Glass-to-metal Seal Patents (Class 174/152GM)
  • Patent number: 6156978
    Abstract: An electrical feedthrough (34) is prepared by furnishing an aluminum oxide feedthrough plate (70) and at least one feedthrough pin (80) having a length greater than the thickness of the feedthrough plate (70). A pin bore (78) is formed through the feedthrough plate (70) for each feedthrough pin (80). Each pin bore (78) has a pin bore (78) size greater than the feedthrough pin (80) size, preferably by an amount no greater than that required to permit the penetration of a brazing metal (88) between the pin bore (78) and the feedthrough pin (80). Each feedthrough pin (80) is inserted into its respective pin bore (78) and brazed into place utilizing a metallic active braze alloy (88) and no glassy seal. The feedthrough plate (70) may be simultaneously brazed to a package structure (22) using active or nonactive brazing.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: December 5, 2000
    Assignee: Raytheon Company
    Inventors: Leonard E. Peck, Timothy S. Romano, Tom K. Evans, Gary B. Hughes, Karl H. Neumann
  • Patent number: 6140592
    Abstract: An improved fuse associated current conducting pin and sealing structure for a hermetic terminal assembly wall wherein the sealing member has a preselected coefficient of expansion compatible with that of the pin and wall and a softening point temperature in excess of the conducting temperature of the pin surface occasioned by fuse melting.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: October 31, 2000
    Assignee: Emerson Electric Co.
    Inventors: F. Dieter Paterek, Richard L. Teaford
  • Patent number: 6114633
    Abstract: A hermetic terminal including a metallic wall having at least one opening therein through which a conductor pin extends, the conductor pin having a discontinuity on its end so that the relative electrical rating of the hermetic terminal can be ascertained through visual inspection of the terminal. A method is provided for use in a production facility whereby the relative electrical capacity of conductor pins, partially assembled hermetic terminals and completed hermetic terminals can be visually distinguished.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: September 5, 2000
    Assignee: Tecumseh Products Company
    Inventor: David M. Duhancik
  • Patent number: 6096979
    Abstract: A primarily polycrystalline but partially amorphous electrical insulator can hermetically seal first and second spaced electrical terminals, one made from an anodized aluminum and the second made from a beryllium copper, Kovar, an alloy of iron and cobalt or an alloy of beryllium, copper, nickel and gold. Nickel may be diffused into the beryllium copper and a noble metal may be deposited on the nickel. The insulator provides a flat meniscus to abut a corresponding electrical insulator in a cable. The insulator may provide an electrical impedance of approximately 50 ohms, an electrical resistivity greater than approximately 10.sup.18 ohms and a dielectric constant of approximately 6.3. The insulator operates satisfactorily in a frequency range to approximately 40 gigahertz.
    Type: Grant
    Filed: July 19, 1993
    Date of Patent: August 1, 2000
    Assignee: Kyle Research Laboratories
    Inventor: James C. Kyle
  • Patent number: 6076017
    Abstract: A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.
    Type: Grant
    Filed: February 11, 1998
    Date of Patent: June 13, 2000
    Assignee: Medtronic, Inc.
    Inventors: William J. Taylor, John D. Wright, Joseph F. Lessar, Gary F. LaBree
  • Patent number: 6031710
    Abstract: A capacitive filter feedthrough assembly and method of making same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by an electrically conductive combination of adhesive, brazing and soldering. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: February 29, 2000
    Assignee: Medtronic, Inc.
    Inventors: William D. Wolf, Mary A. Fraley, Lynn M. Seifried, Ronald F. Hoch
  • Patent number: 5998733
    Abstract: An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass feedthrough seal between the graphite-aluminum MMC material and one or more electrical feedthrough pins or wires connected to the electronic component. The glass feedthrough seal comprises a low melting point, low coefficient of expansion (CTE) solder glass, such as lead zinc borosilicate, effective to form a hermetic glass-to-composite seal by a combined chemical and mechanical compression sealing force. The vitreous solder glass preferably exhibits a CTE in the range of about 41 to about 78 ppm/degree C. and a melting temperature in the range of about 300 to about 500 degrees C.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: December 7, 1999
    Assignee: Northrop Grumman Corporation
    Inventor: Carl R. Smith
  • Patent number: 5994975
    Abstract: A durable, broad-band low insertion loss RF feedthrough is formed of a straight conductor (5) centrally supported by, hermetically sealed to and axially extending through the center of a strong, rigid, impervious ceramic disk (3). The ceramic disk is hermetically sealed, directly or indirectly, to the metal barrier (11) through which the feedthrough is to propagate RF energy. The new ferrule and ferrule-less ceramic metal RF feedthroughs avoid the use of glass, conventional in existing feedthroughs. The novel feedthrough serves as the principal element of a microwave microstrip line to waveguide transition.
    Type: Grant
    Filed: April 28, 1998
    Date of Patent: November 30, 1999
    Assignee: TRW Inc.
    Inventors: Barry R. Allen, Randall J. DuPrey, George G. Pinneo, Daniel T. Moriarty
  • Patent number: 5940279
    Abstract: A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite side of the support element. The connector pins are glass-mounted into pin blocks produced independently of the support element. The pin blocks are inserted into associated cutouts of the support element and fastened therein. The arrangement and number of the connector pins in the pin blocks can thereby be flexibly adapted to particular requirements with no need for modifications to the design of the support element. The material and the geometrical properties of the pin blocks can be optimally adapted to the glass-mounting process of the connector pins, while the material of the support element can be matched to the coefficient of thermal expansion of the attached circuit support.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: August 17, 1999
    Assignee: Robert Bosch GmbH
    Inventors: Lothar Gademann, Franz Schmich, Reinhold Danner, Bernd Maihoefer
  • Patent number: 5936494
    Abstract: The waveguide window assembly disclosed herein is particularly adapted for use in conjunction with a waveguide housing of a high expansion material such as aluminum. The window is formed of a glassy material having a relatively low coefficient of thermal expansion and is provided with a frame of a material having a matching coefficient. The housing is provided with an opening for receiving the frame with substantial clearance. A wall member is interposed between the frame and the edges of the opening with solder filling the space between the wall member and the frame and also the space between the wall member and the edges of the opening, the wall member being constructed of a material having a coefficient of thermal expansion which is intermediate those of the housing material and the frame material.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: August 10, 1999
    Assignee: Special Hermetic Products, Inc.
    Inventor: John A. Pollock
  • Patent number: 5929373
    Abstract: A high voltage feed through supplies power to a device through a passage in a wall of a vacuum chamber. The feed through includes a ceramic body comprising a first brazing surface, a second brazing surface, and a central passage for a conductor, a power source connector brazed to the first brazing surface, and a mounting flange brazed to the second brazing surface, wherein the first and second brazing surfaces are positioned to reduce tensile forces on brazed connections. The brazing surfaces are preferably coplanar to reduce the tensile forces, or angled to place residual compressive forces on the brazed connections. The tensile forces on co-planar surfaces are further reduced by brazing ceramic rings to the power source connector and the mounting flange opposite brazed connections to the ceramic body of the feed through.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: July 27, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Tony Schiavo, Jeff Brodine, Dan Marohl
  • Patent number: 5917150
    Abstract: A mineral-insulated cable termination offering hermetic sealing of the cable end at temperatures in excess of 300.degree. C. having a metal spacer or extension sealed to the cable sheath which matches the cable conductor in thermal expansion, and a high-expansion, refractory glass, ceramic, or glass-ceramic seal filling the gap between and sealed to each of the spacer and the cable sheath, the termination offering stable protection for the cable insulation under corrosive high-temperature operating conditions.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: June 29, 1999
    Assignee: Corning Incorporated
    Inventors: Leslie E. Hampton, G. Daniel Lipp, Robert J. Locker
  • Patent number: 5908334
    Abstract: In accordance with the present invention, two types of polymeric dielectric systems useful in construction of a high-temperature electrostatic chuck are disclosed. Further, a high temperature power connection for transmitting power from a supply source to a conductive extension from the electrostatic chuck conductive layer is described. The first polymeric dielectric system provides for the use of polyimide films which do not require an adhesive to adhere to an underlying substrate support platen. The self-adhering polyimide film comprises from one to three layers of polyimide material, wherein at least one outer layer of polyimide material is thermoplastic in nature, for the purpose of adhesion and/or encapsulation. When the film comprises two layers, one of the layers is a non-thermoplastic polyimide having an increased glass transition temperature of about 350.degree. C. or greater.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: June 1, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Aihua Chen, Vijay Parkhe, Sergio Edelstein
  • Patent number: 5870272
    Abstract: A capacitive filter feedthrough assembly and method of making the same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by an electrically conductive combination of solder and brazing. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.
    Type: Grant
    Filed: May 6, 1997
    Date of Patent: February 9, 1999
    Assignee: Medtronic Inc.
    Inventors: Lynn M. Seifried, Joseph F. Lessar, William D. Wolf, Mary A. Fraley, Kevin K. Tidemand, David B. Engmark, Ronald F. Hoch, Craig L. Wiklund
  • Patent number: 5866851
    Abstract: A hermetically sealed implantable medical device is provided with a multi-pin arrangement including selected glass to metal or ceramic to metal seals for a feedthrough of the compression seal or matched seal type.
    Type: Grant
    Filed: July 28, 1997
    Date of Patent: February 2, 1999
    Assignee: Medtronic Inc.
    Inventors: William J. Taylor, Lynn M. Seifried, Douglas Weiss, Joseph F. Lessar
  • Patent number: 5867361
    Abstract: A capacitive filter feedthrough assembly and method of making the same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by electrically conductive adhesive or brazing, or a combination of adhesive and brazing. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: February 2, 1999
    Assignee: Medtronic Inc.
    Inventors: William D. Wolf, Mary A. Fraley, Lynn M. Seifried
  • Patent number: 5817984
    Abstract: A hermetically sealed implantable medical device is provided with a multi-pin arrangement including selected glass to metal or ceramic to metal seals for a feedthrough of the compression seal or matched seal type.
    Type: Grant
    Filed: July 28, 1995
    Date of Patent: October 6, 1998
    Inventors: William J. Taylor, Lynn M Seifried, Douglas Weiss, Joseph F. Lessar
  • Patent number: 5643694
    Abstract: An electrical feedthrough apparatus, for an electrochemical cell, is formed by a method that includes forming a feedthrough subassembly by providing a ferrule having an exterior surface and an interior opening about a longitudinal axis therethrough. The interior opening extends along the longitudinal axis of the ferrule from a first end of the ferrule to a second end of the ferrule. An electrical conductor is glassed in the opening of the ferrule. A locating member is positioned onto the ferrule in contact with the exterior surface of the ferrule in proximity to the first end of the ferrule and the locating member has a length extending beyond the second end of the ferrule. The feedthrough subassembly is then located at a position in a mold using the locating member and held in the position with the use of the locating member while insulating material is injected into the mold.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: July 1, 1997
    Assignee: Medtronic, Inc.
    Inventor: Bernard F. Heller, Jr.
  • Patent number: 5584716
    Abstract: A hermetic terminal assembly has a plurality of conductor pins which define integral fusible links (36). A unique plug is provided which both separates the individual wires (70) leading to the conductor pins and allows, in cooperation with a fence or with the shell (21) of the compressor (10), for the restriction of access to the conductor pins while the conductor pins are connected to a power source. This unique plug also allows for the positioning of the integral fusible link on the outside of the shell (12) thus resolving the problems associated with compromising the integrity of the shell (12) upon separating of the fuse-like link (36). In addition, the plug insures that the conductor pins are maintained in an electrical isolated fashion should the fuse-like link (36) separate. The fence can be formed as a separate member or alternately to be integral with the terminal body.
    Type: Grant
    Filed: July 14, 1994
    Date of Patent: December 17, 1996
    Assignee: Copeland Corporation
    Inventor: Ernest Bergman
  • Patent number: 5563562
    Abstract: A miniature coaxial connector with a mating end for mating to another connector and a termination end for direct connection to a circuit, provides a closely controlled impedance along its entire length. The connector comprises a coax assembly (14, FIG. 2) having a glass bead (120), a conductive pin (28) projecting through the bead, and a conductive impedance member (40) surrounding the bead. The coax assembly is installed in a connector body (12) having a hollow front mating end portion (50) and a rear end portion (52). The impedance member of the coax assembly has a flange (46) lying on the front face (34) of the bead, and the rear of the body includes a precision passage (60) with the pin projecting completely through the passage and with only air between the pin and passage walls. This arrangement provides precision alignment of the pin with grounded conductive surfaces surrounding it. The flange provides a precision transformer at the front of the pin where it will engage a socket of a mating connector.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: October 8, 1996
    Assignee: ITT Industries, Inc.
    Inventor: Richard J. Szwec
  • Patent number: 5557074
    Abstract: A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.
    Type: Grant
    Filed: December 8, 1994
    Date of Patent: September 17, 1996
    Assignees: Fujitsu Limited, Shinko Electric Industries Co., Ltd.
    Inventors: Takaharu Miyamoto, Fumio Miyagawa, Yoji Ohashi, Tamio Saito
  • Patent number: 5539611
    Abstract: This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient of thermal expansion less than that of the insulating part (1), wherein at least one end of the lead, if it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, or, if it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material (5'), since in the liquid phase, the active brazing material moves into the gap between the wall of the hole (2) and the lead (4, 17) due to capillary action.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: July 23, 1996
    Assignee: Endress u Hauser GmbH u Co.
    Inventors: Frank Hegner, Thomas Klahn
  • Patent number: 5493073
    Abstract: A hermetic terminal assembly structure adapted to be sealed along the periphery of an aperture in a chamber defining housing wall of a hermetically sealed chamber including a terminal pin sealed by a coalescent aperture seal in the aperture to include inner and outer pin portions, each of which pin portions is surrounded by one of a pair of sleeve members sealingly cooperative with the aperture seal.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: February 20, 1996
    Assignee: Emerson Electric Co.
    Inventor: Glenn A. Honkomp
  • Patent number: 5471015
    Abstract: An improved fuse associated current conducting pin and sealing structure for a hermetic terminal assembly wall wherein the sealing member has a preselected coefficient of expansion compatible with that of the pin and wall and a softening point temperature in excess of the conducting temperature of the pin surface occasioned by fuse melting.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: November 28, 1995
    Assignee: Emerson Electric Co.
    Inventors: F. Dieter Paterek, Richard L. Teaford
  • Patent number: 5430257
    Abstract: An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: July 4, 1995
    Assignee: TRW Inc.
    Inventors: James C.-K. Lau, Kenneth Lui, James A. Hathaway, Ronald A. DePace
  • Patent number: 5406444
    Abstract: Tantalum feedthrough conductor pins are provided with a thin, vacuum deposited metal coating to control oxidation growth during feedthrough fabrication. The coated feedthrough pins are incorporated into a feedthrough which includes a capacitive structure in electrical contact with the coated pin.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: April 11, 1995
    Assignee: Medtronic, Inc.
    Inventors: Lynn M. Selfried, Susan A. Tettemer
  • Patent number: 5405272
    Abstract: Electrical connectors are provided for enabling electrical access through a side wall of a microelectronic, sensor, or fiber optic package housing while maintaining hermeticity. These connectors include a connector body having an aperture therethrough and a coefficient of thermal expansion which is different than that of the housing. The connectors include a connector pin disposed through the aperture of the connector body and hermetically sealed to the connector body with an insulating composition or a ceramic insert bonded to the connector pins. Flange means are also provided for joining the hermetic electrical connector to the microelectronic package housing. The flange means includes upper and lower flanges metallurgically bonded together and comprising first and second metallic compositions respectively. The first composition is hermetically bonded to the connector body with a fusion weld having a heat-affected-zone which does not significantly affect the hermetic seals around the connector pins.
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: April 11, 1995
    Assignee: Balo Precision Parts Inc.
    Inventor: Edward J. Rapoza
  • Patent number: 5391061
    Abstract: A hermetic terminal cover is arranged to be mounted onto a hermetic terminal of, such as, a closed-type compressor. The hermetic terminal cover has terminal caps for covering respective terminal strips of the hermetic terminal. Each terminal strip includes a terminal pin fixedly passing through a metallic base with an insulator interposed therebetween. The terminal caps are mutually connected by flexible ribs each having a curved shape, and preferably an arc shape. Accordingly, each terminal cap has a high degree of positional or displacement freedom to facilitate mounting of the terminal cap onto the corresponding terminal strip. Further, each terminal cap has an increased thickness at a portion corresponding to an exposed surface of the insulator holding the terminal pin. Accordingly, adverse affection of metallic powders, such as, generation of short circuits and sparks between the terminal pins and the metallic base is effectively prevented.
    Type: Grant
    Filed: March 12, 1993
    Date of Patent: February 21, 1995
    Assignee: Matsushita Refrigeration Company
    Inventors: Tatsuyuki Iizuka, Etsuro Suzuki
  • Patent number: 5374786
    Abstract: A package for electrical circuitry and method of making same wherein the package is provided with apertured ceramic side walls. Ceramic layers, which have been previously co-fired together and have an aperture therethrough for receiving a copper-based lead, are positioned in each of the apertures along with a copper-based lead. A Kovar braze washer, which has an aperture therein having approximately the same dimensions as the outside dimensions of the lead is positioned over the lead and against the ceramic layers and brazed to these layers and the lead to provide an hermetic seal. A good electrical conductor is then brazed to the portion of the lead extending external to the package.
    Type: Grant
    Filed: March 18, 1994
    Date of Patent: December 20, 1994
    Assignee: Texas Instruments Incorporated
    Inventor: William C. Weger
  • Patent number: 5367125
    Abstract: An insulating electrical feed-through connector extending through a wall of aluminum is obtained by using a sintered sleeve comprising phosphate glass in which a conductive pin is inserted. The sleeve is raised to a firing temperature in excess of the dilatometric softening temperature of the vitreous material in the presence of a first effective quantity of alumina between the sleeve and the wall and of a second effective quantity of nickel oxide between the sleeve and the pin, which makes it possible to achieve a simultaneous and direct hermetic sealing of the sleeve to the wall and of the pin to the sleeve.
    Type: Grant
    Filed: January 4, 1994
    Date of Patent: November 22, 1994
    Assignee: Dassault Electronique
    Inventors: Paul Viret, Bernard Ledain
  • Patent number: 5308925
    Abstract: A conductive pin assembly arrangement for a wall opening of a machine housing including a removable plate in sealed relation to the wall opening, the plate having at least one opening extending therethrough, and a conductive sleeve and pin assembly extending longitudinally through the plate in sealed relation to the plate with one end of the pin in the housing and the opposite end outside the housing.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: May 3, 1994
    Assignee: Emerson Electric Co.
    Inventors: F. Dieter Paterek, Martin S. Russell
  • Patent number: 5298683
    Abstract: Connectors are provided which afford a substantial material match between two dissimilar metals, such as between an electronics package and the connector as well as between connector components to form an electronics assembly. In this manner, the thermal expansion properties of the electronics assembly components to be interfaced are also substantially matched, thereby allowing maintenance of a hermetic feedthru formed therebetween for a sustained period of operation. Additionally, the substantially matched component materials permit the use of simple and cost effective interfacing procedures in assembly construction.
    Type: Grant
    Filed: January 7, 1992
    Date of Patent: March 29, 1994
    Assignee: Pacific Coast Technologies
    Inventor: Edward A. Taylor
  • Patent number: 5273203
    Abstract: A hermetic seal is provided for a conductive feedthrough through a thin ceramic component by a platinum or palladium lead by sealing the gap between the lead and the ceramic with a copper-copper oxide eutectic. The lead may have a copper coating on it prior to and subsequent to formation of the copper-copper oxide eutectic.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: December 28, 1993
    Assignee: General Electric Company
    Inventor: Harold F. Webster
  • Patent number: 5267684
    Abstract: A reservoir for the introduction of a preform of solid brazing filler metal is formed by a recess in the outer wall of an electronic component package and opens into a package through-hole. A lead-wire and bushing are placed within the through-hole with allowance for a clearance space so as to permit liquefaction and capillary diffusion of the filler metal within the space.
    Type: Grant
    Filed: November 15, 1991
    Date of Patent: December 7, 1993
    Assignee: Egide S.A.
    Inventors: Marc Catheline, Jean-Noel Dody, Jean-Pierre Maquaire
  • Patent number: 5227587
    Abstract: A hermetic terminal assembly arrangement for an opening extending through a wall housing panel wherein the opening periphery is threaded to adjustably receive an externally threaded annular sleeve through which a current conducting pin extends, the terminal assembly arrangement including a first seal between the pin and annular sleeve and a second compressible seal between the sleeve and housing.
    Type: Grant
    Filed: May 13, 1991
    Date of Patent: July 13, 1993
    Assignee: Emerson Electric Co.
    Inventor: F. Dieter Paterek
  • Patent number: 5223672
    Abstract: A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: June 29, 1993
    Assignee: TRW Inc.
    Inventors: George G. Pinneo, Marijan D. Grgas
  • Patent number: 5194697
    Abstract: A mechanically heavily loadable and high-vacuum-tight feedthrough connection through a hole (2) of a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, is disclosed which can be produced in a single high-temperature step and is thus inexpensive. It is designed as a terminal lead (4) covered with active solder and soldered into the hole, the terminal lead having a coefficient of thermal expansion less than that of the insulating part (1). The feedthrough connection is preferably used in a capacitive pressure sensor (10) having a diaphragm (11) and a substrate (12) which have spaced-apart, flat inner surfaces which are provided with at least one conductive layer (14, 15) for forming at least one capacitor and are electrically connected to the respective rear side via the feedthrough connection.
    Type: Grant
    Filed: March 20, 1990
    Date of Patent: March 16, 1993
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Thomas Klahn
  • Patent number: 5122621
    Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.
    Type: Grant
    Filed: May 7, 1990
    Date of Patent: June 16, 1992
    Assignee: Synergy Microwave Corporation
    Inventors: Meta Rohde, Shankar R. Joshi
  • Patent number: 5110307
    Abstract: Electrical connectors are provided for enabling electrical access through a side wall of a microelectronic, sensor, or fiber optic package housing while maintaining hermeticity. These connectors include a connector body having an aperture therethrough and a coefficient of thermal expansion which is different than that of the housing. The connectors include a connector pin disposed through the aperture of the connector body and hermetically sealed to the connector body with an insulating composition or a ceramic insert bonded to the connector pins. Flange means are also provided for joining the hermetic electrical connector to the microelectronic package housing. The flange means includes upper and lower flanges metallurgically bonded together and comprising first and second metallic compositions respectively. The first composition is hermetically bonded to the connector body with a fusion weld having a heat-affected-zone which does not significantly affect the hermetic seals around the connector pins.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: May 5, 1992
    Assignee: Balo Precision Parts Inc.
    Inventor: Edward J. Rapoza
  • Patent number: 5096769
    Abstract: A strengthened article formed from a ceramic having a bore through a portion thereof and with a metal rod adhered by heat-settable adhesive to the ceramic within the bore thereof. The metal rod has a greater coefficient of thermal expansion than the ceramic thereby placing this ceramic in compression upon heat setting and cooling of the overall article.
    Type: Grant
    Filed: July 7, 1989
    Date of Patent: March 17, 1992
    Assignee: Alsimag Technical Ceramics, Inc.
    Inventors: Glenn Morgan, James C. Welborn, Jr.
  • Patent number: 5046242
    Abstract: A cochlear prosthetic package having a cup-shaped titanium case with a ceramic plate; a plurality of hermetically-sealed feedthroughs are formed in the plate by sintering the plate with hollow metallic tubes located in plate holes and then sealing at least one end of each tube. An electrode cable connector is provided which allows removal and replacement of a case even in the presence of body fluids. A telemetry coil is contained in a metallic tube which extends out of the case; the coil-containing tube has its two ends hermetically-sealed to the case by ceramic insulating bushings.
    Type: Grant
    Filed: May 11, 1989
    Date of Patent: September 10, 1991
    Assignee: Commonwealth of Australia
    Inventor: Janusz Kuzma
  • Patent number: 5041019
    Abstract: In accordance with this invention, a hermetically sealed transition joint for use with a microwave package which has a receptacle including a side wall made of a first weldable material with a feed-through opening therein. The transition joint includes a first layer of a first material sized to extend across the feed-through opening and weldable to the side wall to form a hermetic seal. A second layer of a second material is explosively bonded to the first layer and sized to match and be received within the feed-through opening. A connector opening extends through the first and second layers. A pin connector unit made of the second material and having electrical pins extending therethrough is sized to fit within the connector opening and is welded to the second layer to form a hermetic seal. The first layer may be aluminum or aluminum alloy and the second layer can be any one of Kovar, cold rolled steel, stainless steel or iron-nickel alloy. Conveniently, the welding is done by laser welding.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: August 20, 1991
    Assignee: Explosive Fabricators, Inc.
    Inventors: William F. Sharp, Prem R. Hingorany, Howard W. Mansell
  • Patent number: 5017740
    Abstract: A hermetic terminal assembly for a housing including a fuse-like area positioned in the outer pin segment of a terminal pin extending in sealed relation through the body member of the terminal assembly which body member can be sealed to a housing wall, the fuse-like area in the outer pin segment being covered with a thermally decomposable coating which in the event of decomposition includes an arc suppressant. A pin guard and lead wire end connection securing device is provided to protect the outer pin segment and to secure the lead wire end connection thereto.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: May 21, 1991
    Assignee: Emerson Electric Co.
    Inventors: Glenn A. Honkomp, Eugene H. Tingley, Thomas O. McNay, Benjamin Bowsky
  • Patent number: 4984973
    Abstract: A hermetic terminal for carrying electric current into the housing of a hermetic compressor, including a cup-shaped metallic body member having a plurality of metallic conductor pins extending therethrough which are electrically insulated from the body member by hermetic glass seals. The body member includes a closed end having an inwardly facing contoured end surface, to which a correspondingly contoured contacting surface of an electrically insulating cap member is secured by means of a uniform layer of electrically insulating bonding material therebetween. The pins extend through passages in the cap member, whereby the cap member defines an oversurface distance between the pins and the body member. A portion of the oversurface distance is protected from contaminants which the compressor housing by means of an annular gap between the outer periphery of the cap member and the sidewall of the body member, and by respective annular gaps between the pins and corresponding passages in the cap member.
    Type: Grant
    Filed: March 21, 1990
    Date of Patent: January 15, 1991
    Assignee: Tecumseh Products Company
    Inventors: Terry Itameri-Kinter, David W. Sauerbrey
  • Patent number: 4964788
    Abstract: A hermetic terminal for carrying electric current into the housing of a hermetic compressor, including a metallic body member formed with three collar portions that define apertures through which respective fusible terminal pin assemblies extend. Each terminal pin assembly includes two electrically conducting pin segments interconnected by an electrically insulating sleeve member having opposite open ends into which respective ends of each pin segment are telescopingly received. The sleeve member and pin segments define a closed cavity in which a cylindrical fusible link is disposed. Opposite ends of the fusible link are received within respective counterbores in axial ends of the pin segments within the closed cavity, and are retained therein by a brazed joint. Each pin assembly is sealingly retained within a respective collar portion of the terminal body by a glass seal, which contacts the insulating sleeve and optionally surrounds one of the joints between the insulating sleeve and the pin segments.
    Type: Grant
    Filed: March 21, 1990
    Date of Patent: October 23, 1990
    Assignee: Tecumseh Products Company
    Inventors: Terry Itameri-Kinter, David W. Sauerbrey, Victor Troia
  • Patent number: 4960391
    Abstract: A housing for a hermetically sealed bulkhead connector is machined of an integral metal member to have a precisely planar bulkhead-engaging surface of a mounting section extending peripherally around a contact support section disposed within a hood section extending through a cutout of the bulkhead. The housing also is machined to have precisely planar surfaces of a contact support section to facilitate assembly of contacts precisely concentrically disposed in passageways through the support section and securing therein by glass seals to comprise a parallel contact array. The housing is free of joints between the several sections which could provide sites for breaching the hermetic nature of the housing. No steps are performed which involve impacting or striking the housing which could disturb the precise planarity of the several precisely machined surfaces. The contact positions may be identified by laser etched indicia.
    Type: Grant
    Filed: March 2, 1990
    Date of Patent: October 2, 1990
    Assignee: AMP Incorporated
    Inventors: Ernest L. Beinhaur, Joseph G. Porter
  • Patent number: 4940858
    Abstract: A hermetic, leak-proof, corrosion resistant electrical feedthrough especially for use with implantable pulse generators. The feedthrough includes a titanium or niobium ferrule, an alumina insulator with a niobium braze area thereon positioned within the ferrule and sealed to the ferrule by a braze of gold at the braze area, electrical lead wires of niobium, tantalum, tungsten, molybdenum or alloys thereof extending through corresponding openings in the insulator, and a body of fusible glass joining and sealing each lead wire to the insulator.
    Type: Grant
    Filed: August 18, 1989
    Date of Patent: July 10, 1990
    Assignee: Medtronic, Inc.
    Inventors: William J. Taylor, Douglas Weiss, Joseph F. Lessar
  • Patent number: 4935583
    Abstract: Electrical articles are provided in which an electrical conductor having a particular coefficient of thermal expansion is bonded to an electrical insulator having substantially the particular coefficient of thermal expansion. The bonding is provided by a ceramic material having substantially the particular coefficient of thermal expansion. By "substantially" is meant a close approximation to the particular coefficient of thermal expansion.The electrical conductor may be made from platinum or titanium or a titanium alloy and the electrical insulator may be made from an alloy of magnesium oxide, silica and aluminum oxide designated as Fosterite. The ceramic material may be partially amorphous and partially crystalline.The bonding may be accomplished by disposing the ceramic material between the electrical conductor and the electrical insulator and by subjecting the ceramic material to a controlled amount of heat. The heat may be applied by a laser beam for an instant such as a fraction of a second.
    Type: Grant
    Filed: September 20, 1982
    Date of Patent: June 19, 1990
    Inventor: James C. Kyle
  • Patent number: 4924033
    Abstract: According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, vacuum furnace is not employed.
    Type: Grant
    Filed: March 3, 1989
    Date of Patent: May 8, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kiyoshi Iyogi, Masako Nakahashi, Hiromitsu Takeda, Makoto Shirokane
  • Patent number: 4921452
    Abstract: An hermetically sealed terminal construction having one or more terminal pin assemblies wherein inner and outer pin parts are interconnected by a fuse link surrounded by a protective capsule defining an expansion cavity, the capsule having a vent port closed by a blow-out plug, the terminal pin assemblies extending through and being hermetically sealed to sleeve forming parts of the supporting base, including a dielectric sealing member which covers the protective capsules, the blow-out plugs and contiguous portions of the adjoining pin parts, the blow-out plugs being adapted to be expelled from the protective capsules upon the build-up of pressure within the capsules caused by disintegration of the fuse links, thereby cutting off the flow of current through the terminal while maintaining the integrity of the hermetical seals by means of which the terminal pin assemblies are mounted to the terminal base.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: May 1, 1990
    Inventor: Hilliard Dozier