Abstract: A method for transferring a useful layer from a donor substrate to a carrier substrate comprises: a) providing the donor substrate, the donor substrate including a buried weakened plane; b) providing the carrier substrate; c) joining the donor substrate to the carrier substrate to form a bonded structure; and d) annealing the bonded structure in order to increase the level of weakening of the buried weakened plane. A predetermined stress is applied to the buried weakened plane during the annealing for a period of time, the predetermined stress being selected so as to initiate the splitting wave once a given level of weakening has been reached. At the end of the period of time, the given level of weakening having been reached, the predetermined stress causes initiation and self-sustained propagation of the splitting wave along the buried weakened plane, resulting in the useful layer being transferred to the carrier substrate.

Abstract: A printer includes: a body with a set of interior walls defining a media enclosure configured to receive a media cartridge, and a latch recess in one of the interior walls, including a retaining surface, and a ramp surface; a lid rotatably coupled to the body and movable between open and closed positions; and a latch movably supported by the lid between a locked position and an unlocked position, the latch including: a bias member biasing the latch towards the locked position, a hook surface configured to engage the retaining surface when the lid is closed and the latch is in the locked position, and a cam surface configured via the bias member, when the lid is closed and the latch is released to the unlocked position, to slide against the ramp surface and lift the lid to an intermediate position between the open and closed positions.

Abstract: A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

Abstract: An example disclosed printer configured to peel media from a backing, the printer having a peeler assembly that is engageable between a peeling position, wherein the printer is configured to peel the media from the backing, and a non-peeling position, wherein the printer is not configured to peel the media from the backing. The printer further including a sensor configured to send a signal corresponding to a position of the peeler assembly. The printer further including a communication interface configured to receive the position of the peeler assembly from the sensor and configured to transmit the position of the peeler assembly to a secondary component.

Abstract: Electrical cables and methods of forming such cables are disclosed, comprising a layer of a two dimensional material. In some embodiments, the cable is a subsea cable. In other embodiments, the cable may be an overhead power cable or a cable for forming electrical windings in a motor, generator or transformer. In some embodiments, the cable comprises a conductive core for carrying an electric current, and the layer of two dimensional material is disposed on the conductive core. In some embodiments, the subsea cable is a subsea power cable, umbilical cable or telecommunications cable. In some embodiments, the two dimensional material is configured to be superconducting or near-superconducting.

Abstract: An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.

Abstract: A film peeling apparatus that peels a film attached to a substrate includes a chamber, a transfer unit, and first peeling rollers. The transfer unit is disposed in the chamber to transfer the substrate. The first peeling rollers are disposed in the chamber, each of the first peeling rollers includes a first electrostatic chuck to adsorb a first film attached to the substrate. The first peeling rollers roll the adsorbed first film to peel the first film from the substrate.

Abstract: A device for removing a protective film off a sheet such as tickets or the like is described. The device has at least one removal or scraping roll of the protective film and at least one drawing or pulling roll of the sheet opposite the scraping roll and between which the sheet passes. The device also has a base and a roll unit mobile or removable with respect to the base and including the scraping roll and the drawing roll.

Abstract: The present disclosure relates to a graphene roll-to-roll transfer method, a graphene roll-to-roll transfer apparatus, a graphene roll manufactured by the graphene roll-to-roll transfer method, and uses thereof.

Abstract: A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.

Abstract: An apparatus for removal of the liner of a self-adhesive balancing weight is disclosed. A stripper wheel or stripper belt is rotated in close proximity over the surface of a balancing weight, and interacting with the liner and pulling the liner off from the balancing weight by means of a plurality of teeth. The speed of the stripper wheel or stripper belt is slightly higher than the speed of motion of the balancing weight.

Abstract: A method and an apparatus for peeling a donor film from a substrate are disclosed. In one embodiment, the donor film peeling apparatus includes i) a first roller disposed on a side of the donor film, ii) a second roller disposed on a side of the support at a position corresponding to the first roller and iii) first and second grippers configured to withdraw the donor film and support, respectively. The apparatus may further include i) first and second peeling rollers engaged with the first and second rollers with the donor film and support withdrawn by the first and second grippers being interposed therebetween to support the withdrawn donor film and support, respectively, and ii) an insertion mechanism disposed in at least one of the first and second peeling rollers and inserted between the bonded donor film and support.

Abstract: A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.

Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module.

Abstract: The present invention describes a dispenser of protective covers for the sole of a shoe. The sole covers are disposed on a sheet that is placed within the dispenser. The dispenser comprises a series of roller supports that are adapted to position the sheet of solve covers onto an exposed platform. A user steps the exposed platform in order to apply the cover to the user's footwear and remove the sole cover from the sheet. The top of the sole cover includes an adhesive that enables the cover to adhere to the sole of the user's shoe, thereby enabling a user to walk around the house while reducing the likelihood that the user would spread dirt therein.

Abstract: A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

Abstract: The embodiment relates to a cover strip machine and process for removing a golf ball cover for recycling purposes. The cover strip machine may comprise four or more rotating gears. The process comprises heating a golf ball, distorting a golf ball, placing a golf ball in a cover strip machine to remove the cover, and separating gear pairs with a driver to remove the golf ball core.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.

Abstract: Apparatuses useful in printing, fixing devices and methods of stripping media from surfaces in apparatuses useful in printing are provided. An exemplary embodiment of an apparatus useful in printing includes a first member including a first surface; at least one heating element for heating the first surface of the first member; a second member including a second surface forming a nip with the first surface, the nip including an inlet end at which a substrate enters the nip and an outlet end at which the substrate exits from the nip; and an air knife disposed downstream from the outlet end of the nip and extending along an axial direction of the first member, the air knife including a first end, a second end opposite to the first end and a plurality of axially-spaced nozzles disposed between the first end and second end; and at least one gas inlet through which gas is supplied to the air knife.

Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.

Abstract: A device for removing a protective film off a sheet such as tickets or the like is described. The device has at least one removal or scraping roll of the protective film and at least one drawing or pulling roll of the sheet opposite the scraping roll and between which the sheet passes. The device also has a base and a roll unit mobile or removable with respect to the base and including the scraping roll and the drawing roll.

Abstract: A method and an apparatus for peeling a donor film from a substrate are disclosed. In one embodiment, the donor film peeling apparatus includes i) a first roller disposed on a side of the donor film, ii) a second roller disposed on a side of the support at a position corresponding to the first roller and iii) first and second grippers configured to withdraw the donor film and support, respectively. The apparatus may further include i) first and second peeling rollers engaged with the first and second rollers with the donor film and support withdrawn by the first and second grippers being interposed therebetween to support the withdrawn donor film and support, respectively, and ii) an insertion mechanism disposed in at least one of the first and second peeling rollers and inserted between the bonded donor film and support.

Abstract: A method and apparatus for application of pavement markers to a roadway or surface that provides for mechanical separation of paper backer from the adhesive surface of the markers. A pair of motor driven drums, having two barb bands, drives the markers through the apparatus and grasps and separates the paper backer from the markers.

Abstract: A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.

Abstract: An apparatus for stripping metal from a cathode plate, the apparatus comprising stripping means adapted for positioning between the metal and the cathode plate in order to separate the metal from the cathode plate, and wherein movement of the stripping means is achieved through movement of a robotic arm.

Abstract: Methods and apparatus are described for removing donor sheets from substrates. A take-up roller contacts the donor element at or near an edge thereof and a peel roller contacts the donor element at a location spaced apart from the edge. A securing mechanism secures the edge of the donor element to the take-up roller which is then moved away from the substrate. While maintaining the peel roller in contact with the donor element, the take-up roller is rotated to take up the donor element while the peel roller and take-up roller are both simultaneously moved in a direction tangential to the substrate. In this manner, the donor element is peeled from the surface of the substrate.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate.

Abstract: An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper.

Abstract: An apparatus for stripping metal from a cathode plate in which part of the metal has been separated from the cathode plate to form a gap between the part of the metal and the cathode plate, the apparatus comprising at least one roller for positioning in the gap between the metal and the cathode plate and drive means for driving the roller along the cathode plate or the metal to cause stripping of the metal from the cathode plate.