Abstract: A method for trench isolation of a silicon island for device fabrication using only conventional very large scale integration (VLSI) techniques is provided. The combination of the sidewall isolation achieved with the trench isolation and the underlying oxide film create a totally dielectrically isolated structure without the possibility of latch-up between adjacent devices.
Type:
Grant
Filed:
August 12, 1983
Date of Patent:
March 26, 1985
Assignee:
Hewlett-Packard Co.
Inventors:
Theodore I. Kamins, Donald R. Bradbury, Clifford I. Drowley