Abstract: A method and apparatus for a connection system to a substrate is provided. The system includes a substrate having a mounting hole to permit an object to be coupled to the substrate. The substrate further includes a conductive pattern around the mounting hole on the substrate. The conductive pattern is designed to contact an interface, and selectively couple a ground signal to the object coupled to the substrate.

Abstract: An insulator in the form of suspension insulator or pin type insulator has an elongated load sustaining body with a plurality of weathersheds extending radially relative to the longitudinal axis of the body on the outer surface of the body. The body and weathersheds are unitarily formed as one piece of rigid dielectric plastic polymer which are molded together. Clevis and eye coupling means are provided on the ends of the body to facilitate connection to support structures and high voltage lines.

Abstract: A spring probe (pogo pin) contactor for testing PGA (Pin Grid Array) devices that limits compression of pogo pins within the spring probe contactor is disclosed. A PGA device has a plurality of device pins extending therefrom for insertion into the spring probe contactor in order to test the PGA device. At least one device pin of the plurality of device pins is provided with a widened annular portion expanding from a portion of the one device pin. A surface of the spring probe contactor has an array of apertures for receiving each device pin of the plurality of device pins of the PGA device in order to make contact with and compress the pogo pins. A cavity is coupled to the surface of the spring probe contactor which corresponds to and mates with the widened annular portion of the one device pin in order to limit an amount of insertion of the PGA device, thereby limiting the compression of the pogo pins.