Abstract: The present invention relates to a blowing means unit and a hot foil stamping and die-cutting device. The blowing means unit fora hot foil stamping device, comprising: a blowing means having a blowing part configured to inject a gas stream to a location of foil material to separate foil and a supporting part for supporting the blowing part; supporting means supporting the blowing means; and lifting means connected to the supporting means for moving the blowing means between a first position and a second position, in the first position, the blowing part of the blowing means is at a working level, and in the second position, the blowing means is at a non-working level to give access to an operation area.

Abstract: A film-removing mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a base, a blowing member coupled to the base, and a holding assembly positioned adjacent to the blowing member. The base can be configured to support the workpiece. The blowing member defining an air outlet can be configured to communicate with an external air resource. The holding assembly can include a supporting member positioned adjacent to the base and a driving member coupled to the supporting member. The supporting member can correspond to the air outlet and the driving member can be configured to connect to the external mechanical arm.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.

Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: Apparatuses useful in printing, fixing devices and methods of stripping media from surfaces in apparatuses useful in printing are provided. An exemplary embodiment of an apparatus useful in printing includes a first member including a first surface; at least one heating element for heating the first surface of the first member; a second member including a second surface forming a nip with the first surface, the nip including an inlet end at which a substrate enters the nip and an outlet end at which the substrate exits from the nip; and an air knife disposed downstream from the outlet end of the nip and extending along an axial direction of the first member, the air knife including a first end, a second end opposite to the first end and a plurality of axially-spaced nozzles disposed between the first end and second end; and at least one gas inlet through which gas is supplied to the air knife.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: A method for removing a protective coating material from a portion of an optical fiber including a glass optical fiber having an outer surface surrounded by said protective coating material, said method comprising the steps of: (i) providing a fiber collection and support device having: (a) a coarse conical fiber collector having an input port and (b) a fine fiber centering collector including a fiber tube having an output port, said input port is larger then said output port; (ii) providing the fiber threaded through the course conical collector into the fiber collection tube of the fine fiber centering collector; (iii) contacting the fiber, as it exits from the output port of the fiber collection tube of the fiber collection and support device, with a stream of hot gas; and (iv) directing a stream of a hot gas onto the protective coating material that is to be removed.

Abstract: A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

Abstract: An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.