Abstract: A three dimensional, bipolar wafer process for integrating high voltage, high power, analog, and digital circuitry, and structure formed thereby includes a wafer of non-compensated epitaxial strata on a heavily donor doped monocrystalline silicon substrate of <100> crystal orientation, which is etched and with three dimensional transistors formed in it. Passivation for and contacts to said circuits are established, and the circuits are interconnected. The high voltage and high power transistors include transistors of an H-bridge circuit, including at least one set of cascode double heterojunction transistors, the analog transistors include a bipolar transistor, and the digital transistors include transistors of a I.sup.2 L circuit. One method for constructing the wafer is by sequentially epitaxially depositing each strata in an UHV silicon-based MBE apparatus.

Abstract: A process for fabricating a semiconductor-metal-semiconductor electronic device and the device formed thereby from a semiconductor substrate is described. The substrate forms a first active region of the device. A porous layer of conductive material is deposited on the substrate preferably by molecular beam epitaxy forming a control region. A layer of a semiconductor material epitaxially matched to the substrate is then grown on the layer of conductive material so that the layer of semiconductor material forms a second active region of an electronic device.

Abstract: Improved semiconductor devices having minimum parasitic junction area are formed by using multiple buried polycrystalline conductor layers to make lateral contact to one or more pillar-shaped epitaxial single crystal device regions. The lateral poly contacts are isolated from each other and from the substrate and have at least one polycrystalline pillar extending to upper surface of the device to permit external connections to the lower poly layer.The structure is made by depositing three dielectric layers with two poly layers sandwiched in between. Holes are anisotropically etched to the lowest poly layer and the substrate. A conformal oxide is applied over the whole structure and anisotropically etched to remove the bottom portions in the hole where the poly pillar and the isolation wall are to be formed and isotropically where the single crystal pillar is to be formed. The remaining oxide regions isolate the buried conductor layers, contacts, and isolation walls.

Abstract: A process for manufacturing semiconductor devices, comprising steps for obtaining a multilayered structure consisting of semiconductors and insulating films, by forming a microbridge which consists of a semiconductor in the form of a connecting bar or a one-side supported bar, and by forming an insulating film by oxidizing the exposed surface of the microbridge. The semiconductor device manufactured by the process of the invention exhibits good interface properties between the insulating film and the semiconductor layer. The invention makes it possible to easily manufacture a variety of MOSFETs with the SOI structure, which exhibit excellent characteristics.

Abstract: A process for fabricating a self-aligned three-dimensionally integrated circuit structure having two channel regions responsive to a common gate electrode. A relatively thick lift-off region is formed over and in alignment with the gate electrode. A thick oxide layer is then deposited over the structure so as to form stressed oxide extending from the lift-off layer sidewalls. A selective etch of the stressed oxide follows. The relatively thick oxide covering the lift-off layer is then removed with the etch of the lift-off layer, the lift-off etch acting through the exposed lift-off layer sidewalls. The formation of an upper field effect transistor gate oxide and a conformal deposition of polysilicon for the channel and source/drain regions follows. The conformally deposited polysilicon retains the contour of the recess formed by the lift-off.

Abstract: Improved bipolar transistors having minimum base-collector and collector-substrate junction area are formed by using multiple polycrystalline (e.g. doped poly silicon) layers to make lateral contact to a pillar shaped single crystal device region. The lateral poly silicon contacts are isolated from each other and the substrate and extend to the upper surface of the device for external connections. The structure is made by depositing two dielectric-poly layer sandwiches, etching and oxidizing part of the poly silicon layers to provide isolated overlapping poly silicon regions, etching a first hole through both poly silicon regions to the substrate, etching a second hole to the lower poly silicon layer, and filling the first and second holes with single and poly-crystalline silicon, respectfully. A sidewall oxide is formed at the periphery of the top of the single crystal pillar for defining the emitter location without additional masking.

Abstract: A method for manufacturing a semiconductor device, which comprises: a first process for producing a semiconductor layer of polycrystalline silicon or amorphous silicon on the surface of a substrate of insulator or a substrate made up by forming an insulating layer on a basic semiconductor; a second process for producing an island of semiconductor layer surrounded by dielectric materials from the semiconductor layer; a third process for producing a film of Si.sub.3 N.sub.4 on the island of semiconductor layer, or on a film of SiO.sub.2 formed on the island; a fourth process for removing the film of Si.sub.3 N.sub.4 at a predetermined region on the island; and a fifth process for irradiating with scanning an energy beam to the island of semiconductor layer so as to melt and recrystallize the island, thereby monocrystallizing or increasing the size of crystal grains at at least a partial region thereof.

Abstract: In a process for manufacturing vertically integrated MOS devices and circuits, gate oxide and a gate are formed on a semiconductor substrate such as a silicon substrate. A layer of polysilicon is then deposited over the wafer, the polysilicon contacting the substrate silicon through a window in the gate oxide. The substrate silicon and the polysilicon are then laser melted and cooled under conditions that encourage crystal seeding from the substrate into the polysilicon over the gate. Subsequently, ions are implanted into the silicon substrate and the polysilicon to form source and drain regions. By introducing the source and drain dopants after melt associated seeding of the polysilicon, the risk of dopant diffusion into the device channel regions is avoided.

Abstract: This invention relates to a process of manufacturing an integrated structure in which optical signals can be processed in an electrooptic material such as lithium tantalate and electrical signals can be processed in a semiconductor material such as silicon. Microelectronic semiconductors are fabricated in the semiconductor material and electrooptic devices are fabricated in the electrooptic material. Devices made by the process of the present invention are also disclosed.

Abstract: A method of fabricating a shared element semiconductor structure in which the insulating layer of a silicon-on-insulator structure is patterned to form a gate oxide. The bulk semiconductor underlying the insulating layer is defined into an FET (field-effect transistor) with its gate region below the gate oxide. The epitaxial layer above the insulating layer is defined into another FET with its drain region above the gate oxide, whereby the drain region also operates as the gate electrode for the bulk FET. Also described is a method of forming a silicon on insulator substrate with insulating layer usable as a gate oxide by means of bonding a silicon substrate to an oxidized epitaxial layer on another silicon seed substrate and then removing the seed substrate.

Abstract: In stacked CMOS, a single gate in first level polycrystalline silicon is used to address both an N-channel device in the substrate and an overlaid p-channel device. The p-channel device has self-aligned source and drain regions formed by diffusing a dopant from doped regions underlying them. The doped regions are formed by planarizing a doped insulating layer, and etching the doped layer back to the upper level of the gate prior to deposition of a second polysilicon layer.

Abstract: A CMOS static RAM, which has P channel transistors formed in a second polysilicon layer, N channel transistors formed in the substrate, and gates of both the N channel and P channel transistors formed in a first polysilicon layers, requires that ohmic contact be made between semiconductor material of differing conductivity type. The first polysilicon layer is N-type, and the second polysilicon layer is P-type. Ohmic contact therebetween is achieved by providing a silicide layer which is between these two layers and in physical contact with both. Ohmic contact between N-type regions in the substrate and the second polysilicon layer is similarly achieved by sandwiching silicide therebetween.

Abstract: A stacked CMOS structure is disclosed which uses buried N++ source and drain for the non-self-aligned bulk N-channel driver devices together with an oversized polygate on which a non-self aligned P-channel load device is made from a second layer of poly or recrystallized poly. The non-self aligned pair of stacked devices provides increased density of devices per unit area with a simple process at the cost of increased gate to source and gate to drain parasitic capicitances.