Abstract: An apparatus and processes for protecting an ultrasonic welding horn (504) during welding of polymeric composites, use a thin separator, or membrane (502) configured to transfer high-frequency acoustic vibrations while keeping the horn (504) isolated from molten workpiece material. Systems and methods for welding polymeric composites, use a conductive mechanical intermediary, reducing cycle time, compensating for any surface unevenness, and improving weld accuracy and connection strength.

Abstract: A cup-type container obtained by compression-forming a thermoplastic resin and including at least a flange portion, a body portion and a bottom portion, wherein a ratio (L/D) of the height of the container to the diameter of the opening is not less than 1.0, and if the direction of height of a test piece cut out from the body portion of the container is denoted by x and the circumferential direction thereof by y, a half-value width P at a half peak of a Miller index at a diffraction angle 2?=14.5° that represents the diffraction by the crystal plane (110), is in a range of 1.25 to 1.5 over the whole body portion in a peak intensity profile in the direction of height (x-direction) of a Debye's ring obtained by measuring the diffraction intensities by causing the X-rays to be incident on an x-y plane of the test piece at right angles thereto.

Abstract: An overlay applicator can include an overlay with a top side and a bottom side. The bottom side can include an adhesive agent configured to adhere to a screen of an electronic device. The overlay applicator can include an adhesive release liner. The adhesive release liner can include a top side and a bottom side. The top side of the adhesive release liner can be removably attached to the bottom side of the overlay. The adhesive release liner can be configured to protect the adhesive agent at the bottom side of the overlay from contaminants. The overlay applicator can include a protective film removably attached to the top side of the overlay. The overlay applicator can include an alignment tab. The alignment tab can include an alignment mechanism. The overlay applicator further can include a pull tab. The pull can include a wiper. Other embodiments are provided.

Abstract: A method for applying at least one ply onto a tool or an uncured composite layup disposed on the tool includes automatically controlling slidably removing at least one nonstick separator relative to the at least one ply positioned on the at least one nonstick separator to inhibit at least a portion of the at least one ply from adhering to the tool or uncured composite layup while applying a moving compressive force to an outer surface of the at least one ply relative to a moving trailing edge of the at least one nonstick separator to adhere at least a portion of the at least one ply to the tool or to the uncured composite layup.

Abstract: A system for applying a tin-tie, from a supply of tin-ties releaseably adhered along the length of a liner, with the tin-tie length generally aligned along a length of packaging moving in a first direction includes a tamp applicator for extending and retracting along a second direction substantially transverse to the first direction. The tamp applicator includes a magnet for carrying the tin-tie after it is released from the liner by a peeler, an air assist for aid in releasing and positioning the tin-tie, and a recess and edge for positioning the tin-tie. Part of the tamp applicator carrying the released tin-tie is also moveable in the same first direction, allowing travel in the same first direction as the moving packaging material when putting the tin-tie on the moving packaging material. A spring biases the part to return in a third direction opposite the first direction.

Abstract: A process for production of a multilayer film that comprises a step in which an adhesive layer formed on a temporary base is situated along the lengthwise direction of the temporary base at a prescribed spacing and cut in such a manner that the plurality of sections which are to serve as adhesive films are partitioned from the other sections, and a step in which the adhesive films on the temporary base are moved onto a support film at a prescribed spacing along the lengthwise direction of the support film. The spacing between the adjacent adhesive films on the temporary base is different from the spacing between the adjacent adhesive films on the support film.

Abstract: The invention relates to a method for manufacturing a label laminate. The method includes forming at least one water based adhesive layer on a belt, drying said at least one water based adhesive layer on the belt, unwinding a first material layer, unwinding a second material layer, attaching said at least one dried water based adhesive layer to the surface of the first material layer, and laminating the first material layer comprising at least one water based adhesive layer together with the second material layer in order to form the label laminate. The invention also relates to a label laminate and to a system for manufacturing a label laminate.

Abstract: Provided is a labeling device for an automatic test-tube setting-up device wherein an identification label can be pasted over a product label with a simple structure.

Abstract: A tamp pad includes a housing that defines an air flow chamber having an inflow opening and an outflow opening. The tamp pad further includes an impact plate having one or more openings therethrough that are in fluid communication with the air flow chamber and an air flow generator fluidly coupled to the air flow chamber for generating an air flow in a first direction. The tamp pad has a valve system for directing the air flow generated by the air flow generator to draw air into the one or more openings to hold a label thereon and to blow air out of the one or more openings to eject the label from the impact plate.

Abstract: A process and a laminating device for producing a microfluidic device are proposed, wherein a film is pressed onto a carrier under the effect of heat and thereby attached to it. During the attachment the film is lifted by the blowing in of gas on the carrier side to prevent it adhering in a non-attachment region and is vented on the remote side. The device is compressed between a holder and a thermode of the laminating device during the lamination. An elastic intermediate layer is arranged in each case between the device and the holder and between the device and the thermode, for evening out the contact pressure and obtaining uniform attachment of the film to the carrier.

Abstract: A label dispensing device is disclosed for dispensing labels from a web that has a web path extending through the label dispensing device. The label dispensing device includes a dispensing member and a transition member. The dispensing member is shaped to effectuate a flexure of the web and includes a peel edge disposed along a portion of the web path. The transition member has a web control surface disposed along a portion of the web path. The web control surface is downstream of the peel edge and is configured to engage the first side of the web, thereby reducing the flexure of the web effectuated by the dispensing member.

Abstract: According to various embodiments, a film assembly may include a protective film, first and second removable opposing tabs, an adhesive, and a split release liner. The first and second opposing tabs may be configured to facilitate the alignment of the protective film with respect to a surface of a portable electronic device. Once aligned, a minority portion of the split release liner may be removed exposing a minority portion of the protective film coated with the adhesive. The minority portion of the protective film may then be adhered to the surface of the portable electronic device. Subsequently, the remaining sections of the split release liner may be removed and the protective film may be fully adhered to the surface of the portable electronic device. Once fully adhered, the first and second opposing tabs may be removed.

Abstract: An apparatus for supplying one or more strands of a relatively wide tape to a high-speed graphite tape laminating machine may include a tape supply reel and a backing paper take-up reel rotatably mounted on the machine, a dancer roller mounted on the machine for lateral movement thereon, and a mechanism for actively controlling the rotation of the tape supply and backing paper take-up reels and the lateral movement of the dancer roller relative to the support frame such that the respective tensions in the tapes are maintained substantially constant during both an on-the-fly tape add operation and an on-the-fly tape cut operation of the laminating machine.

Abstract: Various modifications to a printer to allow the printer to print on linerless adhesive media are described. In one embodiment, a release block is attached to the printer superior to a rubber drive roller. The release block limits the linerless adhesive media from contacting and/or remaining on the rubber drive roller when the linerless adhesive media is fed past print head. The release block may be a guide label, a piece of tape, or fixture. A guide label is adhesively attached and comprises a substrate, an adhesive layer, and release layers so that the linerless adhesive media does not stick to the guide label. Tape may be adhesively attached with a release layer attached to the tape. The fixture may be mechanically attached, magnetically attached, or adhesively attached to the printer. The release block may be removed at any time to allow for standard operation of the printer.

Abstract: A programmable machine and method for adhering a flexible photovoltaic film panel onto metal supplied from a roll for forming a combination solar and roof panel is provided. The voltaic film panels and metal to which is adhered are supplied on rolls which are fed from reels. The rollformer can form male and female edges on the metal which are necessary for a metal roof. The angle at which the exit cutter can cut is calculated by the programmable computer. A measuring device for measuring the roofing and transferring the data to the programmable machine or the placement of the solar film panels and the cutting of the panels is also provided.

Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).

Abstract: A welding device includes a heated wedge having a top surface and a bottom surface, the top and bottom surfaces each including a generally planar portion and a curved potion. The curved portions of the top and bottom surfaces meet at a point. A first pressure plate includes a generally planar contact surface that contacts and covers substantially the entire planar portion of the top surface. A second pressure plate includes a generally planar contact surface that contacts and covers substantially the entire planar portion of the bottom surface.

Abstract: A device for ideal cutting of an adhesive film mother sheet which prevents or reduces displacement or peeling of a cover film, etc. on an adhesive layer when the adhesive film mother sheet deforms as a result of shearing forces that act during cutting. The cutting device cuts the adhesive film mother sheet into strips while performing conveyance thereof and includes a cutter mechanism and heating mechanism. The cutter mechanism may include an upper blade unit wherein a plurality of upper blades are arranged axially and a lower blade unit wherein a plurality of lower blades are arranged axially. The heating mechanism is disposed upstream of the cutter mechanism and may include a blower, a heater, a temperature sensor, and/or a temperature control unit. The blower may be connected to the heater via a an air passage and be disposed so as to blow heated air onto the adhesive film mother sheet.

Abstract: The wafer table (31) for holding a wafer (20) having the back surface thereof supported by a mount frame (36) via a dicing film (3) and the front surface thereof with a surface protective film (11) attached thereon is described. A groove (60) is formed in the area of the table corresponding to at least a part of the outer periphery of the wafer. Further, the table includes a holding means (33) for holding the wafer to the front surface of the table and a suction means for suction of the air in the groove. Thus, the dicing film can be positively collapsed in the groove while at the same time being restored to the original position.

Abstract: An apparatus for film transfer includes at least one printing press and at least one transfer film supply roller, a transfer film guiding device for guiding the transfer film web from the transfer film supply roller to a transfer nip. In order to ensure a variable film transfer in different printing units of the printing press, up to now the transfer film supply roller is moved with a film module into the region of the desired printing unit. In order to make a variable film transfer possible without complicated moving, the guiding device has web guiding elements at least in the region of the at least one printing press and the web guiding elements are enabled to selectively guide the transfer film web to different positions on the at least one printing press, such as to possible potential transfer nips.

Abstract: A protection mechanism for dry film laminator includes a lower member, and an upper member located above the lower member. The upper member moves downwardly/upwardly relative to the lower member. The upper member has a plurality of through holes defined therein and extending therethrough. An air supply device communicates with the through holes for feeding air into the through holes. A film guide device is disposed above the upper member and includes a supply spool and a take-up spool disposed thereon. A continuous release film movably connected to the film guide device. The continuous release film which is wound on the supply spool is routed from the supply spool to flatly pass between the upper member and the lower member, and is sequentially collected by the take-up spool.

Abstract: A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.

Abstract: A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

Abstract: There are provided a cartridge to which a first roll around which a base tape with a plurality of RFID circuit elements arranged is wound can be detachably attached, an antenna for transmission/reception of information with the RFID circuit element, a signal processing circuit and a transmitting portion that generate access information to an IC circuit part of the RFID circuit element, transmit the information to the RFID circuit element and carry out information writing in the IC circuit part or information reading from the IC circuit part, a print head for printing on a cover film, and a control circuit provided with a determination portion that determines matching between parameter data provided at the cartridge and instruction data relating to the print input by an operation portion.

Abstract: Disclosed herein is a high release nip roll assembly comprising a nip roll with a covering comprising a high release material. The release properties of the nip roll material can permit intermittent contact without the coating adhering to the surface of the roller and wrapping the nip. Also disclosed is a high release nip roll belt is made of a high release material on the top and bottom surfaces of the belt. The belt can be positioned at each end of a nip roll so that areas of the nip roll typically vulnerable to molten thermoplastic material contact are protected by a belt. Also disclosed is a belt making apparatus. Also disclosed is a frame assembly for moving a belt longitudinally along a nip roll. Also disclosed is a rope guide assembly for threading a belt in relation to a nip roll and at least at least one belt roller.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

Abstract: In a device for joining strips of wipe materials originating from at least two stacks of packaged materials, a first stack of wipe material which is in use and being used up and a spare stack of wipe material are joined to each other by a joining member placed on an exposed fold of the spare stack to face an exposed fold of the first stack. The joining member includes a component which can be detached after placing the stacks of material one on top of the other and protrudes so that it can be identified and grasped. The joining member includes an adhesive-coated part which is either protected by the detachable component or is in adhesive contact with the exposed fold of the first stack when the detachable component has been removed due to force of gravity pressing the spare stack onto the first stack.

Abstract: There is provided a printing device 12 that performs printing on each of first and second labels L1, L2 on the way of feeding out a raw strip sheet M, which is temporarily stuck with a first label L1 and a second label L2 having a smaller plane area than that of the first label on a release liner S, a peel plate 27 that peels off the first and second labels L1, L2 from the release liner S, first and second label suction plates 30, 31 that hold the respective peeled labels L1, L2, and a laminating device 17 that laminates the first and second labels L1, L2 with the adhesive layer of the second label L2 facing the adhesive layer of the first label L1. The adhesive layer of the first label L1 laminated with the second label L2 is exposed in a closed loop manner in an outer peripheral area all around the second label L2.

Abstract: The invention relates to a method for sticking, a container, a pocket tape, a method for the production of a pocket tape, a device for the production of a pocket tape, a method for the production of an adhesive tape, an adhesive tape and a device for the production of an adhesive tape. The invention is characterised in that adhesive zones are spaced from one another by non-adhesive zones.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit 11 provided with a supporting face for a semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.

Abstract: A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

Abstract: A machine for applying pressure sensitive sample chips to a card includes a linear conveyor for receiving and transporting cards, and at least one sample application station disposed along the conveyor. The sample application station includes a feed roller overlying and spaced from the conveyor for holding a spool containing at least one row of individual pressure sensitive sample chips on a substrate. A plate has an edge immediately overlying and spaced from the conveyor to permit passage of cards beneath the edge. A drive roller is spaced from the feed roller and from the plate for drawing the substrate from the spool on the feed roller over the plate edge to separate the sample chips from the substrate and apply the chips to the cards. A resilient roller preferably is disposed adjacent to the plate edge for pressing the sample chips removed from the substrate onto the cards transported on the conveyor.

Abstract: A first printing device 12 that performs the printing on a first label L1, a second printing device 18 that performs the printing on a second label L2, and a laminating section 20 that laminates these labels one another and discharges the same therefrom and a sticking device 21 that sticks the first and second labels L1 and L2 to an object W. An unprinted surface of the second label L2 is attached to an adhesive layer A of the first label L1 and a printed surface of the second label L2 is positioned between the object W and the same to be hidden.

Abstract: An apparatus for film transfer includes at least one printing press and at least one transfer film supply roller, a transfer film guiding device for guiding the transfer film web from the transfer film supply roller to a transfer nip. In order to ensure a variable film transfer in different printing units of the printing press, up to now the transfer film supply roller is moved with a film module into the region of the desired printing unit. In order to make a variable film transfer possible without complicated moving, the guiding device has web guiding elements at least in the region of the at least one printing press and the web guiding elements are enabled to selectively guide the transfer film web to different positions on the at least one printing press.

Abstract: There is disclosed a method of producing a solar cell module comprising the steps of: mounting a body to be laminated onto a tabular member, carrying in the body to be laminated along with the tabular member onto a heated mounting board; heat-bonding the body to be laminated by pressing with an expanding unit; carrying out the body to be laminated along with the tabular member from the mounting board after parting the expanding unit from the body to be laminated; and separating the body to be laminated from the tabular member. By using the method, a temperature of the body to be laminated does not increase rapidly and a foaming phenomenon is suppressed, thereby allowing manufacturing of the solar cell module with a high yield.

Abstract: A continuous flow of a lineal object such as wire, banding or twine is tagged with the device of this invention with an adhesive-backed tag that is folded around the lineal object as it passes underneath and thru the device.

Abstract: An apparatus for making SMC comprising a conveyor belt assembly having a feed end and a transfer end. The conveyor belt assembly including a belt having an outer surface and an inner surface. A cutting support structure disposed between the feed end and the transfer end, and in contact with the inner surface. A cutting wheel having a perimeter surface and disposed adjacent to the cutting support structure. A feed tension member proximate the outer surface and disposed between the feed end and the cutting wheel. The feed tension member positions the fiber rovings onto the outer surface to be cut by the cutting wheel. The feed tension member, cutting wheel and belt cooperate to feed the fiber rovings at a feed rate, cut the fiber rovings into a plurality of parallel discontinuous fibers, and convey the fibers at substantially the same rate as the feed rate.

Abstract: This invention generally pertains to self propagating high temperature synthesis or combustion synthesis as a way of bonding materials. The present invention provides methods and an apparatus for bonding, preferably carbon-carbon composite materials, by combustion synthesis. Generally, the invention involves providing at least two carbon-carbon composite parts to be bonded and interspersing a combustion synthesis material in between the parts with each part in contact with the combustion synthesis material. The combustion synthesis material is then ignited, which initiates the combustion synthesis reaction. Typically, a ceramic material is formed which immediately freezes, bonding the parts together.

Abstract: An apparatus and method for laminating personalized cards, which includes a frame that supports a supply spindle for delivering a patch film disposed on a web to a personalized card. The frame supports a platen structure for affixing a portion of the patch film to a portion of one side of the personalized card when the supply spindle delivers the patch film to the personalized card. The frame supports a take-up spindle for receiving the web after the patch film has been delivered to the personalized card. The frame supports a lamination assembly for laminating the entire patch film to the entire side of the personalized card after the personalized card has had the patch partially affixed thereto.

Abstract: A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.

Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).

Abstract: A printer with a peeler mechanism 1 for peeling labels from a web, the printer having a movable web pressure roller 24 which may be moved from a web pressure position 24A in which pressure is applied to a platen roller 20 to a retracted position 24B in which pressure is not applied. The printer also has a photosensor 21 and photoreceptor having an emitter/receptor surface 21a for detecting the presence and absence of labels peeled from the web. A window 22b in the label guide surface 22a becomes covered to shield the photosensor output for defining a no-label detection stateWhether the peeler mechanism is set to operate in the label peeling mode or is set to a retracted position defining a non-peeling continuous label dispensing mode of operation can be determined based on the output of the label detection photosensor 21, and the label dispensing mode can be set to the label peeling mode or continuous label dispensing mode based on this determination.

Abstract: The present invention provides a system and method for peeling off a adhesive seal for sealing a evacuation hole in the cover of a hard disk drive without damaging the seal in the fabrication and manufacture of hard disk drives. In one embodiment, a seal peel-off device having a upper presser plate and a lower liner base plate are respectively aligned at the top and bottom of a targeted adhesive seal to be peeled-off from a seal template having a number of adhesive seals and by applying pressure to the upper presser plate of the seal peel-off device, the targeted adhesive seal is removed without any damages.

Abstract: A continuous flow of a lineal object such as wire, banding or twine is tagged with the device of this invention with an adhesive-backed tag that is folded around the lineal object as it passes underneath and thru the device.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: The invention relates to an apparatus for separating a protective tape joined to a semiconductor wafer. Before joining a separation tape to a protective tape on a surface of a semiconductor wafer held, from its back side, by a ring frame via a dicing tape while pressing the separation tape against the protective tape with the use of an edge member, pure water is dropped from a piston nozzle onto the back side of the dicing tape located in front of a joining start end of the separation tape.

Abstract: A sheet laminator includes a bonding unit and a restricting unit. The bonding unit bonds a first sheet to a second sheet that includes an adhesive layer. The restricting unit restricts movement of any one of the first sheet and the second sheet thereby preventing bonding between the first sheet and the second sheet before the first sheet and the second sheet reach the bonding unit.

Abstract: The present invention relates to an ultraviolet light-curable polymer resin-impregnated fibre composite sheet. In some embodiments, the composite sheet comprises polymer resins mixed with glass fibre to form polymer resin-impregnated glass fibre composites. The invention extends to methods of preparing the polymer composite, and to various applications thereof, and also to an apparatus suitable for the manufacture of the polymer composite.

Abstract: An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.