Abstract: The invention relates to a device (1) having a base station (2) and at least one processing unit (3) that can be detached from the base station (2), having a tool (4) for processing a medium, wherein the processing unit (3) is provided with a vessel (5) for receiving the medium, a closure unit (6) for closing the vessel (5) and a sensor device (13) for measuring at least one parameter of the medium, wherein the sensor device (13) is disposed in and/or on the vessel (5) in a stationary manner such that a reliable measurement of a parameter can be carried out simultaneously with processing of the medium, and in that the device (1) has a wireless module (7) for producing a wireless connection between the base station (2) and the processing unit (3) at least for transmitting data.

Abstract: A cooling component suitable for cooling an electrical component disposed in a power source of a welding or cutting system includes a heat transfer surface, an inlet, an outlet, and a closed flow area. The heat transfer surface transfers heat away from the electrical component. The inlet receives process gas from a gas source and the outlet directs the process gas downstream towards a torch assembly. The closed flow area extends between the inlet and the outlet and is in thermal communication with the heat transfer surface so that the process gas enhances cooling of the electrical component as the process gas travels through the closed flow area, from the inlet to the outlet.

Abstract: A two-phase type heat transfer device (10) for heat sources operating at a wide temperature range. The heat transfer device (10) includes an evaporator (21) collecting heat from a heat source, a condenser (21) providing heat to a cold sink by a first working fluid passing through liquid and vapor transport lines (25, 27) that connect the evaporator (21) and the condenser (23). The evaporator (21) is arranged inside a saddle (31) configured for avoiding that the temperature of the first working fluid in the evaporator (21) is greater than its critical point. The invention also refers to aircraft ice protection systems using the heat transfer device (10).

Abstract: An infant bottle feeding system includes an infant bottle with a chamber that receives a liquid, heating or cooling elements operable to heat or cool liquid in the chamber and sensors operable to sense parameters of the liquid in the chamber. The system optionally includes an electronic base removably attached to a bottom surface of the infant bottle and operable to deliver power to electronics in the infant bottle. The system optionally includes a thermal cover that fits over the infant bottle and releasably couples to the electronic base to enclose the infant bottle, the thermal cover insulating the infant bottle and inhibiting heat loss of the liquid in the chamber. The electronic base delivers power to the heating elements and sensors in the infant bottle only when the infant bottle is on the electronic base. The infant bottle, thermal cover and electronic base define a single travel pack unit when coupled together.

Abstract: A warming device that heats and agitates a container. The warming device has a housing having an enclosed chamber and a concentric warming chamber adapted to receive a first fluid. A concentric basket is provided that is adapted to fit within the warming chamber. The concentric basket secures the container partially submerged within the first fluid. At least one heating element is provided to heat the first fluid in the warming chamber to warm an exterior surface of the container. A motor is provided to agitate and warm a second fluid in the container by rotating the concentric basket at a predetermined rate. A control panel provides various signal instructions to the heating element and the motor.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: A waste water heat recovery system may include a waste water conduit, a plurality of heat exchanger modules, an inlet manifold, and an outlet manifold. The plurality of heat exchanger modules may be disposed on an outer surface of the waste water conduit. Each of the plurality of heat exchanger modules may include a first conduction member, a second conduction member, and a serpentine potable water conduit seated between the first and second conduction members. The inlet manifold may receive potable water from a water source and may be fluidly connected to an inlet of the potable water conduit of each of the plurality of heat exchanger modules. The outlet manifold may be fluidly connected to an outlet of the potable water conduit of each of the plurality of heat exchanger modules.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: Provided is a device for regulating a temperature of a substrate within a chamber of a substrate processing apparatus, which includes: a mounting stand configured to mount the substrate thereon and including a temperature regulating medium flow path formed therein; a substrate elevating mechanism configured to move the substrate up and down between a first position and a second position; a first temperature regulating unit configured to supply a temperature regulating medium to the flow path and configured to regulate the temperature of the substrate to a first temperature in the first position; a second temperature regulating unit installed below the mounting stand and configured to regulate the substrate to a second temperature by emitting light toward the substrate in the second position and heating the substrate; and a light transmitting window configured to transmit the light emitted from the second temperature regulating unit.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.

Abstract: The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.

Abstract: A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.

Abstract: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).

Abstract: Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

Abstract: This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are connected to the avionic rack on the one hand electrically (C3-C4) and on the other hand fluidically (36?-37, 45?-44) to a system of pipes (30a, 30b) on at least one cold source for a cooling fluid (30). A heat-dissipating electronic board (35) is equipped with a dissipated-heat collector plate (61-65), in which fluid circulation channels are implemented, connected via quick-disconnect fluidic couplings (42, 39) to quick-disconnect fluidic couplings of the system of pipes. These devices allow the equipment to be removed from or inserted into the rack (32-EE) or the electronic board (35) to be removed from or inserted into the electrical equipment (33-35).

Abstract: A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid.

Abstract: In exemplary implementations of this invention, a warmer is configured to hold warm water and a container of chilled or frozen breast milk, and to heat the breast milk by heat transfer from the water to the breast milk. The warmer may comprise a vessel (for holding the warm water), flexible bristles and a lid/dome. The vessel is insulated by a vacuum layer. The water can be poured into a cavity in the vessel. The vessel is penetrated by a hole that opens into the cavity. In exemplary implementations, the flexible bristles protrude into the hole, and are configured (i) to be elastically deformed when a human user inserts or removes a breast milk container through the hole, and (ii) to inhibit bobbing of the container, due to buoyancy.

Abstract: A self-circulating heat exchanger apparatus for dissipating heat from an electronic assembly. An enclosure defines a closed-loop circulation path for coolant. An electronic assembly capable of generating heat is installed into a vertical portion of the enclosure such that heat from the electronic assembly causes coolant in the vertical portion to rise, thereby inducing self-circulation of the coolant in the enclosure. The electronic assembly is coated with a combination of silicon nitride and PARYLENE® in order to protect electronic components from water based coolants such as a mixture of ethylene glycol and water.

Abstract: A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.

Abstract: A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.

Abstract: A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.

Abstract: A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Abstract: A device holds at least one medical instrument in a fluid bath intended for maintaining the temperature of the instrument. The device includes a first portion disposed at one end of the bath, the first portion including at least one well adapted to hold the instrument relative to the bath. The device also includes a second portion connected to the first portion at the one end of the bath, whereby the first portion is maintained in a position to hold the instrument securely in the bath.

Abstract: An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A voltage supply apparatus for a motor vehicle, especially a passenger car, truck or a motorcycle, includes a storage cell arrangement having one or more electrochemical storage cells and/or double layer capacitors that are mounted on top of each other. The storage cell arrangement is releasably connected in a form-fitting way to a heat-conducting cooling device that removes heat from the storage cells and/or double layer capacitors such that at least some of the storage cells and/or double layer capacitors of a respective storage cell group can each be thermally connected with the heat-conducting cooling device.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: The present invention relates to a system for increasing the temperature of a fluid being infused into a patient's body while the infusion is taking place. The present invention also provides for improved monitoring of air in the infusion system such to prevent the introduction of air into the patient's body receiving the fluid infusion. The present invention also provides for a system pump which provides a variable flow rate that serves a vast amount of infusion needs and purposes. A disposable cartridge in accordance with the present invention will allow for the efficient transfer of heat energy to the fluid being infused into the patient's body. The cartridge will further ensure that deleterious amounts of air will not be introduced into the patient's body.

Abstract: To cool a digestion vessel (2) of a calorimeter (3) by means of a liquid coolant, a recess (4) over which the digestion vessel (2) is invented during the cooling possess and which has one or more ports (10) for a cooling liquid by means of which the inside of the digestion vessel (2) is wetted in such a way that the coolant runs down over part or the entireties of this inside of the digestion vessel (2) so as to remove the heat thereof is provided.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: A system, configured to be disposed in a information technology equipment rack for providing ice thermal storage, includes a tank configured to hold water, a heat exchanger disposed in water in the tank and configured to convey a two-phase liquid and vapor refrigerant and to transfer heat between the water and the refrigerant, a first valve connected to a liquid and a vapor refrigerant line and configured to selectively connect the liquid refrigerant line to a first port and the vapor refrigerant line to a second port in a first mode and to connect the liquid refrigerant line to the second port and the vapor refrigerant line to the first port in a second mode, a thermostatic expansion valve connected to an inlet of the heat exchanger, and a liquid/vapor pump connected to an outlet of the heat exchanger and to the second port of the first valve.

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract: A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A water tank includes a box, an air valve body, a valve core, a cap, and an elastic element. The box defines an accommodating space and a vent communicating with the accommodating space. The air valve body is extended out from the box and adjacent to the vent. The valve core is mounted to the valve body to airproof the vent, and comprises a first end inserted into the accommodating space through the vent and a second end opposite to the first end. The elastic element is arranged between the cap and the valve core. The valve core will open the vent to deform the elastic member and allow heated air in the accommodating space to leak out of the accommodating space through the vent, in response to an air pressure in the box is greater a reference air pressure.

Abstract: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.

Abstract: A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.

Abstract: A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.