Face To Face Deposition Patents (Class 148/DIG52)
  • Method of making a silicon based biomedical sensor
    Patent number: 5693577
    Abstract: A sensor 20 is formed on semiconductor substrate 22. Dielectric layers 23 and 24 are formed on the face and backside of substrate 22, respectively. Metal leads 26 and 28 contact the substrate through openings in the dielectric layer 23. The leads 26 and 28 are also connected to the set of interleaved longitudinal contact fingers 27 and 29. Additionally, a pair of backside contacts 30 and 32 are formed on the dielectric layer 24. The backside contact 30 is in contact only with the metal lead 26 through a conductive region 34.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: December 2, 1997
    Assignee: Texas Instruments Incorporated
    Inventors: William R. Krenik, Mark Appleton