Metal Coated On Insulation Patents (Class 174/126.4)
  • Patent number: 10595573
    Abstract: Protective gear for protecting individuals from impact forces by transferring axial forces into tangential forces directed away from the individual. The protective apparatus includes a first plate assembly including a first end and a second end; a second plate assembly including a first end and a second end; a load-bearing hinge connecting the first end of the first plate assembly to the first end of the second plate assembly; a first toothed plate attached to the second end of the first plate assembly; and a second toothed plate attached to the second end of the second plate assembly. The load-bearing hinge and the toothed plates tangentially distribute impact forces between the plate assemblies and around, rather than axially toward, the body or object being protected. The apparatus may further include sensors and electronics for detecting a physical property of the protective apparatus, and transmitting signals to a remote server.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: March 24, 2020
    Inventor: Kaydon A. Stanzione
  • Patent number: 10256434
    Abstract: A display device includes a driving circuit layer including a thin film transistor, a display layer at the driving circuit layer and overlapping a portion of the driving circuit layer, a window at the display layer, a first adhesive member between the driving circuit layer and the window, and a second adhesive member between the display layer and the window and spaced from the first adhesive member in a plane view.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 9, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyeondeuk Hwang, Soyeon Joo, Hayoung Choi
  • Patent number: 10004218
    Abstract: A termite shield for protecting wooden frame structures comprising a cellulous sheet impregnated with a non repellant insecticide. The shield is placed between the sill/mudplate and the foundation and extends upward between the siding and interior space.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: June 26, 2018
    Inventor: Robert J. P. Goodspeed
  • Patent number: 9698293
    Abstract: A solar cell module having an interconnector and a method of fabricating the same are disclosed. The solar cell module includes a plurality of solar cells and an interconnector including a first area electrically connected to one of two adjacent solar cells of the plurality of solar cells, a second area electrically connected to the other of the two adjacent solar cells, and a third area connecting the first area to the second area. At least one of the first area and the second area of the interconnector has at least one uneven surface, and the third area of the interconnector has a substantially planarized surface.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: July 4, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Jongdae Kim, Jongkyoung Hong, Giwon Lee
  • Patent number: 9496912
    Abstract: A cover panel made of sapphire is provided on a surface of electronic apparatus. The electronic apparatus includes a casing that supports a first area positioned in an edge area of the cover panel; a first component that is disposed so as to face a second area positioned further inside than the first area in the cover panel; and a supporting structure that supports a third area positioned between the first and second areas and separated from the first and second areas in the panel.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: November 15, 2016
    Assignee: KYOCERA CORPORATION
    Inventors: Mizuho Hidaka, Norikazu Morioka, Hiroyoshi Kawanishi
  • Patent number: 9357041
    Abstract: A cover panel made of sapphire is provided on a surface of electronic apparatus. The electronic apparatus includes a casing that supports a first area positioned in an edge area of the cover panel; a first component that is disposed so as to face a second area positioned further inside than the first area in the cover panel; and a supporting structure that supports a third area positioned between the first and second areas and separated from the first and second areas in the panel.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: May 31, 2016
    Assignee: KYOCERA Corporation
    Inventors: Mizuho Hidaka, Norikazu Morioka, Hiroyoshi Kawanishi
  • Patent number: 9137892
    Abstract: A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: September 15, 2015
    Assignee: SONY CORPORATION
    Inventors: Masashi Bando, Keisuke Shimizu, Koji Kadono, Nozomi Kimura, Toshiyuki Kobayashi
  • Patent number: 9123644
    Abstract: A semiconductor device includes a gate insulating film formed on a semiconductor substrate; a first conductive metal-containing film formed on the gate insulating film; a second conductive metal-containing film, formed on the first metal-containing film, to which aluminum is added; and a silicon film formed on the second metal-containing film.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: September 1, 2015
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventor: Arito Ogawa
  • Patent number: 8981226
    Abstract: The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: March 17, 2015
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Taku Sasaki, Hiroshi Natsui, Shinya Uenoyama, Ren-de Sun
  • Patent number: 8957312
    Abstract: Embodiments of submersible composite cables include a non-composite electrically conductive core cable, a multiplicity of composite cables, including a multiplicity of composite wires, around the core cable, and an insulative sheath surrounding the composite cables. Other embodiments include an electrically conductive core cable; a multiplicity of elements selected from fluid transport, electrical power transmission, electrical signal transmission, light transmission, weight elements, buoyancy elements, filler elements, or armor elements, arranged around the core cable in at least one cylindrical layer defined about a center longitudinal axis of the core cable when viewed in a radial cross section; a multiplicity of composite wires surrounding the elements in at least one cylindrical layer about the center longitudinal axis; and an insulative sheath surrounding the composite wires. The composite wires may be metal matrix or polymer composite wires.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: February 17, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Colin McCullough, Douglas E. Johnson, Michael F. Grether
  • Patent number: 8896117
    Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Youn Jo Ko, Jin Kyu Kim, Dong Seon Uh, Kil Yong Lee, Jang Hyun Cho
  • Publication number: 20140284078
    Abstract: An electrode loop structure of a touch panel mainly extends from I-shaped electrode elements serving as a base, and utilizes the annular conducting chain and gradient chain regularly cascaded together. A discontinuous resistor chain is disposed between the conducting chain and the gradient chain, wherein the conducting chain changes, by adjusting the cascaded length of and the gaps between the electrode elements, the conductor area to generate the trend of voltage drop, so that the conducting chain has the voltage regulating and compensating properties. Meanwhile, the gradient chain may also make the gradient chain have the voltage distributing uniformity by adjusting the lengths of and the gaps between the electrode elements, so that the electrode loop is effectively distributed around the electroconductive substrate to form the homogenized electric field effect, thereby satisfying the narrow-edge design requirement.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 25, 2014
    Applicant: Miracletouch Technology Inc.
    Inventor: YU-JIE LI
  • Publication number: 20140272480
    Abstract: A conductor is describing for an electrochemical energy store, including a base body, and at least one electrically conductive layer situated at least partially on the base body. The base body includes a non-electrically conductive material. In addition, an energy store is described which is equipped with the conductor, a method for manufacturing a conductor is described, and the use of the energy store equipped with the conductor in an electrical device is described.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: ROBERT BOSCH GMBH
    Inventors: Peter SCHUETZBACH, Armin GLOCK
  • Patent number: 8802990
    Abstract: A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: August 12, 2014
    Assignee: International Business Machines Corporation
    Inventors: Lawrence A. Clevenger, Zhengwen Li, Kevin S. Petrarca, Roger A. Quon, Carl J. Radens, Brian C. Sapp
  • Patent number: 8773373
    Abstract: Provided herein are a display apparatus with a touch panel to which a piezoelectric actuator may readily be mounted, and a piezoelectric actuator used in such a display apparatus with a touch panel. A support structure for supporting a piezoelectric actuator 3 on a front surface of a circuit substrate 5 is constituted from a pair of electrically conductive support members 13A, 13B which are each formed of an electrically conductive foam. The piezoelectric actuator 3 may be mounted by locating the piezoelectric actuator 3 with the pair of electrically conductive support members 13A, 13B attached thereto in a predetermined position on the circuit substrate 5, and connecting the pair of electrically conductive support members 13A, 13B to the pair of output electrodes 5A, 5B of the circuit substrate 5.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: July 8, 2014
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Tatsuo Sato, Tadao Sunahara, Yasuyoshi Nabeyama
  • Publication number: 20140151085
    Abstract: There is provided a transparent electrode comprising a supporting substrate, a first transparent electrically-conductive film provided on the supporting substrate, a transparent insulating film provided on the first transparent electrically-conductive film, and a second transparent electrically-conductive film provided on the transparent insulating film. In the transparent electrode of the present invention, all of the first transparent electrically-conductive film, the second transparent electrically-conductive film and the transparent insulating film provided therebetween comprise a metal compound, and the first transparent electrically-conductive film and the second transparent electrically-conductive film have a crystalline structure, whereas the transparent insulating film has an amorphous structure.
    Type: Application
    Filed: May 17, 2013
    Publication date: June 5, 2014
    Applicant: Panasonic Corporation
    Inventors: Takashi Ichiryu, Yoshihisa Yamashita, Seiichi Nakatani
  • Patent number: 8723043
    Abstract: This invention relates to an electrical conductor (25) which is composed at least partially of an electrically conductive material. According to the invention, at least part of the electrical conductor (25) is provided with a protective layer (11) whose specific electrical conductivity is lower, at least locally, than that of the electrically conductive material of the conductor (25).
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: May 13, 2014
    Assignee: W.E.T. Automotive Systems AG
    Inventors: Michael Weiss, Peter Tremmel, Markus Völk
  • Publication number: 20140102761
    Abstract: A material for providing an electrically conducting contact layer, the material comprising a base material being any one of Ag, Cu, Sn, Ni, a first metal salt of one thereof, or an alloy of one or more thereof. The material further comprises In within a range of 0.01 at. % to 10 at. %, Pd within a range of 0.01 at. % to 10 at. %, and, unless already the base material comprises Sn at a higher amount, Sn within a range of 0.01 at. % to 10 at. %. From such material, a contact layer (6) can be provided that, compared to a coating of only the base material, has improved corrosion resistance and low contact resistance. Also disclosed is: an electrically conducting contact element (2) that comprises a substrate (4) and coated thereon a contact layer (6) comprising the material, a method for providing the contact element (2), and uses of the material as contact layer and target material.
    Type: Application
    Filed: February 9, 2012
    Publication date: April 17, 2014
    Applicant: Impact Coatings AB
    Inventors: Henrik Ljungcrantz, Christian Ulrich, Axel Flink, Torbjörn Joelsson
  • Publication number: 20140102781
    Abstract: The present disclosure provides a power cable apparatus that comprises an elongated thermal conductor, and an electrical conductor layer surrounding at least a portion of the elongated thermal conductor. In one or more embodiments, heat generated in the power cable is transferred via the elongated thermal conductor to at least one end of the power cable. In at least one embodiment, the apparatus further comprises an electric insulation layer surrounding at least a portion of the electrical conductor layer. In some embodiments, the apparatus further comprises a thermal insulation layer surrounding at least a portion of the electric insulation layer.
    Type: Application
    Filed: October 16, 2012
    Publication date: April 17, 2014
    Applicant: THE BOEING COMPANY
    Inventor: THE BOEING COMPANY
  • Patent number: 8692119
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: April 8, 2014
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thoes, Herbert Wieder
  • Publication number: 20130314626
    Abstract: A drive substrate, including: an insulating substrate (10); an internal connection terminal (12b) made of ITO or IZO provided on the substrate (10); and a lead interconnect (14) that is connected to the connection terminal (12b) with one end thereof lying on the connection terminal and is led out to an outer edge of the insulating substrate (10) at the other end thereof, wherein a contact portion of the lead interconnect (14) with the internal connection terminal (12b) is formed of a barrier metal layer (15A) made of titanium nitride (TiN) and the nitride concentration thereof is between 35 atoms/cm2 and 65 atoms/cm2 inclusive.
    Type: Application
    Filed: February 21, 2012
    Publication date: November 28, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Katsunori Misaki
  • Publication number: 20130213690
    Abstract: The present invention provides a method for manufacturing an aluminum electrode using a solution process and an aluminum electrode manufactured thereby. The manufacturing method includes the steps of: manufacturing an aluminum precursor solution for the solution processing using AlH3 as a basic material before forming aluminum; coating the aluminum precursor solution on a substrate through the solution process and drying the aluminum precursor solution; and forming a low work function aluminum electrode through a low-temperature baking process at the temperature of at most 150° C. The method for manufacturing the aluminum electrode according to the present invention improves a thermal defect of the electrode due to a high-temperature baking process, prevents excessive loss of raw materials, and can manufacture aluminum electrodes of various sizes with area ranging from small to large at relatively low costs and by a simple process under atmospheric pressure.
    Type: Application
    Filed: December 8, 2010
    Publication date: August 22, 2013
    Applicant: KOREA INSTITUTE OF MACHINERY AND MATERIALS
    Inventors: Hye Moon Lee, Dong-Won Lee, Jung-Yeul Yun
  • Publication number: 20130213691
    Abstract: An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 22, 2013
    Inventors: Kyoung Soo PARK, Woo Suk LEE, Woo Jun LIM, Kyung Jin LEE, Bong Yong KIM, Jin Seong PARK, Dong Seon UH, Youn Jo KO, Jang Hyun CHO, Sang Sik BAE, Jin Kyu KIM
  • Publication number: 20130183581
    Abstract: An improved substrate is disclosed for an electrode of an electrochemical cell. The improved substrate includes a core material surrounded by a coating. The coating is amorphous such that the coating includes substantially no grain boundaries. The core material may be one of lead, fiber glass, and titanium. The coating may be one of lead, lead-dioxide, titanium nitride, and titanium dioxide. Further, an intermediate adhesion promoter surrounds the core material to enhance adhesion between the coating and the core material.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Energy Power Systems LLC
    Inventors: Subhash Dhar, Fabio Albano, Srinivasan Venkatesan, William Koetting, Lin Higley
  • Patent number: 8476530
    Abstract: A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: July 2, 2013
    Assignee: International Business Machines Corporation
    Inventors: Lawrence A. Clevenger, Zhengwen Li, Kevin S. Petrarca, Roger A. Quon, Carl J. Radens, Brian C. Sapp
  • Publication number: 20130133925
    Abstract: Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.
    Type: Application
    Filed: October 22, 2012
    Publication date: May 30, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Samsung Electro-Mechanics Co., Ltd.
  • Patent number: 8426735
    Abstract: The present invention relates to a compliant deformable conductor and a method for producing the same, comprising a wire or a tube made of an electrically insulating material and one or more electrical leads applied on said wire or tube, wherein one or more of said leads comprise a plurality of islets of conductive material, forming an electrically conductive layer providing electrical conduction and/or electrical percolation.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: April 23, 2013
    Assignee: Neurotech
    Inventors: Michel Troosters, Stephane Befahy, Sami Yunus, Patrick Bertrand
  • Publication number: 20130046368
    Abstract: Thin conductive metal coatings suitable for flexible nonmetal fine wires and leads are described. Polymer clad silica fiber cores are produced by plasma coating with single or dual layers of metals such as silver, gold or titanium to provide micro thin leads such as those used for pacemakers and fracture resistant aircraft wires that are both conductive and resistant to flexing breakage. The metal surfaces can be used to transmit analog signals while the nonmetal cores can be designed to transmit digital signals. Select deposition conditions can produce nanorough metal coating surfaces which promote cell adhesion so that tissue scarring in vivo is greatly reduced.
    Type: Application
    Filed: October 3, 2012
    Publication date: February 21, 2013
    Inventor: DANIEL M. STOREY
  • Publication number: 20130043058
    Abstract: An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° C. and not more than 150° C., a halogen-free flame retardant at a rate of not less than 100 parts by mass and not more than 250 parts by mass relative to 100 parts by mass of the copolyamide resin, and a carbodiimide compound soluble in the solvent at the room temperature (25° C.), and a conductor adhesion layer laminated on the adhesive layer.
    Type: Application
    Filed: March 29, 2012
    Publication date: February 21, 2013
    Applicant: HITACHI CABLE, LTD.
    Inventor: Daisuke SHANAI
  • Patent number: 8367573
    Abstract: A glass composition substantially free from lead and bismuth and containing vanadium oxide and phosphor oxide as main ingredients, wherein the sintered glass of the glass composition exhibits 109 ?cm or more at 25° C.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: February 5, 2013
    Assignee: Hitachi Powdered Metals Co., Ltd.
    Inventors: Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Hiroki Yamamoto, Hiroshi Yoshida, Shinji Yamada, Katsumi Mabuchi
  • Publication number: 20130028065
    Abstract: A flexible cable is provided. The flexible cable includes a base film having a band shape, a plurality of wiring layers disposed on the base film and extending in one direction, and a plurality of elasticity-adjusting patterns attached to a portion of the base film and partially adjusting the elasticity of the flexible cable.
    Type: Application
    Filed: February 13, 2012
    Publication date: January 31, 2013
    Inventors: Young-bin Kim, Young-sun Jung
  • Patent number: 8330046
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: December 11, 2012
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thös, Herbert Wieder
  • Publication number: 20120237819
    Abstract: An electrode assembly includes a porous polymer layer, a conductive layer on each of a first and a second surface of the porous polymer layer, and an active material layer on each of the first and second surfaces of the porous polymer layer.
    Type: Application
    Filed: September 21, 2011
    Publication date: September 20, 2012
    Inventor: Chang-Bum Ahn
  • Patent number: 8232479
    Abstract: There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 31, 2012
    Assignee: Kyocera Corporation
    Inventor: Hisashi Satou
  • Patent number: 8232475
    Abstract: A nano-hole array for improving contact conductance of a conductor element that consists of a first layer and a second layer is provided. The nano-hole array formed between the first and second layers comprises a plurality of holes. The contact conductance of the conductor element is enhanced by reducing the hole size of the hole array, increasing the occupation rate of the hole array, and performing thermal annealing.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: July 31, 2012
    Assignee: National Taiwan University
    Inventors: Jong-Lih Li, Chieh-Hsiung Kuan
  • Publication number: 20120168201
    Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.
    Type: Application
    Filed: August 31, 2011
    Publication date: July 5, 2012
    Inventors: Young Ah SONG, Byoung Jin Chun, Dong Hoon Kim, Sung Il Oh
  • Publication number: 20120125660
    Abstract: A process of forming optically clear conductive metal or metal alloy thin films is provided that includes depositing the metal or metal alloy film on a polycrystalline seed layer that has been deposited directly on a nucleation layer of metal oxide comprising zinc oxide. Also conductive films made by this process are provided. In some embodiments, the metal alloy thin films include silver/gold alloys.
    Type: Application
    Filed: July 26, 2010
    Publication date: May 24, 2012
    Inventor: Clark I. Bright
  • Publication number: 20120119626
    Abstract: To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/?m) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 ?m or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/?m) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.
    Type: Application
    Filed: January 26, 2012
    Publication date: May 17, 2012
    Applicant: TOKAI RUBBER INDUSTRIES, LTD.
    Inventors: Wataru TAKAHASHI, Hitoshi YOSHIKAWA, Jun KOBAYASHI
  • Publication number: 20120097424
    Abstract: A method for manufacturing a transparent electrode using a print-based metal wire is provided, which enables the mass production of the transparent electrode as a substitute for ITO at low cost. The manufacturing method includes: the first step of forming a metal wire in a pattern set for a transparent substrate; and the second step of coating a solution type transparent electrode on the transparent substrate.
    Type: Application
    Filed: September 1, 2011
    Publication date: April 26, 2012
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Jeong-Dai JO, Jong-Su YU, Jung Su KIM, Seong-Man YOON, Sung Woo BAE, Dong-Soo KIM
  • Publication number: 20120073859
    Abstract: A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate.
    Type: Application
    Filed: September 24, 2010
    Publication date: March 29, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Wai Yew Lo, Yit Meng Lee, Lan Chu Tan
  • Patent number: 8076583
    Abstract: Disclosed herein is a light-transmitting electric conductor including, on a surface of a light-transmitting support, a conductive material in which a multiplicity of carbon nanolinear structures are accumulated in two dimensions while making partial contact with each other, wherein the conductive material is a light-transmitting conductive material composed only of the carbon nanolinear structures, and direct bonds are formed between the surface of the light-transmitting support and the carbon nanolinear structures making contact with the surface, and between the carbon nanolinear structures making contact with each other.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: December 13, 2011
    Assignee: Sony Corporation
    Inventor: Keisuke Shimizu
  • Publication number: 20110266129
    Abstract: An electrical contact (1) according to the present invention comprises a core body (3) made from elastic material and having outer, inner and side surfaces, a metal mesh layer (5) extending the outer and side surfaces of the core body (3) and a bonding layer (7) covering the edge of the metal mesh layer (5) at the side surface of the core body (3). Since the metal mesh layer (5) is provided to the outer surface (contact surface) of the core body (3), the outer surface comes in contact with the other contact surface with a number of contact points. By providing the bonding layer (7), the edge (cut surface) of the metal mesh (5) is rarely exposed to air and the rusting which occurs easily at the edge can be prevented. And, the bonding layer (7) has a function for preventing the key top material from coming into around the outer surface of the electrical contact at the process for attaching the contact (1) to the key top.
    Type: Application
    Filed: December 11, 2009
    Publication date: November 3, 2011
    Applicant: COVAC CO., LTD.
    Inventor: Shuji Inagaki
  • Patent number: 7969021
    Abstract: A bonding wire for a semiconductor device has a core wire and a periphery comprising a conductive metal mainly composed of an element common to both and/or an alloy or alloys of said metal and, between the core wire and the periphery, a diffusion layer or an intermetallic compound layer composed of the elements constituting the core wire and the periphery and a bonding wire for a semiconductor device characterized by having a core wire comprising a first conductive metal or an alloy mainly composed of the first conductive metal, a periphery comprising a second conductive metal different from the first conductive metal of the core wire or an alloy mainly composed of the second conductive metal, and, between the core wire and the periphery, a diffusion layer or an intermetallic compound layer and a method of producing the same.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: June 28, 2011
    Assignee: Nippon Steel Corporation
    Inventors: Tomohiro Uno, Shinichi Terashima, Kohei Tatsumi
  • Patent number: 7956287
    Abstract: A touch panel-use transparent conductive molded product having a conductive layer excellent in wear resistance and flexing resistance, small in surface resistivity change when the touch panel is in use, and free from a change in transmitted light hue, and a touch panel using it. The touch panel-use transparent conductive molded product comprises a fine-conductive-fibers (4)-containing, transparent conductive layer (12) formed on at least one surface of a transparent substrate (11), and the touch panel uses the above transparent conductive molded product as an electrode. The fine conductive fibers in the transparent conductive layer (12) are dispersed without being aggregated, and touch each other while being dispersed with each of them separated from each other or each bundle of several fibers separated from each other. Therefore, it is possible to control a surface resistivity to 104?/? or smaller, and a conductive layer light beam transmittance at a wavelength of 550 nm to 75% or larger.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: June 7, 2011
    Assignee: Takiron Co., Ltd.
    Inventors: Ryuji Takayama, Hidemi Ito, Hitoshi Masago, Junichi Nakanishi
  • Patent number: 7931973
    Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: April 26, 2011
    Assignee: Princo Corp.
    Inventor: Chih-kuang Yang
  • Publication number: 20110061709
    Abstract: The invention relates to a structural element for a solar panel, comprising at least one layer of dielectric material, characterized in that it comprises conductive means, which are in contact with said layer of dielectric material, and an electrical connection means for connecting the conductive means to the earth of said structure.
    Type: Application
    Filed: June 4, 2010
    Publication date: March 17, 2011
    Inventor: Denis Payan
  • Publication number: 20100319962
    Abstract: A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.
    Type: Application
    Filed: June 22, 2009
    Publication date: December 23, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lawrence A. Clevenger, Zhengwen Li, Kevin S. Petrarca, Roger A. Quon, Carl J. Radens, Brian C. Sapp
  • Publication number: 20100294539
    Abstract: It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period. The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.
    Type: Application
    Filed: October 24, 2008
    Publication date: November 25, 2010
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Taku Sasaki, Hiroshi Natsui, Shinya Uenoyama, Ren-de Sun
  • Publication number: 20100294538
    Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.
    Type: Application
    Filed: May 22, 2009
    Publication date: November 25, 2010
    Inventor: Cheng-Feng CHIANG
  • Publication number: 20100258348
    Abstract: An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 14, 2010
    Applicant: Bridge Semiconductor Corporation
    Inventors: Joshua Ziff, Joseph R. Acquaviva, Chien Hung Wu, William Jan, Charles Buenzli, Nelson Kuan