Abstract: A common mode filter includes a coil part in which a plurality of insulating layers having coils formed on one surfaces thereof and containing fillers are stacked; a first cover part disposed beneath the coil part; and a second cover part disposed on the coil part, wherein surface reforming layers improving close adhesion between the insulating layers are formed on at least one surfaces of the insulating layers.

Abstract: A circuit substrate in which the conductor portions constituting the functional devices formed in the insulating board have interfacial electric conductivities &sgr; of not larger than 2.90×107 &OHgr;−1·m−1 to greatly lower the insertion losses.

Abstract: A printed circuit board which has in a first edge a first notch and a second notch a first predetermined distance apart and along said first edge between said first and second notches a plurality of terminal pads in a broadside array, the first edge including a third notch spaced from the second notch and disposed a second predetermined distance, greater than the first predetermined distance, from said first notch, the board having along and adjacent the first edge between the second and third notches a second plurality of terminal pads arranged in a respective broadside array.

Abstract: A multiconductor cable (10) including a large number of coaxial conductor pairs (16), with the coaxial conductor pairs arranged in groups (14) each including several of the coaxial conductor pairs arranged in a required order as a modular array (18) with each of the conductor pairs of each array being held in a required position with respect to the others and supported with a portion of each central conductor (54) and each shield conductor (47) exposed at a predetermined position, for connection of the array to a corresponding array (28) of terminal pads (24, 26) on a circuit board (30) or the like. Each array includes support bodies (32, 34) of flexible dielectric sheet material adhesively attached to the coaxial conductor pairs to support them in the required positions. Apertures (70, 76) are defined in the sheet material to expose the conductors for simultaneous soldering to, or unsoldering from, the terminal pads (24, 26), without removal of the support bodies (32, 34) from the coaxial conductors.