Always Out Of Direct Contact With Each Other Patents (Class 165/104.14)
  • Patent number: 10883768
    Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: January 5, 2021
    Assignee: COOLER MASTER CO. LTD.
    Inventor: Jen-Chih Cheng
  • Patent number: 10867888
    Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: December 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser, Gerald Weidinger, Alexander Kasper, Gernot Grober
  • Patent number: 10855144
    Abstract: An electrical winding topology having a core and a plurality of windings is provided. The plurality of windings is operatively coupled to the core, where at least one of the plurality of windings includes an evaporator section and a condenser section. Further, at least a portion of one or more of the plurality of windings includes heat pipes.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: December 1, 2020
    Assignee: General Electric Company
    Inventors: Karthik Kumar Bodla, Samir Armando Salamah
  • Patent number: 10793297
    Abstract: A passive thermal system for use in a satellite and other aerospace applications includes a container having a heat-pipe working fluid disposed in a first chamber and a Phase Change Material (PCM) disposed in a second chamber that substantially surrounds the first chamber. The first chamber contains a wick for transporting the heat-pipe working fluid. The exterior of the first chamber has fins, etc., that extend into the PCM for heat spreading and increased interface area.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 6, 2020
    Assignee: WORLDVU SATELLITES LIMITED
    Inventors: Alexander D. Smith, Daniel W. Field, Armen Askijian, James Grossman
  • Patent number: 10782079
    Abstract: A three-dimensional pulsating heat pipe includes a pipe member and a connecting member. The pipe member is coiled around an axis to form a plurality of loop portions, and the loop portions are arranged in order along the axis so as to form a three-dimensional coiled structure. The three-dimensional coiled structure has a heat receiving section, and the pipe member has different effective pipe cross-sectional areas on two opposite sides adjacent to the heat receiving section. The connecting member is connected to two ends of the pipe member, such that the connecting member and the pipe member together form a closed loop.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: September 22, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Yung Tseng, Kai-Shing Yang, Shih-Kuo Wu
  • Patent number: 10766594
    Abstract: A vehicle body may have an internal skeleton, and a skin fabricated in-situ over the internal skeleton. The skin may include a matrix material, and a plurality of continuous fibers encased within the matrix material. The plurality of continuous fibers may include at least one electrically conductive wire interwoven with others of the plurality of continuous fibers. The at least one electrically conductive wire may be configured to function as at least one of a heater and a strain gauge.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: September 8, 2020
    Assignee: Continuous Composites Inc.
    Inventors: Kenneth L. Tyler, Ryan C. Stockett
  • Patent number: 10766595
    Abstract: A vehicle body may have an internal skeleton forming a wing shape and a fuselage shape, and a skin fabricated in-situ over the internal skeleton. The skin may include a matrix material, and a plurality of continuous fibers at least partially coated with the matrix material. The plurality of continuous fibers may extend from the wing shape over the fuselage shape.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: September 8, 2020
    Assignee: Continuous Composites Inc.
    Inventors: Ryan C Stockett, Kenneth L. Tyler
  • Patent number: 10751683
    Abstract: A reactor, which includes a reactor body and two reactor ends sealing the ends of the reactor body, a plurality of reactor tubes extending inside the reactor body at least partially between the reactor ends, and at least one heat pipe disposed inside at least one of the reactor tubes.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: August 25, 2020
    Assignee: UNISA
    Inventors: David Glasser, Xiaojun Lu, Diane Hildebrandt
  • Patent number: 10730645
    Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: August 4, 2020
    Assignee: THE BOEING COMPANY
    Inventors: Eric S. Mindock, James H. Mabe, Frederick Theodore Calkins, Abraham Naroll Gissen, Miguel A. Estevez
  • Patent number: 10665526
    Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 26, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser, Gerald Weidinger, Alexander Kasper, Gernot Grober
  • Patent number: 10544993
    Abstract: A cooling device including: a base block having a first length and a first thickness and having a mounting side on which a heat-generating body is installed along a first vertical direction. The cooling device further includes a pipe unit, including a tank buried at an opposite side to the mounting side of the base block for storing a coolant, and pipes which are connected to the tank and are parallel to one another. Heat radiation fins are disposed on the pipes in a state in which the pipes penetrate the heat radiation fins. The cooling device in which the tank is formed has a flattened shape and a smaller dimension along a first thickness direction of the base block than a height dimension along the first length of the block. Each of the pipes are connected to an upper position of the tank with respect to the height dimension.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: January 28, 2020
    Assignee: MITSUBISHI ALUMINUM CO., LTD.
    Inventors: Hiroshi Takemura, Yasuhito Sueki, Shun-ichi Sata, Tokio Hisano
  • Patent number: 10543434
    Abstract: The system and method spatially predict the condensation of water and acid from the flue gas in the condensing heat exchanger installed in fossil power plant flue gas treatment system or similar environment. By modifying the operational conditions, the heat exchanger can control rates and areas of condensations. The system and method adjust either the cooling water temperature or the flowrate ratio of flue gas to cooling water to control the condensation rates of water or acids. The system and method also estimate actual coverage areas to apply for anti-corrosive coating onto the tube or duct surfaces to resist corrosion due to acid condensation. The system and method also optimize or customize condensation rates of water and acids in boiler flue gas under operating conditions given at a power plant.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: January 28, 2020
    Assignee: Arkansas State University—Jonesboro
    Inventor: Kwangkook Jeong
  • Patent number: 10533811
    Abstract: A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: January 14, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronis (QinHuangDao) Co., Ltd.
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho
  • Patent number: 10516194
    Abstract: A thermally managed electrical supply unit is provided. The unit contains an energy unit comprising a battery or a battery pack; a casing of a porous thermally conductive framework comprising a phase change material on at least one surface of the energy unit; at least one heat flux rectifier unit on the thermally conductive framework casing; wherein a surface of the heat flux rectifier opposite to the PF/PCM casing is subject to cooling. Also provided is a method for thermal management of an energy unit comprising absorption of heat from the energy unit within a phase change material, transfer of the heat energy from the phase change material through a heat flux rectifier and removal of the heat transferred across the heat flux rectifier. The flow of heat across the heat flux rectifier is irreversible and the heat flux rectifier acts as an on/off switch to control the heat flow.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: December 24, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Ercan Mehmet Dede
  • Patent number: 10473408
    Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 12, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Jay W. Kokas, Leo J. Veilleux, Jr., Rudolph Thomas Beaupre
  • Patent number: 10455735
    Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: October 22, 2019
    Assignee: Coolanyp, LLC
    Inventor: Peng Cheng
  • Patent number: 10442968
    Abstract: Provided is a latent heat transfer material that is micro-encapsulated, said material exhibiting superior mechanical strength and heat resistance. A production method for the latent heat transfer material that is micro-encapsulated in a hard shell comprises: 1) a step in which a perforate hollow silica particle is manufactured; 2) a step in which the phase change material is sealed inside the perforate hollow silica particle by inserting the perforate hollow silica particle in a molten solution of the phase change material and repeatedly subjecting the same to vibrations such as ultrasound oscillations; 3) a step in which the perforate hollow silica particle having the phase change material sealed within is washed in a saturated aqueous solution of the phase change material; and 4) a step in which perhydropolysilazane is used to coat the outer shell of the perforate hollow silica particle with silica.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: October 15, 2019
    Assignee: National University Corporation Kobe University
    Inventors: Hiroshi Suzuki, Yoshiyuki Komoda, Ruri Hidema
  • Patent number: 10392135
    Abstract: A passive thermal system for use in satellites includes a solid radiator panel with a plurality of heat pipes attached to a surface thereof. In addition to their heat transporting capability, the heat pipes strengthen the radiator panel to which they are coupled. In some embodiments, the heat pipes are structurally modified to increase their area moment of inertia.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 27, 2019
    Assignee: WorldVu Satellites Limited
    Inventors: Alexander D. Smith, Daniel W. Field, Armen Askijian, James Grossman
  • Patent number: 10381771
    Abstract: A connector assembly includes a socket connector and a plug connector. The socket connector includes a main body having a tongue; multiple mating terminals having multiple first contact portions; a shell surrounding the tongue to form an accommodating cavity; and a first thermal conduction member. The first contact portions are exposed from at least one first surface of the tongue and are arranged in a left-right direction. The first thermal conduction member has a first mating portion accommodated in the accommodating cavity, and the first mating portion and the tongue are provided at intervals in the left-right direction. The plug connector includes a circuit board; a chip, provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member having a second mating portion and a conducting portion thermally conducted with the chip.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: August 13, 2019
    Assignee: LOTES CO., LTD.
    Inventors: Ted Ju, Chin Chi Lin
  • Patent number: 10352625
    Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: July 16, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 10309348
    Abstract: A motor vehicle heat exchanger system includes a closed circuit for a working medium and an evaporator for evaporation of the working medium. The evaporator includes at least two evaporator cassettes having an exhaust gas channel formed between the evaporator cassettes. Each evaporator cassette includes a capillary structure and a liquid side and a vapor side. A medium feed is provided on the liquid side for liquid working medium. Each evaporator cassette includes a vapor collector.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: June 4, 2019
    Assignee: Benteler Automobiltechnik GmbH
    Inventors: Felix Rubitschek, Sven Przybylski, Tobias Düpmeier
  • Patent number: 10220725
    Abstract: A system and method are provided for passively cooling an inverter subsystem within an enclosure. The method and system absorb heat generated by an inverter subsystem within an enclosure through a first heat spreader. The first heat spreader is thermally coupled to in the inverter subsystem and a first interior surface of the enclosure. The system and method transfer a portion of the heat from the first heat spreader to a second heat spreader through a plurality of heat pipes. The plurality of heat pipes are thermally coupled to the first heat spreader and the second heat spreader. The system and method further thermally couple the second heat spreader to a second interior surface of the enclosure.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: March 5, 2019
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Brian Magann Rush, Joo Han Kim
  • Patent number: 10221498
    Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: March 5, 2019
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Andrew J. Pascall, Hannah Grace Coe, Julie A. Jackson, Susant K. Patra
  • Patent number: 10206308
    Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: February 12, 2019
    Assignee: NERDALIZE B.V.
    Inventors: Mathijs De Meijer, Remy Van Rooijen, Marinus Schoute, Thomas De Jong, Boaz Samuel Leupe, Florian Jacob Schneider
  • Patent number: 10184731
    Abstract: A domestic boiler preheater includes a flue box having a combustion gas inlet to receive hot combustion gas from a boiler, and a combustion air inlet to receive air for combustion in a boiler. The preheater further includes a condenser having a mains cold water inlet and a mains water outlet arranged such that mains water flows through the condenser prior to being supplied to a boiler combustion chamber. The condenser further includes a central heating water return and a central heating water flow outlet arranged such that central heating water flows through the condenser prior to being supplied to the boiler combustion chamber. The condenser further includes connections that enable the condenser to be connected to preheated fluid supply pipework from a source of preheated fluid, the preheated fluid having fluid heated by heat from at least one of the combustion gas and a renewable energy source.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: January 22, 2019
    Inventor: Luke Chamberlain
  • Patent number: 10162382
    Abstract: Methods, apparatus, systems are disclosed for using a movable heat sink to cool an electrical device during an ejection cycle of the electrical device from a dock. In accord with these concepts, the heat sink is moved from a first position, not in contact with the electrical device, to a second position in physical contact with the electrical device to conduct heat from the electronic device prior to an ejection of an electronic device from the dock.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: December 25, 2018
    Assignee: Intel Corporation
    Inventor: Nishi Yoshi Yoshifumi
  • Patent number: 10154748
    Abstract: The invention concerns a regeneration household machine (10) for regenerating packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portions of food. The machine (10) comprises at least one compartment (16, 18) adapted to receive, preferably when it is empty, at least one packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portion of food to be regenerated and at least one conduct (65, 65b, 65c, 68a, 69, 69a, 69b) for feeding a heating fluid into said at least one compartment (16, 18), heating means (72) being provided at said at least one conduct in order to heat said heating fluid at a desired temperature depending on the recipe of the food of said at least one packaged cooked and subsequently cooled to chilled, ambient or frozen temperatures portion of food.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: December 18, 2018
    Assignee: Nutresia SA
    Inventor: Jonathan Pennella
  • Patent number: 10136551
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 20, 2018
    Assignee: Asetek Danmark A/S
    Inventor: Steven B. Branton
  • Patent number: 10119770
    Abstract: A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 6, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Hiroshi Sakai, Tatsuro Miura, Yoshikatsu Inagaki
  • Patent number: 10080263
    Abstract: A cooking appliance includes at least one housing assembly and at least one cooking chamber formed in the housing assembly. The at least one cooking chamber includes at least one loading opening. At least one cooking chamber door closes the at least one loading opening. The at least one cooking chamber door includes at least one frame assembly and at least one window assembly. The at least one frame assembly includes a plurality of edges, with at least one contact face at each of the edges on a side of the at least one cooking chamber door that faces the at least one cooking chamber when the at least one cooking chamber door is closed. At least one of the contact faces is an at least one extended contact face that is significantly larger than the remaining contact faces with respect to at least one geometric dimension.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: September 18, 2018
    Assignee: MIELE & CIE. KG
    Inventors: Ruediger Hoehn, Timo Lippert, Carolin Kaudewitz, Micha Reifert
  • Patent number: 10034487
    Abstract: A method and apparatus for producing popping candy which is formed in molds. A reactor with one or more trays holds the product and one or more moveable transmission mechanisms and one or more lids provided at each end of the reactor act as inlets and outlets. One or more two way valves regulate and maintain inside pressure of the reactor and cooling and heating mechanisms are provided.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: July 31, 2018
    Inventor: Tolga Erden
  • Patent number: 10012454
    Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: July 3, 2018
    Assignees: Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho
  • Patent number: 9995537
    Abstract: The purpose of this invention is to provide a sheet-shaped heat pipe that makes it possible to reduce a pressure loss caused by a vapor flow or a pressure loss caused by a working fluid flow to improve the maximum amount of heat to be transported and reduce thermal resistance by increasing the cross-sectional area of a vapor flow passage or a fluid flow passage, which has been limited by the length of a container in a height direction. A heat pipe (20) is provided with a protruding portion (24) so that the height of the wick-occupied portion (23) serving as the fluid flow passage is larger than the height of the space portion (22) serving as the vapor flow passage.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 12, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirofumi Aoki, Masami Ikeda, Yoshikatsu Inagaki
  • Patent number: 9962622
    Abstract: An object is to provide a highly-efficient evaporator capable of effectively avoiding reduction in steam generation efficiency due to the Leidenfrost phenomenon while maintaining a heating surface in a heating chamber for steam generation in a high-temperature region to be subjected to the influence of the Leidenfrost phenomenon by not reducing heating power required for heating the inside of the heating chamber from outside or not heat-insulating the heating chamber. To achieve this object, a sleeve-like sheet made of foamed nickel is disposed as a foamed member 64 containing metal as a principal component near a heating surface 69 and along an entire periphery of the heating surface 69 in a heating chamber 68 formed inside a pipe body 67 to be heated from the outside in such a manner as to contact the heating surface 69. While water supplied to the inside of the sleeve-like sheet passes through this inside, the water is diffused to permeate the surrounding sleeve-like sheet.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: May 8, 2018
    Assignee: SUMITOMO PRECISION PRODUCTS CO., LTD.
    Inventor: Makoto Hirakawa
  • Patent number: 9953771
    Abstract: A heat dissipation apparatus, system and method for an air circuit breaker (ACB) switchgear has at least one pair of primary contact toes constructed and arranged to connect to a terminal of the circuit breaker. A bus bar joint is connected to the primary contact toes. The heat dissipation apparatus comprises an evaporator clamped to the primary contact toes. A condenser is located at a higher elevation than the evaporator and at least two electrically isolating pipes fluidly connect the evaporator with the condenser. A dielectric fluid in the evaporator can be heated to a vapor state, with one of the pipes transferring the vapor to the condenser and the second pipe returning the condensed dielectric fluid back to the evaporator for cooling the at least one pair of primary contact toes.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: April 24, 2018
    Assignee: Anord Control Systems Limited
    Inventor: Patrick Kennelly
  • Patent number: 9939205
    Abstract: A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: April 10, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu, Xiao-Min Zhang
  • Patent number: 9939170
    Abstract: The rapid thermal cycling of a material is targeted. A microfluidic heat exchanger with an internal porous medium is coupled to tanks containing cold fluid and hot fluid. Fluid flows alternately from the cold tank and the hot tank into the porous medium, cooling and heating samples contained in the microfluidic heat exchanger's sample wells. A valve may be coupled to the tanks and a pump, and switching the position of the valve may switch the source and direction of fluid flowing through the porous medium. A controller may control the switching of valve positions based on the temperature of the samples and determined temperature thresholds. A sample tray for containing samples to be thermally cycled may be used in conjunction with the thermal cycling system. A surface or internal electrical heater may aid in heating the samples, or may replace the necessity for the hot tank.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: April 10, 2018
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Neil Reginald Beer, William J. Benett, James M. Frank, Joshua R. Deotte, Christopher Spadaccini
  • Patent number: 9936608
    Abstract: Production of a heat absorption device comprising a first face intended to be in contact with a hot source and a second face opposite to the first face, a network of cells filled with a first phase change material being arranged between the first face, a passage between cells being filled with at least one second phase change material different from the first phase change material.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: April 3, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Ulrich Soupremanien, Emmanuel Ollier
  • Patent number: 9930811
    Abstract: An apparatus includes an enclosure defining an interior space and includes a server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a set of one or more dampers that are contiguous to natural air outside of the room and that are opened up when a temperature outside reaches a threshold value.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: March 27, 2018
    Assignee: Excalibur IP, LLC
    Inventors: Scott Noteboom, Albert Dell Robison, Jesus Suarez, Norman Holt
  • Patent number: 9908643
    Abstract: A passive thermal system for use in aerospace vehicles includes a first passive thermal panel having at least one internal resident heat pipe, wherein the first passive thermal panel is further configured to provide an embedded interface between a portion of the resident heat pipe and at least one heat pipe extending from a neighboring passive thermal panel. The embedded interface is facilitated via an internal channel that is adjacent to the internal resident heat pipe. The channel is dimensioned and arranged to receive a portion of a heat pipe extending from a passive thermal panel that will be situated adjacent to the first passive thermal panel. The embedded interface is also facilitated by an arrangement that imparts a compressive force to the non-resident heat pipe that urges it against the resident heat pipe.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 6, 2018
    Assignee: WorldVu Satellites Limited
    Inventors: Alexander D. Smith, Armen Askijian, Daniel W. Field, James Grossman
  • Patent number: 9902931
    Abstract: A culture apparatus is provided which can suppress condensation on walls of a culture space and the like to suppress adverse effects on a culture material. In the culture apparatus having a culture space formed in a heat insulating box main body, a humidification water reservoir for humidifying the culture space is disposed in the heat insulating box main body. A heat transfer condensation member in which a condensation portion at one end and a cooling portion at the other end are integrated is disposed such that the cooling portion is disposed outside the heat insulating box main body, while the condensation portion is disposed inside the culture space. The condensation portion is disposed so that condensed water on the surface thereof is led into the humidification water reservoir.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: February 27, 2018
    Assignee: PANASONIC HEALTHCARE HOLDINGS CO., LTD.
    Inventors: Tomoyoshi Tokumaru, Masahiko Kobayashi
  • Patent number: 9907206
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: February 27, 2018
    Assignee: Asetek Danmark A/S
    Inventor: Steven B. Branton
  • Patent number: 9897393
    Abstract: The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 20, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 9874708
    Abstract: An optical module blind mating heat relay system, comprising a linecard comprising a circuit board; a heat relay apparatus comprising a first heat pipe on the circuit board, a radiator attached to the circuit board and in thermal contact with the first heat pipe; a heat relay receiver assembly comprising a receiver housing having a slot and a contact slug connected to the receiver housing and in thermal contact with the first heat pipe; a pluggable optical module removably engaged with the linecard; and a second heat pipe having a pluggable optical module portion contacting the pluggable optical module and having a plug portion removably positioned within the slot of the receiver housing, the plug portion in thermal contact with the contact slug, the second heat pipe removable from the receiver housing while the linecard is receiving electrical power.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: January 23, 2018
    Assignee: Infinera Corporation
    Inventor: Matthew James Kelty
  • Patent number: 9863716
    Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: January 9, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Jay W Kokas, Leo J Veilleux, Jr., Rudolph Thomas Beaupre
  • Patent number: 9858753
    Abstract: Techniques for reducing electromagnetic (EM) emission in a wager-based gaming machine. A gaming machine includes one or more processors configured to generate a bus clock signal having a fundamental frequency and fundamental spectral components at harmonics of the fundamental frequency. The fundamental spectral components each have a fundamental amplitude. A signal processor is configured to generate a spread spectrum clock signal having a nominal frequency substantially equivalent to the fundamental frequency of the bus clock signal as well as nominal spectral components at harmonics of the nominal frequency. However, the nominal spectral components each have a nominal amplitude less than the fundamental amplitude of a fundamental spectral component at the same harmonic. A bus connects the signal processor with one or more elements and carries the spread spectrum clock signal to the one or more elements, thereby reducing EM emissions from the bus.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 2, 2018
    Assignee: IGT
    Inventors: Calvin DeCoursey, Gene E. Powell
  • Patent number: 9746249
    Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: August 29, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sung-Wei Lee
  • Patent number: 9746248
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: August 29, 2017
    Assignee: Thermal Corp.
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Patent number: 9721869
    Abstract: The heat sink structure includes a vapor chamber, a heat pipe, and capillary elements. The vapor chamber includes a housing, a first capillary structure covering inside the housing, and a first working fluid filled inside the housing. The housing includes through holes and an inner top wall. Both ends of the heat pipe are inserted through the two through holes respectively and are exposed from the housing. The heat pipe includes a pipe body, a second capillary structure covering inside the pipe body, and a second working fluid filled inside the pipe body. Each of the capillary elements is connected to the inner top wall. One end of each of the capillary elements is in contact with the first capillary structure, and the other end of each of the capillary elements is in thermal contact with the heat pipe.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: August 1, 2017
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Chien-Hung Sun
  • Patent number: 9715241
    Abstract: A wireless system for monitoring and control of the temperature of a product in transport includes a controller system wirelessly connected to a temperature system and a valve control system. The temperature system measures the current temperature of the product and wirelessly transmits the temperature information to the controller system. The valve control system controls the position of a valve allowing heated fluid to move through the product, heating the product. The controller system allows an operator to input a high temperature limit and low temperature limit and alarm, and using the current temperature of the product, wirelessly signals the valve control system to open or close the valve in order to keep the temperature of the product between the high temperature limit and low temperature limit. The controller system monitors and records the product temperature, high and low temperature limits and alarms, and provides a report of the data.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: July 25, 2017
    Assignee: Knappco Corporation
    Inventor: Claude W. Mixon