Corrugated Or Slotted Patents (Class 174/126.3)
  • Patent number: 11437642
    Abstract: An exemplary embodiment of the present invention provides a rechargeable battery, including: an electrode assembly formed by disposing an electrode having coated regions and uncoated tabs at opposite sides of a separator; a case configured to accommodate the electrode assembly therein; a cap plate coupled to an opening of the case; and electrode terminals insert-molded into terminal holes of the cap plate to be connected to the uncoated tabs, wherein the electrode terminal includes: an external terminal portion configured to protrude outside of the cap plate; an internal terminal portion disposed within the cap plate to be connected to the uncoated tabs; and a connector configured to connect the external terminal portion and the internal terminal portion, and disposed in the terminal hole to be insulated by a molding resin material.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Joonghun Kim, Kangwook Kim, Backgun Kim, Wook Su Lee
  • Patent number: 11318562
    Abstract: A grain-oriented electrical steel sheet includes a groove formed on a surface and a solidified alloy layer formed under the groove, wherein the solidified alloy layer includes particles of a certain average diameter.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 3, 2022
    Assignee: POSCO
    Inventors: Oh-Yeoul Kwon, Se-Min Park, Jong-Tae Park, Won-Gul Lee
  • Patent number: 10998597
    Abstract: A battery module includes a pair of battery cells, each battery cell having an electrode lead, and the battery cells being stacked to face each other; a connector configured to connect the electrode leads of battery cells; and a connector breaking device disposed in a space formed between terrace portions of the battery cells and configured to be operated with a pressure applied to the connector breaking device due to swelling of at least one of the battery cells to cut off an electric connection between the connector and the electrode leads is provided. A method to interrupt an electrical connection in a battery module is also provided.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: May 4, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jae-Uk Ryu, Dal-Mo Kang, Su-Chang Kim, Jeong-O Mun, Ji-Su Yoon
  • Patent number: 10971346
    Abstract: An apparatus for mass spectrometry and/or ion mobility spectrometry is disclosed comprising a first device arranged and adapted to generate aerosol, smoke or vapour from a target and one or more second devices arranged and adapted to aspirate aerosol, smoke, vapour and/or liquid to or towards an analyser. A liquid trap or separator is provided to capture and/or discard liquid aspirated by the one or more second devices.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 6, 2021
    Assignee: Micromass UK Limited
    Inventors: Tamas Karancsi, Lajos Godorhazy, Daniel Szalay, Zoltan Takats, Julia Balog, Steven Derek Pringle, Daniel Simon
  • Patent number: 10920755
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: February 16, 2021
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis
  • Patent number: 10910206
    Abstract: An apparatus for mass spectrometry and/or ion mobility spectrometry is disclosed comprising a first device arranged and adapted to generate aerosol, smoke or vapour from a target and one or more second devices arranged and adapted to aspirate aerosol, smoke, vapour and/or liquid to or towards an analyser. A liquid trap or separator is provided to capture and/or discard liquid aspirated by the one or more second devices.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: February 2, 2021
    Assignee: Micromass UK Limited
    Inventors: Tamas Karancsi, Lajos Godorhazy, Daniel Szalay, Zoltan Takats, Julia Balog, Steven Derek Pringle, Daniel Simon
  • Patent number: 9748711
    Abstract: The invention is characterized in that a HF coaxial cable is designed as a conventional corrugated sheath cable comprising a cable outer conductor, in the form of a metal corrugated tube, having a line impedance Zk and a minimum bending radius rk,min specified by the manufacturer as a characteristic feature of the coaxial cable; in corrugated sheath cable, directly or indirectly following the straight plug connector, is bent to have a bending radius r?, where 0.2 rk,min?r??0.9 rk,min, which alters the line impedance Zk by a maximum of 1 ohm. The bend with the bending radius r? is produced by cold forming corrugated sheath cable with the introduction of bending forces and tensile forces directed along said corrugated sheath cable.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: August 29, 2017
    Assignee: SPINNER GMBH
    Inventors: Bernd Zimmerhaeckel, Ingolf Fischer, Falk Mutze
  • Patent number: 9163756
    Abstract: The corrugated tube includes a body in which a plurality of peaks and a plurality of valleys are continuously alternated in a longitudinal direction of the body. A slit is formed in the body along the longitudinal direction. Both end portions of the body between which the slit is interposed are overlapped. A mark is provided to only one peak of the plurality of peaks at the one end portion of the body, and another mark is also provided to corresponding only one peak of the plurality of peak disposed at the other end portion of the body and brought into a fitting engagement with the marked peak disposed at the one end portion of the body.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: October 20, 2015
    Assignee: Yazaki Corporation
    Inventor: Atsushi Sugiyama
  • Patent number: 9121531
    Abstract: The corrugated tube includes a body in which a plurality of peaks and a plurality of valleys are continuously alternated in a longitudinal direction of the body. A slit is formed in the body along the longitudinal direction. Both end portions of the body between which the slit is interposed are overlapped. A mark is provided to only one peak of the plurality of peaks at the one end portion of the body, and another mark is also provided to corresponding only one peak of the plurality of peak disposed at the other end portion of the body and brought into a fitting engagement with the marked peak disposed at the one end portion of the body.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: September 1, 2015
    Assignee: Yazaki Corporation
    Inventor: Atsushi Sugiyama
  • Patent number: 9023485
    Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: May 5, 2015
    Assignee: Wieland-Werke AG
    Inventors: Isabell Buresch, Dieter Stock, Thorsten Weireter
  • Publication number: 20150041211
    Abstract: A conductive insert which provides a low resistance bond between low conductive materials. The insert includes a first surface and an oppositely facing second surface. A plurality of openings extends between the first surface and the second surface. At least one first projection extends from the first surface proximate respective first openings, the at least one first projections extend from the first surface in a direction away from the second surface. At least one second projection extends from the second surface proximate respective second openings, the at least one second projections extend from the second surface in a direction away from the first surface. The insert provides a stable, low resistance electrically conductive path between the conductive materials.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Kimberly DEBOCK, David James FABIAN, Brian Todd KLINGER
  • Publication number: 20140374137
    Abstract: A method for manufacturing an electrical steel sheet is provided. The method for manufacturing an electrical steel sheet includes forming a groove having first and second side surfaces and a bottom surface by melting a surface of a steel sheet by laser irradiation, and forming an opening by removing melted byproducts of the steel sheet formed on the first and second side surfaces and the bottom surface through air blowing or suctioning to expose at least one surface of the first side surface, the second side surface, and the bottom surface in the forming of the groove.
    Type: Application
    Filed: November 15, 2012
    Publication date: December 25, 2014
    Inventors: Oh-Yeoul Kwon, Won-Gul Lee, Chan-Hee Han, Hyun-Chul Park
  • Publication number: 20130134567
    Abstract: The present invention relates to the field of semiconductor package structures, and more specifically to a lead frame and a semiconductor package structure thereof. In one embodiment, a lead frame can include a plurality of parallel-arrayed lead fingers with a plurality of grooves situated on surfaces of the lead fingers, where the depths of the grooves can be smaller than the thickness of the lead fingers. In one embodiment, a flip chip semiconductor package structure can include a chip, a group of bumps, and the above-described lead frame. The first surfaces of the bumps can be coupled to the front surface of the chip, and the second surfaces of the bumps can be coupled to the upper surface of the lead frame.
    Type: Application
    Filed: November 12, 2012
    Publication date: May 30, 2013
    Applicant: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventor: Silergy Semiconductor Technology (Hangzhou) L
  • Patent number: 8278556
    Abstract: Stabilization of dielectrics used in transmission lines is described. In one implementation, the transmission line includes an outer conductor, a center conductor, and a dielectric material. The dielectric material separates the outer conductor from the center conductor. The center conductor has a conductive surface with a pattern distributed thereon. The pattern is configured to prevent the dielectric material from moving when the transmission line is exposed to an extreme temperature fluctuation. The pattern increases a coefficient of friction between the center conductor and dielectric material sufficient enough to prevent undesired motion of the dielectric material. In one implementation, the pattern includes indentations that are generally, but not necessarily limited to between 0.001 and 0.004 of an inch deep.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: October 2, 2012
    Assignee: Cobham Defense Electronic Systems Corporation
    Inventor: Peter Michael Waltz
  • Publication number: 20120153473
    Abstract: Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.
    Type: Application
    Filed: March 11, 2011
    Publication date: June 21, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Yul LEE
  • Publication number: 20090159311
    Abstract: A battery system for storing electrical power and supplying electrical power to a vehicle is disclosed. The system includes multiple battery packs, each with a plurality of cells. The cells in each battery pack are electrically connected with one another and the multiple battery packs are also electrically connected with one another to combine the total energy output of the cells of the system. The electrical connections between at least some of the cells include a severable feature, whereby the electrical connection is severed locally at the severable feature in response to an impact force that is in excess of a predetermined magnitude and/or an overcurrent/overtemperature condition.
    Type: Application
    Filed: December 22, 2008
    Publication date: June 25, 2009
    Inventors: Weixin Zheng, Jianhua Zhu, Xi Shen, Hao Hu, Qing Lai, Yingliang Ji, Liying Pan, Yuanyuan He
  • Patent number: 7237317
    Abstract: A process is provided for the production of a superconducting cable having a single cable core that contains at least one elongated superconducting element and a flexible tube that which surrounds the cable core. The process includes continuously pulling the single cable core from a supply unit, continuously pulling a metal strip from a strip supply unit and continuously forming a slotted tube around the cable care with the metal strip to form a slotted tube. The longitudinal slot of the slotted tube is welded shut corrugating the welded tube with the cable core inside the tube. The then semi-finished superconducting cable is wound in at least one turn on a cable drum, and the ends of the cable core are mechanically joined to the ends of the corrugated tube while the cable is on the cable drum.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: July 3, 2007
    Assignee: Nexans
    Inventor: Klaus Schippl
  • Publication number: 20040182598
    Abstract: Stabilization of dielectrics used in transmission lines is described. In one implementation, the transmission line includes an outer conductor, a center conductor, and a dielectric material. The dielectric material separates the outer conductor from the center conductor. The center conductor has a conductive surface with a pattern distributed thereon. The pattern is configured to prevent the dielectric material from moving when the transmission line is exposed to an extreme temperature fluctuation. The pattern increases a coefficient of friction between the center conductor and dielectric material sufficient enough to prevent undesired motion of the dielectric material. In one implementation, the pattern includes indentations that are generally, but not necessarily limited to between 0.001 and 0.004 of an inch deep.
    Type: Application
    Filed: March 17, 2003
    Publication date: September 23, 2004
    Applicant: M/A COM, Inc.
    Inventor: Peter Michael Waltz
  • Patent number: 6541708
    Abstract: The object of the present invention is to provide a helical surfaced conductor capable of effectively eliminating noise components while alternating current is turned on and capable of generating a stable magnetic field. To this end, the helical surface conductor has helical grooves or helical protrusions formed on the surface of the conductor. By energizing the helical surfaced conductor according to the present invention, noise components produced while alternating current is turned on can be effectively eliminated. And as a result, it has become possible to generate stable magnetic fields.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: April 1, 2003
    Assignee: Apollo Science Laboratory Co., Ltd.
    Inventor: Jyunrou Suehiro
  • Patent number: 6459836
    Abstract: A protective cable armor for cable having tensile stiffness and providing structural protection from invasion by foreign objects. The armor comprises a substantially planar sheet member having a length and a width and an intermittent corrugation pattern disposed therein. The intermittent corrugation pattern comprises at least one land extending across the width of the sheet member and having a defined land width. The intermittent corrugation pattern further comprises at least one, groove extending across the width of the sheet member and having a defined groove width, where the defined land width differs from the defined groove width. The land is disposed adjacent the groove. The sheet member can also be disposed in a substantially tubular form.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: October 1, 2002
    Assignee: Avaya Technology Corp.
    Inventors: Luis M. Bocanegra, Lisa A. Dixon, Michael D. Kinard, Phillip M. Thomas, Robert A. Williams
  • Patent number: 6291937
    Abstract: A high frequency coupler wherein a section of the high frequency coupler cut by a plane perpendicular to a straight line which connects the center of a joint surface between the coupler and an output portion of a matching circuit and the center of a joint surface between the coupler and the antenna has a configuration such that the section contains a plurality of line segments arranged radially from a point adjacent the center of the section. This arrangement enables the flow of currents having good symmetry, uniform distribution of currents flowing on antenna, and uniform plasma generation.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: September 18, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomohiro Okumura, Shozo Watanabe