Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: There is provided a method for disassembling a bonded structure obtained by bonding a first base member and a second base member to each other via a bonding film mainly made of a compound having a branched polyorganosiloxane skeleton having a structural unit expressed by a following general formula (1) at a terminal portion, a structural unit expressed by a following general formula (2) at a linking portion, and a structural unit expressed by a following general formula (3) at a branched portion: In the formulas, each R independently represents a non-substituted hydrocarbon group; each Z independently represents a hydroxyl group or a hydrolytic group; each X represents a siloxane residue; a represents 0 or an integer of 1 to 3; b represents 0 or an integer of 1 or 2; and c represents 0 or 1.

Abstract: A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend.

Abstract: Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with: a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer, the connection release means being made to work in a temperature range from 0 to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.

Abstract: To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for detaching a first substrate and a second substrate bonded together by a pressure-sensitive adhesive film comprising a pressure-sensitive adhesive polymer having dispersed therein a thermally decomposable metal hydroxide or metal salt hydrate filler, the method comprising a step of heating the pressure-sensitive adhesive film to a temperature capable of causing decomposition and dehydration of the metal hydroxide or metal salt hydrate, thereby accelerating the detachment.

Abstract: Temperature switchable adhesives formed by combining a pressure sensitive adhesive, which does not exhibit temperature switchable properties, with a crystallizable oil are described. These temperature switchable adhesives exhibit a sharp reduction in peel strength when the temperature is raised above the switching temperature. The adhesive properties of these adhesives may be readily tuned by adjusting the ratio of the elastomer, tackifier, and the crystallizable oil, and by choosing different crystallizable oils. The temperature switchable adhesives have use in medical, consumer, and industrial applications.

Abstract: A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.

Abstract: A method of dismantling a plasma display device including a plasma display panel unit produced by bonding a plasma display panel to a support member through a bonding member, where the bonding member of the plasma display device unit is heated when the plasma display panel is peeled off from the support member, in a state in which either one of the plasma display panel and the support member is fixed and the other is undergoing an urging force in a direction such that the plasma display panel is peeled off from the support member.

Abstract: An image removing method including heating a recording material having thereon an image to a temperature so that the image has a plasticity; pressure-contacting an uppermost stream peeling member with the recording material while the image maintains a plasticity; separating the uppermost stream peeling member from the recording material to transfer at least a portion of the image to the uppermost stream peeling member; and repeating the heating, pressure-contacting and separating steps at least one more time using at least one downstream peeling member, wherein the uppermost stream peeling member has a first outermost layer which does not have a plasticity when being pressure-contacted with the recording material, and at least one of the at least one downstream peeling member has a second outermost layer which has a plasticity when being pressure-contacted with the recording material.