Abstract: A liquid rheostat includes a conductive element which surrounds multiple electrodes. The element provides a multiplicity of current paths between the electrodes at a given depth of electrolyte solution thus decreasing current concentration of the electrodes. In order to further decrease current concentration, cylindrical electrodes are used. In a second embodiment, the liquid rheostat and an electrolyte storage container are disposed so as to surround a fluid transport pipe of a pumping system, the fluid being transported in the pipe serving to cool the electrolyte. The rheostat and storage container combined with the pipe provide a compact arrangement for saving space in a pump installation.

Abstract: A method is provided for customizing the heat transfer from the walls of an electronic unit such as a semi-conductor chip or wafer by determining the required heat transfer characteristics of the units; drilling holes of a predetermined size and location in the walls of the unit with a high energy beam in accordance with the required heat transfer characteristics of the unit; immersing the unit in a suitable dielectric coolant so that nucleate boiling will start at approximately the desired wall temperature to obtain the required heat transfer from the unit, thereby providing a uniform wall temperature.A further aspect of the invention is the inclusion of a heater means located at or near the bottom of the heat transfer wall so that bubble generation can be started thereat, which bubbles wash the liquid from the downstream drilled holes or natural nucleation sites, thereby starting nucleate boiling when the required temperature is reached.

Abstract: In a liquid cooled thyristor column in which disk thyristors are stacked along with heat sinks with the disk thyristors and heat sinks held elastically together each heat sink is equipped with a laterally projecting heat pipe having its free end emersed in a coolant line, with the free ends of the heat pipes secured to the coolant lines by means of a membrane. Each heat pipe includes an intermediate section having electrical insulating material and a tube section of elastic material adjacent the heat sink thereby permitting impure cooling liquids to be used.

Abstract: Vapor chamber-containing apparatus is provided for cooling heat-producing electrical and electronic components wherein the heat is absorbed by a vaporizable agent.

Abstract: A liquid cooled heat exchanger particularly adapted to cool heat sinks of an electrical power supply for large electronic systems. The heat exchanger has thin flexible walls. Pressure of the coolant within the heat exchanger assures a positive mechanical contact between the heat exchanger and the heat sink, one that can accommodate changes in dimensions of the heat sink or heat exchanger and a lack of planarity of the surfaces of the heat sink without increasing the thermal impedance between the liquid in the heat exchanger and the heat sink. Fluid flow within the heat exchanger is controlled so that heat transfer efficiency between certain areas of the flexible walls and the coolant is maximized, which areas are proximate to the heat sources mounted on the heat sink.

Abstract: The invention contemplates a heat-transfer device or heat pipe characterized by integral screen-wick structure providing relatively great contact area between the internal working fluid or condensable medium and the heat input.