Abstract: A method for producing insulating profiles comprises manufacturing a profile body and a first functional element separately, and the profile body and the first functional element are supplied to an ultrasonic welding device, wherein the profile body and the functional element are connected to one another by a material bond by formation of a welded joint. The profile body and the functional element are brought together into a predetermined first cross-sectional geometry during formation of the welded joint and are thereafter guided in this cross-sectional geometry until the plastics material of the welded joint solidifies to such an extent that the profile body and the first functional element are fixed in the predetermined cross-sectional geometry.

Abstract: A burn wire release mechanism for a spacecraft or other system having two masses initially held together by a pretensioned loop, with a spring configured to push the masses apart. The burn wire release system includes at least one burn wire held in contact with the pretensioned loop material. When an electrical current flows through the burn wire, the wire heats up and severs the pretensioned loop, and the masses are pushed apart by the spring.

Abstract: A portable cushion tray includes a cushion coupled to a tray. The tray has a first maximum perimeter. The cushion has a second maximum perimeter. The first maximum perimeter is one of the same as the second maximum perimeter and disposed inside of the second maximum perimeter. The portable cushion tray is used as a furniture accessory and selectively provides each of a pillow and a working surface for use with furniture.

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: An apparatus is provided for splicing together old and new thermoformable sheets in order to supply a continuous thermoforming operation. The apparatus is used to join together thermoformable sheets by: providing a first thermoformable sheet with a trailing edge and a second thermoformable sheet with a leading edge; forming a terminal edge portion with a hot element along the trailing edge and a complementary terminal edge portion along the leading edge by severing a scrap sheet from each portion; laterally retracting each scrap portion away from the trailing edge and the leading edge; and joining together the first thermoformable sheet and the second thermoformable sheet by interlocking together the terminal edge portion with the complementary terminal edge portion.

Abstract: An apparatus and method are provided for splicing together old and new thermoformable sheets in order to supply a continuous thermoforming operation. The method for joining together thermoformable sheets includes: providing a first thermoformable sheet with a trailing edge and a second thermoformable sheet with a leading edge; forming a terminal edge portion with a hot element along the trailing edge and a complementary terminal edge portion along the leading edge by severing a scrap sheet from each portion; laterally retracting each scrap portion away from the trailing edge and the leading edge; and joining together the first thermoformable sheet and the second thermoformable sheet by interlocking together the terminal edge portion with the complementary terminal edge portion.

Abstract: In a film bonding machine 1 including a laser oscillation means 2 for oscillating laser for processing a tape 7 bonded onto an end surface 8 of a columnar honeycomb structural body 6 by the laser oscillated from the laser oscillation means 2, the film bonding machine 1 further includes an image pick-up means 3 having a moving type or tilt type mirror 4 capable of reflecting the end surface 8 of the honeycomb structural body 6 onto the same axis as the laser oscillation means 2 by reflected light and an image pick-up unit 5 for picking up the image of the end surface 8 of the honeycomb structural body 6 reflected by the mirror 4. In the film bonding machine 1, the processing position of the tape 7 bonded onto the end surface 8 of the honeycomb structural body 6 can be recognized by the image-pick means 3 on the same axis as the laser oscillation means 2. As a result, the tape bonded onto the end surface of the honeycomb structural body can be accurately processed by the laser.

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: A laser strikes and aseptically heats or sterilizes the end of two flexible tube ends for connection. Tube holders are pushed toward each other to bring the tube ends into contact. A weld detector checks the characteristics of the weld. A laser optics assembly may be used to change the direction of the laser and focus the laser at the tube ends. In addition, a crimping device is used to compress a single flexible tube for disconnection. The laser strikes the compressed area. The crimping device continues to pinch the area and forms a seal in the tube. The tube is separated into two tube segments, each segment has a sealed end.