Abstract: A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.

Abstract: A twist-on wire connector for connecting the ends of a plurality of wires together, includes a hollow, cup-shaped housing having an inner cavity with an opening at one end thereof and a closed end wall at the other end thereof and a coiled spring received in the housing and defining a wire-receiving first end generally adjacent to the opening of the housing and a constricted second end generally adjacent to the housing closed end wall. The coiled spring is in the form of at least a double helix so as to define at least a dual coil spring having a dual leading edge which facilitates quick twist-on of the wires.