Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

Abstract: A drying device includes an air/air heat exchanger and an air/refrigerant heat exchanger. The air refrigerant heat exchanger includes a phase change material.

Abstract: The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.

Abstract: Improved systems, methods, apparatus and compositions for generating, extracting and distributing the renewable heat energy produced by microbial decomposition of organic biomass within a contained and controlled environment. This heat energy is preferably transferred and distributed, preferably by the use of heat pipes, to the interior of a greenhouse or other structure to be heated, either directly or via heat exchange apparatus such as hot water heating systems. In one embodiment heat transfer and distribution mechanism customized to the application requirements of a greenhouse heating batch-type process is disclosed, along with a recipe for a readily available biomass material composition. Additional continuous and batch process embodiments of biomass heating systems are also disclosed that extract heat energy from decomposing biomass for heating uses.

Abstract: A control system for providing thermal management of electronic equipment housed in a cabinet enclosure. The system can include a plurality of sensors in proximity to the cabinet enclosure for monitoring a temperature, a pressure and a humidity associated with the electronic equipment; and a controller in communication with the sensors for receiving data from the sensors, where the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment.

Abstract: A drying device includes an air/air heat exchanger and an air/refrigerant heat exchanger. The air refrigerant heat exchanger includes a phase change material.

Abstract: A modular electronic cooling system with moving parts, composed of a base unit and individual modules inserted into this base unit in respect to the expected upper limit of the heat load may utilize thermoelectric power generation and the heat load itself to allow for operation independent of any external power source. By the same mechanism the cooling system scales within a range automatically reacting to and dissipating a dynamic heat load via forced convection, and doing so passively, without the need for specific programming. This cooling system uses porous material or multi-layered mesh parts, thermoelectric components, a modular assembly system and independent enclosure parts for described porous material or multi-layered mesh, an electronics control system that may be passively activated, and a motor assembly. Altogether the system provides maximum efficiency in terms of form factor.

Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.

Abstract: This invention relates generally to the treatment of NOx in combustion flue gas. In certain embodiments, the invention relates to the use of a regenerative heat exchanger (RHE) to convert urea to ammonia in a side stream of flue gas. Ammonia and/or other urea decomposition products exit the heat exchanger, are mixed with the rest of the flue gas, and enter a selective catalytic reduction (SCR) unit for reduction of NOx in the flue gas. The use of an RHE significantly improves the thermal efficiency of the overall process. More particularly, in certain embodiments, the regenerative heat exchanger is a dual chamber RHE.

Abstract: A cooling device includes a boiling chamber containing working fluid therein. The chamber includes a bottom wall for contacting with a heat generating component and a cover hermetically connected with the bottom wall. The cover includes a top wall and a bulge formed at a periphery thereof. The bulge includes a pair of spaced side walls, one of the side walls connecting with the top wall and the other of the side walls connecting with the bottom wall. A buffering region is formed between the side walls, which is capable of absorbing agitation wave generated by boiling fluid to thereby allow the boiling fluid to be capabling of continuously and stably contacting with and exchanging heat from the top wall of the boiling chamber when the fluid boils. A heat sink is arranged on the cover of the boiling chamber for transferring heat from the boiling chamber to environment.

Abstract: The invention relates to a food cooking installation comprising numerous cooking tanks which are used to receive the food items to be cooked; means of loading/unloading the food items into/from said cooking tanks; and means of conveying, driving and storing liquids, which are used to connect a heated liquid container, a cooled liquid container and a piped water delivery point with the aforementioned cooking tanks. In this way, the tanks can be filled and emptied independently and the food items contained therein can be subjected to successive baths for different periods of time and at different temperatures, at least one of the baths being a cooking bath and the other a cooling bath. According to the Invention, each of the aforementioned cooking tanks comprises at least one lateral opening which is equipped with impervious sealing means and which is used to load/unload the food items using the above-mentioned loading/unloading means.

Abstract: The conducting type inter-piping fluid thermal energy transfer device of the present invention is that a thermal conducting structure is installed between the thermal conductive casing of first piping having at least one fluid inlet and at least one fluid outlet for passing through supply water flow and the thermal conductive casing of second piping having at least one fluid inlet and one fluid outlet for passing through thermal conducting fluid.

Abstract: A heating apparatus 1 includes a shell 2, a primary heat exchanger (sensible heat exchanger) 3, a burner (combustion means) 5, and a fan 6. A secondary heat exchanger (latent heat exchanger) 7 has a plurality of heat receiving tubes 18 arranged in parallel between a pair of headers 16 and 17, the heat receiving tubes 18 being fixed to tube plates 20. The heat receiving tubes 18 are bare tubes without fins and are arranged across flow of combustion gas. The number of the tubes 18 arranged vertically is less than the number of the tubes 18 arranged horizontally.

Abstract: A liquid cooling device (10) includes a heat sink (12), a reservoir (14) distant from the heat sink, a duct (16) connecting with the reservoir, a flexible tube (18) connected to the duct and the heat sink, and a heat-transfer member (19) in the liquid cooling device. The liquid cooling device is filled with liquid therein. The heat-transfer member is a heat pipe including an evaporating segment (192) fixed to the heat sink and a condensing segment (194) extending freely in the reservoir.

Abstract: A method, dedicated to the fabrication of the panels having built-in heat pipe(s) and/or insert(s) (P), consists in a) providing a bottom plate (SI) comprising, in selected places on either side of the heat pipe or insert accommodation zones, tabs (L) which are substantially flat and suitable for being straightened above its upper face, b) partially straightening the tabs (L) toward the accommodation zones, c) positioning the heat pipes and/or the inserts (C1, C2) in each accommodation zone between the tabs (L) and in contact with the upper face of the bottom plate (SI), d) terminating the straightening of the tabs (L) so that they are pressed against the side faces of the heat pipes and/or inserts (Ci), e) depositing a selected thickness of a first adhesive against the side faces of the heat pipes and/or the inserts (Ci), f) positioning separating structures (N1-N3), substantially having the same height as that of the heat pipes and/or the inserts (C1, C2) on either side of the side faces of each heat pipe a

Abstract: A system and a method for heating two buildings using geothermal energy comprises pumping a heat transfer liquid through conduits located in a water filled well and then passing the heat transfer liquid through floor conduits located in a first building, subsequently pumping the heat transfer liquid through a reservoir and then back to the well, pumping a second heat transfer liquid through a compressor and using the warm side of the compressor to heat a second building, the second heat transfer liquid being passed through a serpentine arrangement in the reservoir. The first building is normally an outbuilding and the second building is a residence.

Abstract: A heat sink includes a heat-transfer container incorporating a flow path through which a cooling fluid flows, for cooling a heating element in contact with the heat-transfer container The flow path includes a first cross-sectional portion that becomes narrower as the distance between a given point in the flow path and a side of the heat-transfer container which makes contact with the heating element becomes longer in a direction perpendicular to the direction in which the cooling fluid flows, and a second cross-sectional portion that is approximately constant in the direction perpendicular to the direction in which the cooling fluid flows. The first cross-sectional portion and the second cross-sectional portion alternately continue in the direction in which the cooling fluid flows causing a three-dimensional flow so the heat-transfer properties are enhanced with a simplified structure.

Abstract: A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the horizontal axis toward a remote housing including remote condensing fingers extending downwardly from and perpendicular to the horizontal axis. The remote condensing fingers are disposed circumferentially about a remote axis extending vertically through the remote housing. The tube interconnects the primary housing and the remote housing and is flexible to facilitate movement of the housings relative to one another.

Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.

Abstract: The heat exchange assembly (1) for exchanging heat between a first and a second fluid comprises: a plurality of heat exchange modules (12) for exchanging heat between the first and second fluids, these being distributed about a central axis (X) and having opposing respective lateral faces (47); feed manifolds (14, 16) for feeding the modules (12) with primary and secondary fluid and collection manifolds (18, 20) for removing these fluids. At least some of the said manifolds (14, 16) or parts of the said manifolds (18) run between the modules (12), the said manifolds (14, 16) or parts of manifolds (18) flanking one and the same module (12) being positioned substantially symmetrically with respect to the mid-plane situated between the two lateral faces (47) of the said module (12) in such a way that the said manifolds (14, 16) or parts of manifolds (18) create substantially identical thermal stresses in the lateral faces (47) of the module (12).

Abstract: A multi-fluid heat exchanger assembly Is provided that integrates multiple and distinct heat exchanger systems into a single, integrated system or housing utilizing a common header. Any combination of techniques as described may be utilized for optimizing exchanger performance according to the particular fluids being cooled. The heat exchanger assembly can be optimized by utilizing a pair of opposed headers having a first set of openings and a tube core arranged according to a first configuration and a second set of openings and a tube core arranged according to a second configuration and wherein the first and second configurations are different from one another. The heat exchanger assembly can also be optimized through different tube core/fin joining techniques for each of the distinct heat exchanger systems. Another technique for optimizing the heat exchanger assembly is through the use of differing core depths for each of the distinct heat exchanger systems.

Abstract: The invention provides a method and apparatus for integrating the tube side streams in a plurality of plate fin and tube or finned tube exchangers to accomplish more efficient heat transfer or a more compact design.

Abstract: The liquid galley refrigeration system for cooling food carts for aircraft employs an intermediate working fluid to transfer heat from one or more food carts to one or more remote chillers, allowing the carts and chillers to be advantageously distributed in the aircraft. A plurality of heat exchanges effect a cooling of the carts wherein heat from the food cart is first transferred to a first airflow; heat from the first airflow is then transferred to an intermediate working fluid that is circulated between a location immediately adjacent the food carts and a remote chiller; heat from the intermediate working fluid is subsequently transferred to the chiller working fluid; and finally, heat from the chiller working fluid is expelled. While the chiller working fluid undergoes a phase change in order to transfer heat from the intermediate working fluid to the cooling air, the intermediate working fluid remains in its liquid phase throughout its circulation.

Abstract: A composite panel provides structural strength and rigidity for modular assembly of spacecraft while serving the dual purposes of structure and heat transfer for thermal management of an environment for equipment, such as a spacecraft. Instruments, gimbals, surveillance, imaging, detectors, and the like may be mounted in a spacecraft designed and constructed from standard panels to provide the structural and heat transfer requirements to support the onboard equipment. Extremely small temperature differentials required by the panels support a substantially isothermal perimeter for the structure, able to sink heat from any location on a panel, transport it to a rejection site, and reject it to the cold environment of space, thus easing the task of design and packaging of instrumentation and infrastructure of satellites and other spacecraft.

Abstract: Disclosed is a hot water supplying apparatus which has a dual pipe capable of transferring heat energy of hot water, which is heated by heat of combustion of a burner and flows in pipe of a heat exchanger, to an inner pipe in which cold water is introduced, thereby inhibiting the condensation of moisture so as to prevent the corrosion of parts in the hot water supplying apparatus. The hot water supplying apparatus, comprises: a burner for supplying heat; a water inlet pipe for supplying cold water; a heat exchanging pipe formed with a dual pipe including an outer pipe for directly receiving combustion heat of the burner, and an inner pipe formed in the outer pipe, for allowing the cold water, which is introduced through the water inlet pipe, to be heated while passing through the inner pipe; and a water outlet pipe for discharging the heated water from the heat exchanging pipe.

Abstract: A cooling mechanism comprises a heat pipe coupled to a water block.

Abstract: An electronic device includes a cabinet, a first heat generating member, a second heat generating member, a fan unit, a first heat pipe and a second heat pipe. The first and second heat pipes are each formed by sealing an operation fluid which shifts its phase between gas and liquid into a pipe-like main body. In the second position, the first end portion of the first heat pipe is located at a position lower than that of the second end portion and the one end portion of the second heat pipe is located at a position higher than that of the other end portion. The second heat pipe includes a conveying mechanism that conveys the operation fluid in liquid phase from the other end portion to the one end portion.

Abstract: To improve a heat exchange efficiency of a heat sink without enlarging the heat sink. The heat sink of the invention comprises a heat receiving base receiving heat from an exothermic element, a plurality of fins radiating heat arranged radially around the heat receiving base at predetermined intervals, and one or more heat pipe(s) comprising a curved portion. One of end portions of the curved portion is individually connected to a predetermined portion of the heat receiving base, and a predetermined region of the curved portion is contacted with the fins in a heat transferable manner.

Abstract: An electronic assembly incorporates a sealed chamber that is filled with a first cooling fluid. A second cooling fluid that does not contact the first cooling fluid is circulated so as to remove heat from the first cooling fluid. The second cooling fluid is transported to an external heat removal system. Fluid circulation apparatus circulates the first cooling fluid within the chamber and facilitates heat transfer from components in the chamber. Optionally, the second cooling fluid may provide power to circulate the first cooling fluid.

Abstract: A double pipe heat exchanger that can be produced easily and can be used as a part of piping by bending the whole body, wherein an inner pipe is configured so that: a plurality of balloon-shaped bulges communicating with one another and extending from the center toward the radial directions in a cross section orthogonal to the axis line thereof may be formed; the outer circumference of the bulges may be bent into the shape of waves in an axial cross section; and the top portions of the waves may touch the inner surface of an outer pipe. Then in the state, the whole body including the inner pipe and the outer pipe is bent by applying external force.

Abstract: An onboard hydrogen storage unit with heat transfer system for a hydrogen powered vehicle. The system includes a hydrogen storage vessel containing a hydrogen storage alloy configured to receive a stream of hydrogen and provide hydrogen for use in powering a vehicle. During refueling a cooling/heating loop is used to remove the heat of hydride formation from the hydrogen storage alloy and during operation of the vehicle the heating/cooling loop is used to supply heat to the hydrogen storage alloy to aid in hydrogen desorption.

Abstract: Electromagnetic components are provided with a heat exchange mechanism. For example, a fluid-cooled electromagnetic field-functioning device, such as a motor, generator, transformer, solenoid or relay, comprises one or more electrical conductors. A monolithic body of phase change material substantially encapsulates the conductors or an inductor. At least one liquid-tight coolant channel is also substantially encapsulated within the body of phase change material. The coolant channel may be part of a heat pipe or cold plate. The coolant channel may be made by molding a conduit into the body, using a “lost wax” molding process, or injecting gas into the molten phase change material while it is in the mold. The coolant channel may also be formed at the juncture between the body and a cover over the body.

Abstract: Electromagnetic components are provided with a heat exchange mechanism. For example, a fluid-cooled electromagnetic field-functioning device, such as a motor, generator, transformer, solenoid or relay, comprises one or more electrical conductors. A monolithic body of phase change material substantially encapsulates the conductors or an inductor. At least one liquid-tight coolant channel is also substantially encapsulated within the body of phase change material. The coolant channel may be part of a heat pipe or cold plate. The coolant channel may be made by molding a conduit into the body, using a “lost wax” molding process, or injecting gas into the molten phase change material while it is in the mold. The coolant channel may also be formed at the juncture between the body and a cover over the body.

Abstract: The inventive method includes the utilization of different phase change materials with different melting temperature ranges in each of the headliner (3), the seats (7), and the instrument panel (12) of an automobile in order to save energy while improving thermal comfort for the passengers. When used in the seats (7), the phase change material can be included in the seat heater system. Preferable phase change materials are alkyl hydrocarbons and mixtures thereof, salt-hydrates, metals, alloys, poly-alcohols, and eutectics with phase changes within the desired temperature ranges and with appropriate heat storage capacities. Preferably, the phase change materials are directly incorporated in a polymeric compound structure, in an elastomeric compound structure, or in a foam structure in order to enhance the overall thermal capacity.

Abstract: In a method for controlling the temperature of a first printing unit by way of a temperature control medium, the temperature control medium used is a dampening solution from a second printing unit.

Abstract: In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

Abstract: An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipation.

Abstract: A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.

Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at respective opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick structure (12) is arranged at an inner surface of the hollow metal casing. A sealed heat reservoir (20) is mounted on the evaporating section of the heat pipe to increase heat absorbing area of the heat pipe. The heat reservoir has working fluid and a capillary wick structure (22) therein. Heat generated by a heat source is first absorbed by the heat reservoir and then transferred to the evaporating section of the metal casing.

Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (C) and a condensing section (A) at opposite ends thereof, and an adiabatic section (B) located between the evaporating section and the condensing section. A capillary wick structure (12) is arranged at an inner surface of the hollow metal casing. Two sealed heat reservoirs (20, 21) are respectively mounted on the evaporating and condensing sections of the heat pipe for increasing heat absorbing and dissipation areas of the heat pipe.

Abstract: Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have a selected temperature of transformation that facilitates use of the apparatus to heat or cool a substance contacted by the apparatus.

Abstract: Improved systems, methods, apparatus and compositions for generating, extracting and distributing the renewable heat energy produced by microbial decomposition of organic biomass within a contained and controlled environment. This heat energy is preferably transferred and distributed, preferably by the use of heat pipes, to the interior of a greenhouse or other structure to be heated, either directly or via heat exchange apparatus such as hot water heating systems. In one embodiment heat transfer and distribution mechanism customized to the application requirements of a greenhouse heating batch-type process is disclosed, along with a recipe for a readily available biomass material composition that will slowly decompose while it generates a substantial quantity of usable heat energy to be consumed in the elevation of temperature in a separated greenhouse basement confinement area.

Abstract: A heat exchanger having an air/air heat exchanger, an air/refrigerant heat exchanger coupled to the air/air heat exchanger by a connecting tube, and a phase change material. The air/refrigerant heat exchanger having a series of stacked plates, such that the phase change material is contained within a first gap between one of the stacked plates and another of the stacked plates.

Abstract: A heat sink, method of making a heat sink, and a heat sink assembly. The heat sink includes a base and a plurality of heat pipes that extend from the base. The base is dimensioned and shaped to promote good thermal contact with the heat source, and the heat pipes are attached thereto in such a manner as to promote good thermal contact to the working fluid. Each heat pipe includes an outer surface and an inner surface that form a condenser portion from which from heat is transferred during condensation of the working fluid.

Abstract: A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plurality of fine pores 7 are formed, a branching section 5 provided on an upstream side of the fine pores 7 to supply a gaseous working fluid returned from a gas pipe 12 into each of the fine pores 7, and a collecting section 6 provided on a downstream side of the fine pores 7 to collect the working fluid condensed inside the fine pores 7 and then supply the same into a liquid pipe 9. The gas pipe 12 is connected to an upper portion of the branching section 5 and the liquid pipe 9 is connected to a lower portion of the collecting section 6.

Abstract: The present invention relates to a cooling device for an electron tube designated to amplify a high frequency signal. The invention is particularly suitable for cooling electron tubes that amplify radio frequency signals used for television or radio. The electron tube installed on a portal frame designed to hold the frame. The device includes a first hydraulic circuit inside which a first fluid circulates to cool at least part of the tube. The device also includes fluid exchanger to transfer heat transported by the first fluid to a second hydraulic circuit. The exchanger is also located on the portal frame.

Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.

Abstract: A body heating/cooling apparatus includes a vest having a front panel and a back panel defining a cavity therebetween. A flexible, continuous channel is disposed in serpentine fashion throughout the cavity and has adjacent portions. An inlet and an outlet are provided for infusing a fluid into the channel and for withdrawing the fluid from the channel. The adjacent portions of the channel are placed in fluid communication by passageways extending between corresponding adjacent portions at locations intermediate the ends of the adjacent portions. The passageways are configured with respect to the corresponding adjacent portions such that substantially all of a fluid flowing through the corresponding adjacent portions normally bypasses the passageways.

Abstract: A passive thermal control system maintains the operating temperature range of protected equipment within desired limits by controlling the conductive attributes of thermal interfaces and physical relationships within the system so as to achieve a desired thermal balance. In one embodiment, an integrated cell unit (100) includes a solar array (102), a Lithium ion cell (108) and an antenna assembly (114) such as a phased array antenna. In operation, a thermal gradient (116) is defined between the array (102) and the assembly (114) as the assembly (114) radiates heat from the array (102) into space. The operating temperature range of the cell (108) is controlled by appropriate design of the thermal interfaces between the cell (108) and the assembly (114) and/or interfaces within the assembly (114), such as a thermal interface associated with dielectric spacers provided between emitter pairs of the assembly (114).