Semiconductive Product Delaminating (e.g., Delaminating Semiconductive Wafer From Underlayer, Etc.) Patents (Class 156/930)
  • Patent number: 9011638
    Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 21, 2015
    Assignee: Epistar Corporation
    Inventors: Chen-Ke Hsu, Liang Sheng Chi, Chun-Chang Chen, Win-Jim Su, Hsu-Cheng Lin, Mei-Ling Tsai, Yi Lung Liu, Chen Ou
  • Patent number: 8999107
    Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Patent number: 8997821
    Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: April 7, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Osamu Hirakawa
  • Patent number: 8999108
    Abstract: In the separation of a cover tape 15e from a carrier tape 15 performed by a cover tape separating mechanism 50, a cover tape 15e, which is separated from a base tape 15a by a separating blade edge 51f, comes into contact with a concave conical surface 52c, so that one side portion of a cover tape 15e is bent toward the other side portion; and the bent cover tape 15e is pressed against a guide surface 32s from below while the carrier tape 15 is guided to a pick-up position. Accordingly, the cover tape 15e is folded on the base tape 15a in a flat shape.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: April 7, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8992726
    Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Koso Matsuno, Michirou Yoshino, Masayuki Takahashi, Tooru Furushige, Yuji Yamamoto
  • Patent number: 8986496
    Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: March 24, 2015
    Assignee: EV Group GmbH
    Inventors: Friedrich Paul Lindner, Jurgen Burggraf
  • Patent number: 8986497
    Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: March 24, 2015
    Assignee: IPG Photonics Corporation
    Inventors: Jeffrey P. Sercel, Marco Mendes, Jie Fu
  • Patent number: 8955730
    Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: February 17, 2015
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8945344
    Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: February 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai
  • Patent number: 8939188
    Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: January 27, 2015
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chung W. Ho, Chih-Hsien Cheng
  • Patent number: 8931674
    Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: January 13, 2015
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8919412
    Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: December 30, 2014
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
  • Patent number: 8905111
    Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: December 9, 2014
    Assignee: EV Group GmbH
    Inventor: Erich Thallner
  • Patent number: 8852391
    Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: October 7, 2014
    Assignee: Brewer Science Inc.
    Inventors: Jeremy W. McCutcheon, Robert D. Brown
  • Patent number: 8845859
    Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: September 30, 2014
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Michael John Ries, Jeffrey L. Libbert, Dale A. Witte
  • Patent number: 8835282
    Abstract: A method for forming a multi-material thin film includes providing a multi-material donor substrate comprising single crystal silicon and an overlying film comprising GaN. Energetic particles are introduced through a surface of the multi-material donor substrate to a selected depth within the single crystal silicon. The method includes providing energy to a selected region of the donor substrate to initiate a controlled cleaving action in the donor substrate. Then, a cleaving action is made using a propagating cleave front to free a multi-material film from a remaining portion of the donor substrate, the multi-material film comprising single crystal silicon and the overlying film.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: September 16, 2014
    Assignee: Silicon Genesis Corporation
    Inventors: Francois J. Henley, Nathan Cheung
  • Patent number: 8807189
    Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: August 19, 2014
    Assignee: Empire Technology Development LLC
    Inventor: Mark Meloni
  • Patent number: 8800631
    Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: August 12, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuki Noda, Masaru Iwasawa
  • Patent number: 8764935
    Abstract: In a structure that exfoliation is performed in the pitch sending of a carrier tape (15) by making a cover tape exfoliating mechanism (50) intervene between joining surfaces of a base tape (15a) and a cover tape (15e), in an exfoliation start position where an exfoliating knife tip (51f) of an acuminate shape, which is provided at a front end, starts to exfoliate the joining surface, a lower guide member (40), which guides the carrier tape (15) from below, is pushed up from the bottom side by a lever member (44), and when the carrier tape (15) is installed, the carrier tape (15) is pushed up together with the lower guide member (40) to make the exfoliating knife tip (51f) in the exfoliation start position to be aligned to the joining surfaces and enter between the joining surfaces.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: July 1, 2014
    Assignee: Panasonic Corporation
    Inventors: Yutaka Kinoshita, Kazuhide Nagao, Nobuhiro Nakai
  • Patent number: 8758553
    Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jens A. Riege, Steve Canale, David J. Zapp
  • Patent number: 8758552
    Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Steve Canale, David J. Zapp, Daniel E. Sanchez, Hung V. Phan, Hyong Y. Lee
  • Patent number: 8715458
    Abstract: A method of operation of a micro device feeder system includes: adjusting a distance between a movable drive plate and a mounting plate for aligning a carrier tape carrying a micro device to a center line for pick-up of the micro device by external device handling equipment; and configuring a tape handling mechanism, having a sprocket assembly, to accommodate a predetermined width of the carrier tape.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: May 6, 2014
    Assignee: Data I/O Corporation
    Inventor: Rossen Atanassov Rachkov
  • Patent number: 8715459
    Abstract: A positioning mechanism, which determines the relative position of a carrier tape 15 in a tape feed direction by fitting alignment pins 37 to feed holes 15d in a lower member 31, and a cover tape separating mechanism 50, which is provided on an upper member 32 and exposes electronic components 16 stored in component pockets 15b by separating a cover tape 15e from a base tape 15, are provided at non-interference positions that do not interfere with each other when the upper member 32 is closed to the lower member 31. Accordingly, when the cover tape 15e is separated from the carrier tape 15, the carrier tape 15 is aligned with the guide section 30.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 6, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuhide Nagao, Nobuhiro Nakai, Yutaka Kinoshita
  • Patent number: 8679280
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 25, 2014
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, Matthew Farinelli, John Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang
  • Patent number: 8657994
    Abstract: An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: February 25, 2014
    Assignee: Alta Devices, Inc.
    Inventors: Brian Burrows, Brian Brown, Thomas Gmitter, Gang He
  • Patent number: 8603294
    Abstract: Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: December 10, 2013
    Assignee: EV Group GmbH
    Inventor: Erich Thallner
  • Patent number: 8574662
    Abstract: A substrate section for a flexible display device is disclosed. The substrate section prevents adhesion loss between a reinforcing layer and a barrier layer, thereby preventing a peel-off phenomenon between an inorganic barrier layer and a reinforcing layer.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: November 5, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventor: Dong-Beom Lee
  • Patent number: 8551291
    Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: October 8, 2013
    Assignee: Suss Microtec Lithography, GmbH
    Inventor: Gregory George
  • Patent number: 8443864
    Abstract: Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: May 21, 2013
    Assignee: EV Group GmbH
    Inventor: Erich Thallner
  • Patent number: 8419895
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Patent number: 8388782
    Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, John Knickerbocker, Aparna Prahbakar, Peter J. Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Patent number: 8366874
    Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: February 5, 2013
    Assignee: Empire Technology Development LLC
    Inventor: Mark Meloni
  • Patent number: 8366873
    Abstract: A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: February 5, 2013
    Assignee: SUSS MICROTEC LITHOGRAPHY, GmbH
    Inventor: Gregory George
  • Patent number: 8333869
    Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: December 18, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Koki Tamura, Takahiro Asai, Atsushi Kubo, Hirofumi Imai, Takahiro Yoshioka
  • Patent number: 8298365
    Abstract: A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: October 30, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hirofumi Imai, Koki Tamura, Takahiro Asai, Takahiro Yoshioka, Yoshihiro Inao
  • Patent number: 8297331
    Abstract: A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: October 30, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yoshihiro Inao, Akihiko Nakamura, Yasumasa Iwata
  • Patent number: 8267143
    Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: September 18, 2012
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Gregory George, Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles
  • Patent number: 8226796
    Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: July 24, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yau Sun Fan, Wai Shing Ho, Hiu Leung Tse, Yee Fan Yeung, Ka On Yue
  • Patent number: 8186410
    Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10).
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: May 29, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Junichi Katsuragawa, Atsushi Miyanari, Yoshihiro Inao, Yasumasa Iwata
  • Patent number: 8181688
    Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: May 22, 2012
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kuhnle
  • Patent number: 8171977
    Abstract: A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: May 8, 2012
    Assignee: Lintec Corporation
    Inventor: Kenji Kobayashi
  • Patent number: 8038839
    Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: October 18, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuki Noda, Masaru Iwasawa
  • Patent number: 8038824
    Abstract: A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 18, 2011
    Assignee: Lintec Corporation
    Inventors: Kenji Kobayashi, Takahisa Yoshioka, Takeshi Takano
  • Patent number: 8012307
    Abstract: A separating device for separating an electronic main body from a substrate bonded thereto comprises a platform, a conveying section, a dissolving section, a cleaning section, and a first partition plate. The conveying section is disposed on the platform for moving the electronic main body and the substrate forward. The dissolving section is disposed on the platform for spraying a solvent onto the bonded electronic main body and substrate. The cleaning section is also disposed on the platform for cleaning the electronic main body. The first partition plate is located between the dissolving section and the cleaning section and has at least one first slot, which allows only the electronic main body but not the substrate to pass therethrough, so that the electronic main body is separated from the substrate at the first partition plate. A method for separating the electronic main body and the substrate is also provided.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: September 6, 2011
    Assignee: Asia IC Mic-Process, Inc.
    Inventors: Yuan-Hsin Li, Chiu-Feng Yang
  • Publication number: 20110139375
    Abstract: An adhesive tape joined to a wafer is irradiated with ultraviolet rays via diodes. Simultaneously, a heater heats the adhesive tape to a preset temperature. Consequently, an ultraviolet reaction with the diodes and an infrared reaction with the heater may ensure promotion of a polymerization reaction, which results in cure of an adhesive that is not curable with only ultraviolet rays. As a result, an adhesive force of the adhesion tape may sufficiently be reduced. After ultraviolet irradiation via the diodes and heating with the heater, a separation mechanism separates the adhesive tape from the wafer. Therefore, accurate separation may be realized of the adhesive tape joined to the wafer.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 16, 2011
    Inventors: Masayuki Yamamoto, Masaru Irie