Abstract: An apparatus configured for heat dissipation that includes a heat source, a heat sink and a heat conducting element. The heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that: a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus is provided.

Abstract: A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Abstract: Self-regulating thermal insulation includes one or more thermal actuators that expand and contract in response to changes in temperature adjacent the thermal insulation, thereby automatically changing the thermal resistance of the thermal insulation. In this manner, a self-regulating thermal insulation may be configured to locally adjust in response to local changes in temperature of a part being insulated, for example, during curing or some other manufacturing process. Such self-regulating thermal insulation may be configured to respond to temperature changes without feedback control systems, power, or human intervention.

Abstract: A satellite includes a satellite housing, a temperature sensitive component carried by the satellite housing, and a thermal radiator carried by the satellite housing. A thermal switch is movable between a coupled state and a decoupled state. In the coupled state, the temperature sensitive component and the thermal radiator are thermally coupled. In the decoupled state, the temperature sensitive component and the thermal radiator are thermally decoupled.

Abstract: A satellite includes a satellite housing, a temperature sensitive component carried by the satellite housing, and a thermal radiator carried by the satellite housing. A thermal switch is movable between a coupled state and a decoupled state. In the coupled state, the temperature sensitive component and the thermal radiator are thermally coupled. In the decoupled state, the temperature sensitive component and the thermal radiator are thermally decoupled.

Abstract: A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Abstract: Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

Abstract: The first and second media are coupled via evanescent waves generated by surface phonon polaritons thermally excited on surfaces of the first and second media. First and second media made of the same material are disposed with a gap formed between for cutting off thermal conduction and the heat transfer between them is performed via the thermally excited evanescent waves. A third medium is provided on a surface of the first medium on a side toward the second medium. Heat flux flows from the second medium to the first medium in a first state wherein the second medium has a first temperature TH and the first medium has a second temperature TL lower than the TH differ in intensity from heat flux which flows from the first to the second medium in a second state wherein the first medium has the TH and the second medium has the TL.

Abstract: An electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable casing containing a heat-conducting and electrically-insulating liquid, the device comprising a heat dissipation plate that is substantially parallel to the support and spaced apart therefrom, and heat exchange means for heat exchange by conduction between the casing and the plate, the heat-conducting and electrically-insulating liquid being selected and the casing being arranged so that thermal expansion of the oil leads to the casing applying force against the means for heat exchange by conduction.

Abstract: A method and system for selectively dissipating thermal energy are provided. The system includes a heat-generating structure, a first heat sink, a second heat sink, and a heat transfer element. The heat-generating structure generates thermal energy. The first heat sink is in thermal communication with the heat-generating structure. The heat transfer element is configured to be selectively positioned between the first heat sink and the second heat sink to establish a path for the transfer of thermal energy between the first heat sink and the second heat sink. Upon positioning the heat transfer element between the first heat sink and the second heat sink, at least a portion of the thermal energy from the heat-generating structure is allowed to travel through the first heat sink and through the heat transfer element to the second heat sink.

Abstract: Holder (1) for a sample to be cooled to a low temperature in a vacuum space, comprising a carrier body (2) for carrying the sample in thermal contact and contact means (3, 4, 5) for bringing the carrier body into thermal contact with a cooling body to be brought to the low temperature, wherein the contact means can be switched between a first mode, in which there is no thermal contact between the carrier body and the cooling body, and a second mode in which there is thermal contact between the carrier body and the cooling body, and a probe for inserting into a vacuum space in a refrigerator such a holder for a sample to be cooled to a low temperature in this vacuum space, and a refrigerator, in particular a 3He-4He dilution refrigerator, adapted to accommodate such a probe.

Abstract: Negative-stiffness-producing mechanisms can be incorporated with structural devices that are used on spacecraft that provide thermal coupling between a vibrating source and a vibration-sensitive object. Negative-stiffness-producing mechanisms can be associated with a flexible conductive link (FCL) or “thermal strap” or “cold strap” to reduce the positive stiffness of the FCL. The negative-stiffness-producing mechanism can be loaded so as to create negative stiffness that will reduce or negate the natural positive stiffness inherent with the FCL. The FCL will still be able to provide maximum thermal conductance while achieving low or near-zero stiffness to maximize structural decoupling.

Abstract: A device comprises equipment (101) with a heat source, a cold part (102) relative to the equipment, and a thermal conductor element (103) capable of conducting the heat from the equipment to the cold part. The element (103) is such that, under certain thermal conditions above a given thermal condition, the equipment and the cold part are essentially thermally isolated.

Abstract: A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.

Abstract: The adjustable heat exchanger provides precise control of oven temperature in a pyrolysis reaction. The heat exchanger includes two sets of hollow non-circular discs, the discs of a movable set being interleaved with the discs of a stationary set. A first working fluid circulates through a heat source oven and through the hollow stationary discs, and a second working fluid circulates through the hollow rotating discs and a pyrolysis oven. The two fluids do not mix with one another, but are always completely separate from one another. Heat transfer depends upon the relative surface area of the rotary discs interleaved between the stationary discs. Minimum heat transfer occurs when the rotary discs are rotated to a position clear of the stationary discs, and maximum heat transfer occurs when the rotary discs are completely interleaved with the stationary discs.

Abstract: Systems, methods and devices for utilizing an energy chassis device designed to sense, collect, store and distribute energy from where it is available using devices that harvest or convert energy to locations requiring energy such as but not limited to HVAC (heating, ventilation and cooling) systems. The systems, methods and devices can also be used with a next generation geothermal heat exchanger that achieves higher energy harvesting efficiency and provides greater functionality than current geothermal exchangers.

Abstract: Temperature control devices and methods are described. The described temperature control devices and methods comprise optical emission and detection assemblies and can be used in PCR and qPCR applications.

Abstract: A system, including a superconductive heat transfer assembly, including, a first superconductive heat transfer pipe, a second superconductive heat transfer pipe, and a superconductive heat transfer contact switch configured to open and close a gap between the first superconductive heat transfer pipe and the second superconductive heat transfer pipe.

Abstract: A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In the first position the first conduction body is spaced apart from the second conduction body, thermally isolating the heat source from the heat sink. In the second position the first conduction body thermally contacts the second conduction body, and conducts heat from the heat source, through the conduction bodies and into the heat sink. Related methods are also described.

Abstract: In one embodiment, a heat dissipating apparatus includes a chassis positionable within a housing of a downhole tool. The heat dissipating apparatus also includes a heat sink coupled to the chassis and a displacement mechanism coupled to the heat sink. The displacement mechanism is actuatable to move the heat sink, with respect to the chassis, between a first position and a second position such that in the first position the heat sink is radially retracted toward the chassis to form a gap between the heat sink and the housing and such that in the second position the heat sink is radially extended from the chassis to contact the housing.

Abstract: A temperature control apparatus, for radiating heat from a side door to a vehicle interior, includes components which are provided inside each of the vehicle body and side door, respectively. A heat source is disposed within a peripheral edge part of an opening in a vehicle body. A heat pipe is provided in the side door. When the door opening is closed by the side door, the heat source and heat pipe come into contact, and are thermally connected by a heat transmission mechanism.

Abstract: A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.

Abstract: A method of controlling thermal transfer between a first structure and a second structure includes sending a command signal to a thermal switch and actuating an electric motor in response to receiving the signal. The electric motor may move a first thermally conductive member toward and/or in contact with a second thermally conductive member. The first and second thermally conductive member may be in thermally conductive contact with respective ones of the first and second structure.

Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.

Abstract: This invention relates to the use of system thermal energy generated by equipment, such as an ultrasound sensing device, to transfer heat to the peripherals/sensors/probes under user control. This is accomplished by recycling the heat generated by the system and used that to keep the peripheral/sensor/probe warm.

Abstract: A device and method for dissipating heat from a source of heat is described. A plurality of layers of thermally conductive materials receives a flow of heat from a source of heat. A first layer of the plurality of layers receives the flow of heat from the source of heat and redirects and transfers the flow of heat to a second of the plurality of layers. Each layer has a separate preselected thermal impedance to control a desired temperature change across the plurality of layers and to maintain a desired operating temperature of the source heat.

Abstract: A heat radiation structure for a portable micro projector that enables efficient radiation of heat generated therein. A projector module irradiates light of high intensity using a lamp to project an image to an external screen. A thermally conductive plate having a plate-like shape, the projector module being attached to one surface of the thermally conductive plate to transfer heat generated in the projector module. A heat radiation case to which the thermally conductive plate to which the projector module is attached is coupled therein to emit the heat transferred through the thermally conductive plate outside.

Abstract: Thermal rectifiers using linear nanostructures as core thermal conductors have been fabricated. A high mass density material is added preferentially to one end of the nanostructures to produce an axially non-uniform mass distribution. The resulting nanoscale system conducts heat asymmetrically with greatest heat flow in the direction of decreasing mass density. Thermal rectification has been demonstrated for linear nanostructures that are electrical insulators, such as boron nitride nanotubes, and for nanostructures that are conductive, such as carbon nanotubes.

Abstract: In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the second body is a heat sink.

Abstract: A superconductor cooling system has: a first superconductor; a first cooling conductor used for cooling the first superconductor; a first cooling unit configured to cool the first cooling conductor to a first temperature; and a current lead configured to supply a current to the first superconductor. Here, a part of a path of the current is formed of a second superconductor. The superconductor cooling system further has: a second cooling conductor used for cooling the second superconductor; a second cooling unit configured to cool the second cooling conductor to a second temperature; and a first thermal conduction switch connected between the first cooling conductor and the second cooling conductor to ON and OFF heat transfer between the first cooling conductor and the second cooling conductor.

Abstract: The invention concerns a thermal switch, characterized in that said switch comprises a thermal connection element consisting of an integral single part forming a body of thermally conductive homogeneous composition as well as an actuator for opening said switch by mechanical rupture of said thermal connection element.

Abstract: A device comprises equipment (501) with a heat source having a maximum thermal operation condition, a cold part (502) relative to the equipment and an element (503) capable of transmitting the heat from the equipment to the cold part. The element (503) is capable of causing the transmitted heat to be limited for thermal conditions above a specified threshold below said maximum condition.

Abstract: Described here are systems for regulating the temperature of a heating or cooling device without adjusting the input power. In general, the systems described here comprise a heating or cooling device and a controller. The heating or cooling device typically comprises a cold region and a hot region, there being a temperature difference between the two, and an input power. The controllers are configured to be placed in thermal contact with at least a portion of the cold region and at least a portion of the hot region, and are configured to create a path for heat exchange between the portions of the contacted hot and cold regions. The heat exchanged may be controlled and the temperature of the system may be user adjustable, or it may be automatically controlled.

Abstract: A tank for storing a cryo fuel in a vehicle with an internal storage container, an external container enveloping the internal container, and an electromagnetically switch selectable thermal bridge element which can produce or interrupt a heat conducting connection between the wall of the internal container and the wall of the external container. The thermal bridge element may be designed such that in the closed state a spatial contact area is formed between a receiving element of the thermal switch affixed to the internal container and an output element of the thermal switch affixed to the outer container. The receiving element may have a smaller thermal capacity and/or size than the output element. Either the thermal bridge or a second thermal bridge element may be adapted to cool the internal container.

Abstract: A thermal control device for controlling the temperature of a craft/spacecraft is an electrostatic switch causing a large change in apparent emissivity. A flexible covering has a high emissivity and makes close contact with the surface of the spacecraft when electrostatically attracted thereto, when the covering is out of contact, the spacecraft surface emissivity controls radiation. The device can operate with moderate levels of DC voltages. Application of voltage results in high emissivity while removal of voltage allows a separator to move the covering out of contact and thus results in low emissivity.

Abstract: A connecting device (13), such as for connecting an electronic component (10) to a heat sink (12), or connecting any two objects, includes a thermally activated adhesive (202a) with a local heating element (200) placed in contact therewith. The local heating element (200), such as a wire, may be embedded within the thermally activated adhesive (202a), which may be in sheet form or non-sheet form. When the local heating element (200) is activated, the local heating element cures the adhesive (such as epoxy) within the thermally activated adhesive that is adjacent to the local heating element when, for example, current is passed through the local heating element (200).

Abstract: The invention describes a heat exchanger that continuously and passively regulates the transfer of heat across each part of the heat exchanger's partitions. Such partitions composed of typically two tubes, one inside the other's bore, that at various points, contact each other or separate from each other, thereby increasing or decreasing heat transfer across their walls at those points. Such separations and contacts being spontaneously effected by changes in the shape of at least one of the tubes which is driven by elements connected to that tube and which change their shape in response to temperature changes, such as shape memory alloys (SMA's) or bi-metal strips.

Abstract: Apparatus and method for sub-ambient cooling using thermoelectric element dynamics in conjunction with pulsed electrical power and selectively enabled thermal coupling to the cold sink. In one form, Peltier devices are dynamically enabled using pulses of electrical power while the thermal path between the cold side of the Peltier device and the cold sink is selectively switched in relative synchronism between conductive states responsive to the dynamics of the Peltier device temperatures. Switched coupling of the thermal connection between the cold sink and the Peltier device materially improves efficiency by decoupling Joule heating and conductive heat transfer losses otherwise conveyed from the Peltier device. Preferable implementations utilizes MEMS to accomplish the selective thermal switching, whereby sub-ambient cooling capacity is increased by parallel operation of multiple Peltier devices and MEMS switches.

Abstract: In the adiabatic apparatus of the present invention, a vessel includes an adiabatic layer in which an object is taken. A plurality of thermal shield plates are located in the adiabatic layer. Each thermal shield plate concentrically surrounds the object. A temperature control section cools or heats the object and the plurality of thermal shield plates. A switch section thermally connects the temperature control section to the plurality of thermal shield plates and the object if temperature of the plurality of thermal shield plates and the object is controlled, and thermally separates the temperature control section from the plurality of thermal shield plates and the object if control of the temperature of the plurality of thermal shield plates and the object is completed.