Vaporization Patents (Class 165/911)
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Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
Patent number: 10051762Abstract: The present invention discloses an external thermal conduction interface structure of electrical equipment wherein a fluid jetting device is utilized to jet a thermal conductive fluid for exchanging heat with the external thermal conduction interface structure of electrical equipment via the thermal energy of the jetted thermal conductive fluid, the heat exchange means includes the external thermal conduction interface structure of electrical equipment having relative high temperature being cooled by a fluid have relative lower temperature, and external thermal conduction interface structure of electrical equipment having relative lower temperature being heated by a fluid having relative higher temperature.Type: GrantFiled: February 11, 2011Date of Patent: August 14, 2018Inventor: Tai-Her Yang -
Patent number: 8904819Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.Type: GrantFiled: November 4, 2013Date of Patent: December 9, 2014Assignee: Samsung Display Co., Ltd.Inventors: Damien Boesch, Martin Rosenblum
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Patent number: 8763681Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.Type: GrantFiled: August 3, 2010Date of Patent: July 1, 2014Assignee: ABB Research LtdInventors: Francesco Agostini, Berk Yesin, Bruno Agostini
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Patent number: 8596341Abstract: A family of structures and designs for use in devices such as heat exchangers so as to allow for enhanced performance in heat exchangers smaller and lighter weight than other existing devices. These structures provide separate flow paths for liquid and vapor and are generally open. In some embodiments of the invention, these structures can also provide secondary heat transfer as well. In an evaporative heat exchanger, the inclusion of these structures and devices enhance the heat transfer coefficient of the evaporation phase change process with comparable or lower pressure drop.Type: GrantFiled: June 5, 2008Date of Patent: December 3, 2013Assignee: Battelle Memorial InstituteInventors: Ward E. Tegrotenhuis, Paul H. Humble, Curt A. Lavender, Dustin D. Caldwell
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Patent number: 8590338Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.Type: GrantFiled: December 31, 2009Date of Patent: November 26, 2013Assignee: Samsung Mobile Display Co., Ltd.Inventors: Damien Boesch, Martin Rosenblum
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Patent number: 8361422Abstract: The invention relates to systems and methods for heating a solid or liquid reducing material such as an urea-containing material for NOx selective catalytic reduction (‘SCR’) using a heat stored in a thermal energy storage material, such as a phase change material. The stored heat may be heat from an exhaust waste, such as from an exhaust gas of an internal combustion engine. The reducing material may be a solid reducing material. Other reducing materials include aqueous solutions such as an aqueous solution containing, consisting essentially of, or consisting of urea and water. In one aspect, the process may include a step of evaporating an aqueous solution of urea for immediate urea hydrolysis.Type: GrantFiled: August 15, 2011Date of Patent: January 29, 2013Assignee: Dow Global Technologies LLCInventors: Andrey Soukhojak, David H. Bank
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Patent number: 8249211Abstract: Provided is a modified target assembly in which the target fluid is moved within the target assembly in a manner that increases the effective density of the target fluid within the beam path, thereby increasing beam yield utilizing forced convection. The target may also include optional structures, such as nozzles, diverters and deflectors for guiding and/or accelerating the flow of the target fluid. The target assembly directs the target fluid along an inner sleeve in a direction opposite the direction of the beam current to produce a counter current flow and may also direct the flow of the target fluid away from the inner surface of the inner sleeve and toward a central region in the target cavity. This countercurrent flow suppresses natural convection that tends to reduce the density of the target fluid in the beam path and tends to increase the heat transfer from the target.Type: GrantFiled: June 29, 2005Date of Patent: August 21, 2012Assignee: Advanced Applied Physics Solutions, Inc.Inventor: Kenneth Robert Buckley
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Patent number: 7575046Abstract: A method and system for stabilizing flow includes introducing a flow into a channel with a minimum cross-sectional dimension of less than three millimeters and triggering a release of one or more bubbles in the flow at one or more locations in the channel. The one or more locations are spaced in from an inlet and an outlet to the channel.Type: GrantFiled: September 13, 2004Date of Patent: August 18, 2009Assignee: Rochester Institute of TechnologyInventor: Satish G. Kandlikar
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Patent number: 7442277Abstract: A process for the removal of at least one volatile compound from a reactive or unreactive mixture of substances with the aid of at least one micro-evaporator, the micro-evaporator displaying channels for carrying the mixture of substances having a hydraulic diameter of 5 to 1000 ?m and a specific evaporator surface area of at least 103 m2/m3.Type: GrantFiled: July 23, 2004Date of Patent: October 28, 2008Assignee: Bayer MaterialScience LLCInventors: Kurt-Manfred Küpper, Oswald Wilmes, Hartmut Steenbeck, Almut Nagel
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Patent number: 7223296Abstract: A hydrogen generation system may include a burner unit that generates combustion gas and a combustion gas passage through which the combustion gas generated by the burner unit flows. A reformer, having a reforming catalyst, generates a reformed gas containing hydrogen by steam reforming a feed material and steam using the heat from the combustion gas. An evaporator evaporates water into steam using the heat from the combustion gas, flowing through the combustion gas passage, and supplies the steam to the reformer. The combustion gas passage is arranged to cover at least a portion of an outer surface of the reformer, and the evaporator is arranged to cover at least a portion of an outer surface of the combustion gas passage.Type: GrantFiled: December 23, 2002Date of Patent: May 29, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tomonori Asou, Akira Maenishi, Yutaka Yoshida, Kunihiro Ukai, Yuji Mukai
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Cooling arrangement and method with selected surfaces configured to inhibit changes in boiling state
Patent number: 7028763Abstract: Heat transfer in coolant circuits, as in an internal combustion engine for example, can be beneficially enhanced by maintaining the coolant in a nucleate boiling state, but undesirable transitions to a film boiling state are then possible. The disclosed coolant circuit has selected surface(s) that have a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit. These surfaces are provided with a surface configuration, such as a matrix of nucleation cavities, which has a tendency to inhibit a change in boiling state. The surface configuration can be provided on the parent coolant circuit surface or on a surface of an insert positioned in the coolant circuit. Thus, transitions to film boiling can be effectively avoided at locations in the coolant circuit that are susceptible to such transitions.Type: GrantFiled: December 11, 2003Date of Patent: April 18, 2006Assignee: Caterpillar Inc.Inventors: Colin Peter Garner, Adrian Holland -
Patent number: 7000691Abstract: An apparatus includes heat-generating structure disposed in an environment having an ambient pressure, and a cooling system for removing heat from the heat-generating structure. The cooling system includes a fluid coolant, structure which reduces a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure; and structure which directs a flow of the liquid coolant at the subambient pressure so that it is brought into thermal communication with the heat-generating structure, the coolant then absorbing heat and changing to a vapor. A method for cooling heat-generating structure disposed in an environment having an ambient pressure includes providing a fluid coolant and reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure.Type: GrantFiled: July 11, 2002Date of Patent: February 21, 2006Assignee: Raytheon CompanyInventor: Richard M. Weber
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Publication number: 20040244355Abstract: A heat exchanger for vaporizing a liquid where provided is a boiler in heat-transferrable contact with a plenum that receives a heated medium. The boiler receives a liquid through a liquid inlet, the liquid being in mist or droplet form. The boiler also receives a transport gas through a gas inlet. The transport gas serves to carry the liquid through the boiler where the liquid is vaporized. Also provided is a method of vaporizing a liquid where a transport gas is used to carry a liquid in mist or droplet form through a heated boiler for vaporization.Type: ApplicationFiled: May 26, 2004Publication date: December 9, 2004Inventor: Eugene I. Moody
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Patent number: 6748759Abstract: A heat exchanger for a medium condenser having a plurality of vertical cooling fins having extra length extended both upwardly and downwardly from an ordinary portion of medium coil path for greatly increasing the cooling efficiency thereof, and a drip-drop type water feeding box for feeding water drops to a top of cooling fins densely but intermittently to let each of water drop remain in the space between opposite surfaces of adjacent cooling fins a short period of time and start to slide down the surface of a cooling fin as a next drop of water is delivered to provide enough time for evaporation so as to absorb a large quantity of latent heat and increase cooling efficiency.Type: GrantFiled: October 26, 2001Date of Patent: June 15, 2004Inventor: Ho-Hsin Wu
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Publication number: 20030192679Abstract: An apparatus for use in a counter flow heat exchange assembly that provides increased heat exchange. The apparatus includes a plurality of adjacently spaced arrays, each array having a plurality of cooling conduits that are connected to one another through the utilization of connector portions. The adjacent vertical arrays have a centerline-to-centerline distance extending between them that is greater than the diameter of each of the conduits employed. In addition, the apparatus includes a vertical partition that extends between some or all conduits of each array.Type: ApplicationFiled: April 12, 2002Publication date: October 16, 2003Applicant: The Marley CoolingTower CompanyInventors: Jason Stratman, Jidong Yang
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Patent number: 6550532Abstract: A fuel evaporator (1) includes an evaporation chamber (11) to prepare a fuel gas FG by evaporating a liquid fuel FL with heat, a fuel injector (40) to supply a liquid fuel to the evaporation chamber, a plurality of heating medium tubes (12) to lead a combustion gas HG through said evaporation chamber, a superheating part (11U) to heat a fuel gas FG evaporated in said evaporation chamber by means of the combustion gas HG, an exhaust duct (22) to exhaust the fuel gas FG, and a fuel injection tube (41). The fuel injection tube is provided with a plurality of injection holes (42), said fuel injection tube being extended into said evaporation chamber and said fuel injection tube is provided crossing at right angle with respect to a heating medium tube. Injection property of the fuel injection tube in said evaporation chamber is greatly improved. The liquid fuel is evaporated effectively and rapidly.Type: GrantFiled: November 3, 2000Date of Patent: April 22, 2003Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Masahito Nakamura, Yuuji Asano, Shiyuuichi Togasawa
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Publication number: 20030024692Abstract: A heat exchanger for a medium condenser mainly comprises a plurality of vertical cooling fins essentially having extra length extended both upwardly and downwardly from an ordinary portion of medium coil path for greatly increase the cooling efficiency therefore, and a drip-drop type water feeding box for feeding water drops to a top of cooling fins densely but intermittently to let each of water drop been held in the spacing between opposite surfaces of adjacent cooling fins a short period of time and start to slide down around the surface of a cooling fin as a next drop of water is delivered to provide enough time for evaporating so as to absorb a large quantity of latent heat for increasing cooling efficiency therefore.Type: ApplicationFiled: October 26, 2001Publication date: February 6, 2003Inventor: Ho-Hsin Wu
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Patent number: 6495749Abstract: Hybrid combustion power systems comprising multiple direct energy conversion devices are disclosed, which devices (12, 14, 16) are preferably combined with a Rankine cycle containing a steam turbine (114), where combustion air (A) may be continuously preheated by an optional air heater (58), then by the waste heat of a low temperature direct energy conversion device (16) such as an alkali metal thermoelectric converter (AMTEC), and finally by the waste heat of a high temperature direct energy conversion device (12) such as an AMTEC, where the AMTECs include electrolyte (36) may include a condenser located in substantially the same geometrical plane as the AMTEC electrolyte (36) and thermally insulated from the electrolyte.Type: GrantFiled: March 30, 2001Date of Patent: December 17, 2002Assignee: Siemens Westinghouse Power CorporationInventors: Dmitry V. Paramonov, Mario D Carelli, Dennis A. Horazak
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Publication number: 20020148594Abstract: This invention provides heat transfer systems and methods of cooling surfaces and heating liquids which employ surfaces including a minimum density of discrete, nucleation sites having a conical cross-section tapering to a minimum predetermined depth. These surfaces are placed in contact with a refrigerant having a preselected boiling point so that the nucleation sites become largely flooded with the refrigerant. The nucleation sites permit nucleate boiling of a refrigerant without a temperature overshoot on the initial ascent. In more preferred variations of this invention, specific site spacing and geometries are employed to contain tiny bubble embryos, which minimize hysteresis and reversal of trend effects.Type: ApplicationFiled: March 6, 2002Publication date: October 17, 2002Applicant: The Trustees of the University of PennsylvaniaInventor: Benjamin Gebhart
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Patent number: 6431262Abstract: A thermosyphon radiator comprising a sealed panel containing a reservoir of water in a lowermost part of the panel and a heating member, e.g. a hot water pipe, extending through the lowermost part of the panel, the member being at least partially immersed in the liquid.Type: GrantFiled: September 23, 1996Date of Patent: August 13, 2002Assignee: Lattice Intellectual Property Ltd.Inventors: Nkole Enock Tayali, Alan Reginald Shiret
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Patent number: 6371199Abstract: This invention provides heat transfer systems and methods of cooling surfaces and heating liquids which employ surfaces including a minimum density of discrete, nucleation sites having a conical cross-section tapering to a minimum predetermined depth. These surfaces are placed in contact with a refrigerant having a preselected boiling point so that the nucleation sites become largely flooded with the refrigerant. The nucleation sites permit nucleate boiling of a refrigerant without a temperature overshoot on the initial ascent. In more preferred variations of this invention, specific site spacing and geometries are employed to contain tiny bubble embryos, which minimize hysteresis and reversal of trend effects.Type: GrantFiled: June 7, 1995Date of Patent: April 16, 2002Assignee: The Trustees of the University of PennsylvaniaInventor: Benjamin Gebhart
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Publication number: 20020029873Abstract: In a cooling device boiling and condensing refrigerant, a heat conductor portion for thermally connecting a heat reception wall and a heat radiation wall defining a closed container is disposed in the closed container, a heat-generating member is attached on the heat reception wall, and a heat radiation fin for radiating heat generated from the heat-generating member to an outside is provided on the heat radiation wall. In the cooling device, both ends of the tube are connected to the closed container at different position of the heat radiation wall to communicate with the closed container, so that the heat radiation fin is enclosed by the heat radiation wall and the tube.Type: ApplicationFiled: September 14, 2001Publication date: March 14, 2002Inventors: Hajime Sugito, Hiroshi Tanaka, Takahide Ohara
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Patent number: 6234242Abstract: The present invention provides a two-phase thermosyphon (100) that includes a sealed housing (105). The housing (105) includes a first outer surface, a second outer surface opposite the first outer surface, a first inner surface, and a second inner surface. The housing (105) is preferably formed of a first housing piece and a second housing piece that are attached in such a way as to form a sealed housing. A porous structural material (101) is disposed within the housing (105). A plurality of slots (103) are disposed within the porous structural material (101). The slots (103) preferably run substantially perpendicular to the general direction of vapor flow through the porous structural material (101) and provide increased heat dissipation in the two-phase thermosyphon (100).Type: GrantFiled: April 30, 1999Date of Patent: May 22, 2001Assignee: Motorola, Inc.Inventors: Maninder Singh Sehmbey, Morris B. Bowers
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Patent number: 6227288Abstract: A Multifunctional Capillary System is located within and between a single compensation chamber (CC) and the evaporator of a loop heat pipe. It provides: vapor-liquid interface control for all gravity states from the micro-gravity condition of space (near 0-g) through the earth's gravitational condition (1-g), with liquid supply to the evaporator via wicking from the CC in micro-gravity, and for all orientations (tilts) of the CC-evaporator assembly in earth gravity. As a single compensation chamber is used, dual compensation chamber penalties of weight and wide-temperature-variation are avoided. The system has combined, parallel wicking structure, paths, and joints for micro-gravity and 1-g liquid acquisition. The wick system is comprised of an axial-groove, evaporator-core secondary wick—concentric, contiguous, and in intimate contact with the primary evaporator wick. This secondary wick mates to a porous vane assembly in the CC.Type: GrantFiled: May 1, 2000Date of Patent: May 8, 2001Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Donald F. Gluck, Charlotte Gerhart
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Patent number: 6170500Abstract: A retrievable cane disclosed includes a cane body to which there is attached a retrieval line that is anchored at a lower end and extends from the inside of the cane body at the lower end up through the cane body out through the rear of the cane body below the grip. The retrieval line has an elastic section that allows an attachment end outside the cane body to be releasably attached to the body of the user preferably having the grip portion at the waist allowing normal walking by the user. The elastic section allows the user to pull the cane body away from the waist for use during walking and the elastic section automatically returns the cane to the user's waist when released.Type: GrantFiled: March 1, 1999Date of Patent: January 9, 2001Inventor: Gene D. Turechek
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Patent number: 6056044Abstract: An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.Type: GrantFiled: December 10, 1997Date of Patent: May 2, 2000Assignee: Sandia CorporationInventors: David A. Benson, Charles V. Robino, David W. Palmer, Stanley H. Kravitz
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Patent number: 5951820Abstract: An organometallic compound represented by the general formula (I) ##STR1## or the general formula (II)R-M.sup.2 -R (II)is evaporated, and then passed through the inner tube of a heat exchanger to be precipitated. The heat exchanger is then heated to re-evaporate the organometallic compound, and the re-evaporated organometallic compound is then precipitated in a filling container which is connected to said heat exchanger and cooled down to a prescribed temperature to fill the container.Type: GrantFiled: June 25, 1997Date of Patent: September 14, 1999Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiromi Ohsaki, Kazuhiro Hirahara, Toshinobu Ishihara, Isao Kaneko
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Patent number: 5918665Abstract: A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.Type: GrantFiled: October 15, 1998Date of Patent: July 6, 1999Assignee: Unisys CorporationInventors: James Wittman Babcock, Jerry Ihor Tustaniwskyj
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Patent number: 5765631Abstract: A fluid circulation apparatus comprises a body part (2) in the shape of a dihedron with, on a first face of the dihedron, at least one opening for input/output of this fluid covering over the opening in a leaktight way. The bulb projects with respect to the body part (2) beyond the edge (13) of the dihedron and is produced by combination of metal sheets, of cylindrical, spherical and/or ellipsoidal shape, welded to one another. The apparatus is applicable to the integration of phase separators with heat exchangers of the brazed-plate type or alternatively to the input/output of fluids in such exchangers.Type: GrantFiled: December 20, 1995Date of Patent: June 16, 1998Assignees: L'Air Liquide, Societe Anonyme Pour l'Etude et l'Exploitation des Procedes Georges Claude, Nordon Cryogenie SNCInventor: Claude Gerard
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Patent number: 5737923Abstract: A thermoelectric heat transfer system having a thermoelectric device and a heat exchanger with an evaporating surface and a condensing surface. A working fluid is sealed within the heat exchanger. The thermoelectric device includes a thermally conductive hot plate and a thermally conductive cold plate with thermoelectric elements disposed therebetween and the thermoelectric elements are electrically coupled in series and thermally coupled in parallel. The evaporating surface of the heat exchanger is thermally coupled with the hot plate. A fluid flow path to allow working fluid in its vapor phase to flow from the evaporating surface to the condensing surface and working fluid in its liquid phase to flow from the condensing surface to the evaporating surface.Type: GrantFiled: October 17, 1995Date of Patent: April 14, 1998Assignee: Marlow Industries, Inc.Inventors: Michael D. Gilley, Ralph L. Webb
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Patent number: 5697430Abstract: Metallic tubes (10,10') for boiling have an outer surface (12) for contacting a refrigerant and an inner surface (14) for contacting a liquid heat transfer medium to be chilled. The outer surface (12) has a plurality of radially outwardly extending helical fins (18); the tube inner surface (14) has a plurality of helical ridges (16). The fins (18) of the outer surface are notched to provide nucleate boiling cavities having pores (30). The fins (18) and notches (N) are so spaced that the pores (30) have an average area less than 0.00009 square inches and a pore density of at least 2000 per square inch on the tube outer surface. The helical ridges (16) on the inner surface have a predetermined ridge height and pitch and are positioned at a predetermined helix angle, the inner surface having a severity factor .PHI. in the range of 0.006 to 0.008.Type: GrantFiled: June 7, 1995Date of Patent: December 16, 1997Assignee: Wolverine Tube, Inc.Inventors: Petur Thors, Norman R. Clevinger, Bonnie J. Campbell, James T. Tyler
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Patent number: 5644608Abstract: The performance of a compact heat exchanger in which a flow of air is employed to cool a flow of water can be enhanced by spraying water as a fine mist into the stream of coolant air. The water droplets, preferably less than 100 microns in diameter, coat the heat exchanger surface on the air side of the heat exchanger and provide evaporative cooling. The preferred form of heat exchange surface has strip fins.Type: GrantFiled: May 26, 1995Date of Patent: July 1, 1997Assignees: Consolidated Edison Company of New York, Michael VaselyInventors: Paul Malik, Robert Kosson, Michael Vasely, George Stegmann
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Patent number: 5544696Abstract: A micro consideration of the phase change or boiling cooling of an electronic part is disclosed including focus on a heat exchanging problem that is encountered in the use of this phase change cooling in the presence of realistic flow rates and energy dissipations. The combination of coolant flow and projection of the cooled part into the coolant stream flow is shown to result in difficulties that make such cooling less desirable for electronic and other purposes without use of improvement such as, is achieved in the present invention. Preclusion of these difficulties (involving coolant vapor) by the addition of a small geometric shape or other vapor-considered alterations of the cooled part environment are also disclosed. Results of the achieved improved cooling are shown in graphic relationships. The disclosed invention is couched in terms of electronic part cooling but is applicable to a variety of other heat exchange situations.Type: GrantFiled: July 1, 1994Date of Patent: August 13, 1996Assignee: The United States of America as represented by the Secretary of the Air ForceInventor: John E. Leland
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Patent number: 5488642Abstract: A system for cooling water from a spent fuel pool of a nuclear power generating plant. The system includes a heat exchanger in which a flow of air is employed to cool a flow of pool water. The performance of the heat exchanger is enhanced by spraying water as a fine mist into the flow of coolant air. The water droplets, preferably less than 100 microns in diameter, coat the heat exchange surface on the air side of the heat exchanger and provide evaporative cooling. The preferred form of heat exchange surface has strip fins.Type: GrantFiled: August 22, 1994Date of Patent: January 30, 1996Assignees: Consolidated Edison Company of New York, Inc., Michael VaselyInventors: Paul Malik, Robert Kosson, Michael Vasely, George Stegmann
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Patent number: 5398519Abstract: A thermal control system in which a boiling liquid refrigerant is vaporized by heat addition from the system electronics. The pressure on the boiling liquid refrigerant and the vaporized refrigerant thereover is maintained constant so that the temperature of vaporization is maintained constant. For this reason, the boiling liquid refrigerant rapidly vaporizes and concomitantly removes from the system the very large amount of heat required for the refrigerant to pass from the liquid to the gaseous phase. The heat transfer rates under these conditions are extremely high. In addition to heat addition to the liquid before vaporization, the mass of liquid vaporized absorbs heat during vaporization of the liquid. The transition from liquid to vapor occurs at a constant temperature which is controlled by controlling the pressure at which the vaporization takes place.Type: GrantFiled: July 13, 1992Date of Patent: March 21, 1995Assignee: Texas Instruments IncorporatedInventors: Richard Weber, Donald C. Price
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Patent number: 5390729Abstract: Cooling liquid flowing through cooling-liquid passages cools in heat-transmission manner an inner layer on an inner surface of an impermeable intermediate layer and is directed through a piping to an interface between the intermediate and outer layers, whereby the porous outer layer is cooled by latent heat generated by evaporation of the cooling liquid infiltrated into the porous outer layer.Type: GrantFiled: August 26, 1993Date of Patent: February 21, 1995Assignee: Ishikawajima-Harima Jukogyo Kabushiki KaishaInventors: Akira Sakurai, Masahiro Shiotsu, Toshikazu Yano, Masao Ochi, Toshihiro Sugawara
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Patent number: 5379610Abstract: Cooling liquid flowing through cooling-liquid passages cools in heat-transmission manner an inner layer on an inner surface of an impermeable intermediate layer and is directed through a piping to an interface between the intermediate and outer layers, whereby the porous outer layer is cooled by latent heat generated by evaporation of the cooling liquid infiltrated into the porous outer layer.Type: GrantFiled: August 26, 1993Date of Patent: January 10, 1995Assignee: Ishikawajima-Harima Jukogyo Kabushiki KaishaInventors: Akira Sakurai, Masahiro Shiotsu, Toshikazu Yano, Masao Ochi, Toshihiro Sugawara
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Patent number: 5333682Abstract: A tube for use in a heat exchanger where heat is transferred between a fluid flowing through the tube and a fluid flowing around the exterior of the tube and where the fluid external to the tube boils during the heat exchange process. The tube has one or more external fin convolutions extending from its external surface. At intervals along each side surface of the fin convolutions there are shoulder notches extending from the fin side surfaces. The groove space between adjacent fin convolutions has raised teeth located circumferentially at intervals. The fin convolutions do not extend perpendicularly from the tube surface but are inclined, with one convolution overlying an adjacent groove but not touching its adjacent neighbor fin convolution to form a re-entrant boiling cavity with an opening gap. In one embodiment, the opening gap extends completely around the circumference of the tube.Type: GrantFiled: September 13, 1993Date of Patent: August 2, 1994Assignee: Carrier CorporationInventors: Xin Liu, Steven J. Spencer, Neelkanth S. Gupte, Robert H. L. Chiang, Daniel Gaffaney
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Patent number: 5329785Abstract: Cooling liquid flowing through cooling-liquid passages cools in heat-transmission manner an inner layer on an inner surface of an impermeable intermediate layer and is directed through a piping to an interface between the intermediate and outer layers, whereby the porous outer layer is cooled by latent heat generated by evaporation of the cooling liquid infiltrated into the porous outer layer.Type: GrantFiled: June 8, 1993Date of Patent: July 19, 1994Assignee: Ishikawajima-Harima Jukogyo Kabushiki KaishaInventors: Akira Sakurai, Masahiro Shiotsu, Toshikazu Yano, Masao Ochi, Toshihiro Sugawara
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Patent number: 5325913Abstract: An apparatus is provided for cooling electronic components mounted on a cuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet blocks the release opening. A wick is bonded to the inside surface of the interior cavity. The device is sealed with a working fluid that permeates the wick. When the components get hot, the heat is transferred through the heat sink enclosure to the working fluid in the wick, causing the working fluid to vaporize. The vapors remain trapped in the interior cavity until the pellet melts, allowing the vapor to be released and the temperature of the heat sink enclosure to be stabilized or lowered.Type: GrantFiled: June 25, 1993Date of Patent: July 5, 1994Assignee: The United States of America as represented by the Secretary of the NavyInventor: Frank E. Altoz
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Patent number: 5311931Abstract: A method for the efficient cooling of a cavity-bearing surface is disclosed. The method includes the provision of an extra-fine coolant mist to the surface to be cooled wherein the surface has at least two projections and at least one cavity therebetween. The mist is deposited so as to form an ultra-thin coolant film upon the surface and at least one coolant mist vortex within the cavity. The film is evaporated from its outside surface.Type: GrantFiled: December 27, 1991Date of Patent: May 17, 1994Assignee: The Research Foundation of State University of New YorkInventor: Richard S. L. Lee
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Patent number: 5295533Abstract: A heat exchanger for exchanging heat between a first fluid and a second fluid comprises a moving partition member for heat transmission between the first fluid and the second fluid, a housing partitioned by the moving partition member into a first chamber for passing the first fluid and a second chamber for passing the second fluid, and a power source for rotating the moving partition member.Type: GrantFiled: March 25, 1992Date of Patent: March 22, 1994Assignee: Kokusai Gijutsu Kaihatsu Kabushiki KaishaInventor: Yasuo Ueno
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Patent number: 5271454Abstract: Heat is removed from a spacecraft under zero gravity and under various accelerations, by a heat exchange contact between a cooling liquid or coolant and an evaporant or medium to be evaporated. The coolant flowing in at least one liquid cooling circulation circuit and the evaporant which is discharged in its vapor phase, are brought into heat exchange contact with each other in processing chambers forming at least two separate heat exchange stages, wherein different pressure and temperature conditions are set. The cooling liquid or coolant and the medium to be evaporated evaporant flow through these stages in sequence and in such a way that the coolant first flows through the stage with the highest pressure and the highest temperature, and then flows through the stages with successively lower pressure and/or temperature.Type: GrantFiled: September 4, 1992Date of Patent: December 21, 1993Assignee: Erno Raumfahrttechnik GmbHInventor: Bernhard Leidinger
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Patent number: 5261602Abstract: A partial oxidation process and a novel burner are provided for simultaneously introducing two or three separate feedstreams into a free-flow partial oxidation gas generator for the production of synthesis gas and fuel gas, or reducing gas. The reactant feedstreams include a liquid hydrocarbonaceous fuel or a pumpable slurry of solid carbonaceous fuel, and a free-oxygen containing gas e.g. air or oxygen. The burner comprises a central conduit and a plurality of spaced concentric coaxial conduits with down-flowing annular passages. A flat annular-shaped disc or cup-shaped porous ceramic or porous metal cooling means of uniform composition, wall thickness and porosity with the various pores interconnecting is attached to the downstream tip of the burner. A controlled amount of liquid coolant under pressure is passed successively through the porous inside surface, porous core and porous outside surface of the cooling means is vaporized. The tip of the burner is thereby cooled.Type: GrantFiled: December 23, 1991Date of Patent: November 16, 1993Assignee: Texaco Inc.Inventors: Albert Brent, Robert J. Stellaccio, Mitri S. Najjar, Jerrold S. Kassman
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Patent number: 5161610Abstract: An active cooling circuit through which cooling liquid circulates, is connected to an evaporation heat exchanger for cooling said cooling liquid when it has begun to warm. For this purpose, a housing encloses an evaporation chamber into which an evaporation fluid, such as water, is sprayed whereby the heat needed for the evaporation cools the cooling liquid passing through a gap between an inner and an outer wall forming said housing. The active cooling circuit passes through the gap in which eddy bodies are arranged in such positions relative to the normal flow direction of the cooling liquid through the gap to cause eddy currents in the cooling liquid flowing through the gap for an improved heat exchange. The discharge for the evaporated fluid is located at the same housing end where the spray nozzles for the injection of the evaporation fluid are located.Type: GrantFiled: June 12, 1991Date of Patent: November 10, 1992Assignee: ERNO Raumfahrttechnik GmbHInventor: Bernhard Leidinger
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Patent number: 5158742Abstract: A reactor steam isolation cooling system includes a containment building surrounding a reactor pressure vessel having a reactor core for generating reactor steam. An isolation pool is disposed outside the containment building and is vented to the atmosphere. An isolation condenser includes a plurality of heat pipes collectively defining at one end thereof a condenser assembly disposed outside the containment building and inside the isolation pool, and at an opposite end thereof an evaporator assembly extending inside the containment building. Reactor steam is selectively channeled to the evaporator assembly for heating a working liquid therein and condensing the reactor steam to form reactor condensate for return to the pressure vessel. The working liquid is vaporized in the evaporator assembly and flows to the condenser assembly wherein it releases heat into the isolation pool with the working condensate therefrom returning to the evaporator assembly.Type: GrantFiled: December 11, 1991Date of Patent: October 27, 1992Assignee: General Electric CompanyInventor: Charles W. Dillmann
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Patent number: 5150749Abstract: Heat exchanger apparatus which includes a substantially horizontal countercurrent heat exchanger of the shell-and-tube type, particularly for hybrid heat pumps operated with non-azeotropic work fluids. The apparatus further includes fluid distributor with fluid outlets the number of which corresponds to the number of the heat exchanger tubes of the heat exchanger is provided upstream the heat exchanger, the heat exchanger tubes of which are connected each to one fluid outlet of the fluid distributor.Type: GrantFiled: February 27, 1991Date of Patent: September 29, 1992Assignee: Energiagazdalkodasi IntezetInventors: Gyorgy Bergmann, Geza Hivessy, Tamas Homola, Arpad Bakay, Mihaly Horvath
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Patent number: 5148859Abstract: An air/liquid heat exchanger having a refrigerant spray providing evaporative cooling.Type: GrantFiled: February 11, 1991Date of Patent: September 22, 1992Assignee: General Motors CorporationInventor: Henry E. Beamer
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Patent number: 5131233Abstract: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.Type: GrantFiled: March 8, 1991Date of Patent: July 21, 1992Assignee: Cray Computer CorporationInventors: Seymour R. Cray, Gregory J. Sherwood
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Patent number: H1145Abstract: A wafer chuck having a substantially hollow cavity therein utilizes the latent vaporization of a liquid to extract heat from the wafer. An insulated heater provides for heating the wafer to its desired operating point as rapidly as possible in order to bring the wafer to its operating point before plasma etching or deposition occurs.Type: GrantFiled: November 6, 1991Date of Patent: March 2, 1993Assignee: Sematech, Inc.Inventor: Richard L. Anderson