With Grounding Means Patents (Class 174/51)
  • Patent number: 11355687
    Abstract: The present invention relates to a chip-on film type semiconductor package including an integrated circuit chip, a printed circuit board layer, and a graphite layer, in which the integrated circuit chip is connected to one surface of the printed circuit board layer directly or by means of a mounting element and the graphite layer is laminated on an opposite surface of the printed circuit board layer and a display device including the same.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 7, 2022
    Inventor: Hag Mo Kim
  • Patent number: 11355453
    Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: June 7, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Jiwoong Kong, Jung Ju Suh, Seong-Woo Woo
  • Patent number: 11322455
    Abstract: An apparatus, comprising an Integrated Circuit (IC) package comprising a dielectric, the IC package has a first surface and an opposing second-surface, wherein the first surface is separated from the second surface by a thickness of the IC package, wherein sidewalls extend along a perimeter and through the thickness between the first surface and the second surface, and a structure comprising a frame that extends at least partially along the perimeter of the IC package, wherein the structure extends at least through the thickness of the IC package and inwardly from the sidewalls of the IC package.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 3, 2022
    Assignee: Intel Corporation
    Inventors: Jimin Yao, Kyle Yazzie, Shawna M. Liff
  • Patent number: 11209180
    Abstract: A control module configured to control operation of a damper assembly includes an air damper configured to be disposed within an air duct and movable between an open end position and a closed end position, the air duct providing conditioned air to a register boot proximate the air duct. The control module includes a control module housing that is securable to the register boot. A controller is disposed within the control module housing and is configured to generate damper position control signals, the controller providing the damper position control signals to the damper assembly via a control cable that operably couples the control module with the damper assembly. An antenna extends from the control module housing and is operably coupled to the controller, and is configured to extend through an opening formed within a wall of the register boot to be positioned exterior to the register boot.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 28, 2021
    Assignee: Ademco Inc.
    Inventors: Patrick Gonia, David J. Emmons, Nathan Carlson
  • Patent number: 11187752
    Abstract: A testing device and method may be implemented for improved detection of leaks in batteries used in portable electronic devices. The leak testing device may include a chamber configured to hold a device under test. The chamber may include a conductive foam, a conductive liquid, or any suitable conductive material. The chamber may be configured to hold the device under test in a substantially airtight environment and prevent or reduce air ionization under high voltage. The device under test may be a battery that has a conductive outer layer.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 30, 2021
    Assignee: ATEQ Corporation
    Inventors: Jean Luc Regef, Guy D. Dewailly
  • Patent number: 11178770
    Abstract: A semiconductor device, including an insulated circuit board that has a radiation plate, a resin board adhered to a front surface of the radiation plate, and a circuit pattern adhered to a front surface of the resin board. The resin board contains a resin. The semiconductor device further includes a wiring member, and at least one semiconductor chip, bonded to the front surface of the circuit pattern or electrically connected to the wiring member. The circuit pattern has at least one pair of side portions opposite to each other that are supported by the resin board.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: November 16, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroki Kogawa
  • Patent number: 11170618
    Abstract: A method of monitoring a fence or other containments barrier for climbing events by an intruder comprises providing a first and second sensors at different heights on the fence, detecting from each of the sensors signals which are indicative of vibration of the fence, and comparing the signals from the first and second sensors to determine vibration events which change in relation to a height of the intruder on the fence indicative of climbing so as to distinguish climbing events from incidental events and to provide a signal in response thereto.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: November 9, 2021
    Assignee: Network Integrity Systems Inc
    Inventor: Cary R. Murphy
  • Patent number: 11089708
    Abstract: A housing of a power supply includes a first cover and a second cover. The first cover includes a first sideboard and a hook. The first cover is configured with a first opening. The hook is disposed aside a side edge of the first opening and protrudes toward an inner side of the first cover. The second cover includes a second sideboard and a protruding platform. The protruding platform is disposed on the second sideboard and protrudes toward an outer side of the second cover. The protruding platform has a buckle hole. When the first cover is assembled with the second cover, the first sideboard is stacked on the outer side of the second sideboard, the protruding platform is engaged with the first opening, and the hook is engaged with the buckle hole.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: August 10, 2021
    Assignee: CHICONY POWER TECHNOLOGY CO., LTD.
    Inventor: Yu-Jan Lin
  • Patent number: 11083093
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 3, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen
  • Patent number: 11060281
    Abstract: The present invention relates to using interlocking spacer braces between support members to construct wood and metal framed walls, floors and building trusses. Spacer braces have indentations, extensions, with hook fingers, hook tongues and hook receivers along with U & W shaped clips that interlock horizontally, vertically or diagonally between support members. The spacer braces can form diagonal and lateral wall bracing, diagonal and vertical chords within building truss with either horizontally or vertical orientations, headers above doors and windows and shear walls. The spacer braces can be installed individually or in tandem between wood or metal framing.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: July 13, 2021
    Inventor: Dennis LeBlang
  • Patent number: 10994672
    Abstract: A tether fastening device for an automobile body structure includes a fastener clip, at least one tether strap, a tether clip bracket, a clip strap coupler, and a bracket strap coupler. The clip strap coupler operably couples to a slot in the automobile chassis. The tether clip bracket attaches to the fastener clip when in an attached position. The bracket strap coupler is attached to the body panel. The tether strap allows for controlled detachment between the clip strap coupler and the bracket strap coupler. The strap may include a mesh to absorb the deployment energy and decelerate the body panel in a controlled manner. In the event of an airbag activation, the tether clip bracket and the fastener clip initially accelerate and then decelerate from each other. The pair of tether straps control the deceleration and separation distance of the clip strap coupler and bracket strap coupler.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: May 4, 2021
    Assignee: TERMAX LLC
    Inventors: Daniel James Dickinson, Michael Tirrell, John Clasen
  • Patent number: 10985515
    Abstract: A surface mount connector in which an internal terminal does not extend to a location outside an external terminal is provided. A surface mount connector includes an external terminal that includes a tubular portion that extends in a first direction, an internal terminal that is separated from the external terminal inside the tubular portion when viewed in the first direction, and an insulator that is disposed between the internal terminal and the external terminal and that has a first main surface and a second main surface opposite the first main surface. The insulator inside the tubular portion has a through-hole that extends from the first main surface to the second main surface.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: April 20, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Aoi Tanaka, Daisuke Okada
  • Patent number: 10971459
    Abstract: A high-frequency module (1) includes a first substrate (101), a second substrate (102) that faces the first substrate (101), a support (103) that supports the first substrate (101) and the second substrate (102), and a plurality of high-frequency circuit components arranged in internal space formed by the first substrate (101), the second substrate (102), and the support and on both of facing principal faces of the first substrate (101) and the second substrate (102), and the plurality of high-frequency circuit components include a power amplifier element that constitutes a power amplifier circuit (16).
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinya Hitomi, Hidenori Obiya, Reiji Nakajima
  • Patent number: 10923897
    Abstract: A cable sealing gland and method for securing a cable to an enclosure. The cable sealing gland includes a gland connector configured to be coupled to the cable, having a cable gland body sized to fit over the cable and including a first end sized to remain outside the enclosure when the gland connector is inserted through a hole of the enclosure and a second end sized to extend into an interior of the enclosure when the gland connector is inserted through the hole. The gland connector also includes a ferrule sized to fit inside the cable gland body, and a compression bolt configured to engage the cable gland body to compress the ferrule onto the cable. The cable sealing gland also includes a locknut configured to engage the cable gland body to couple the gland connector to the enclosure.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: February 16, 2021
    Assignee: Pentair Flow Services AG
    Inventor: Wesley Dong
  • Patent number: 10891415
    Abstract: An approach is described for a method, system, and product for generating radial bump patterns. According to some embodiments, the approach includes determining parameters for radial pattern generation in a precomputing phase, creating a radial pattern in a second stage, and generating a layout from the radial pattern in the second stage before manufacture a device embodying the radial pattern. In some embodiments, the radial pattern comprises rings having a number of rows where bump instances are placed and rotated such that they are perpendicular to a radius from a common center line. Furthermore, in some embodiments, the number of rows in a ring is generated pursuant to a set value or dynamically generate based on one or more optimization metrics.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: January 12, 2021
    Assignee: Cadence Design Systems, Inc.
    Inventors: Björn Axel Lindberg, Jean-François Alain Lepère, Vladimir Papic
  • Patent number: 10861757
    Abstract: An electronic component includes a wiring substrate, surface mount devices mounted on a front surface of the wiring substrate, and a shield plate fixed on a side adjacent to top surfaces of the surface mount devices. The shield plate includes a magnetic ceramic sintered sheet and a first metal film. The magnetic ceramic sintered sheet includes a first main surface and a second main surface. The first metal film is disposed on the first main surface of the magnetic ceramic sintered sheet.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirokazu Yazaki, Tomoyoshi Hiei
  • Patent number: 10829238
    Abstract: The present invention provides an arrangement for passing a line in a load-free manner through a pressure frame of a fuselage of an aircraft or spacecraft, including an opening penetrating the pressure frame, through which opening the line is passed, the line being mechanically decoupled from the pressure frame; and a flexible sealing device arranged outside the opening at least in portions, which sealing device is simultaneously operatively connected to the line and the pressure frame for the pressure-tight separation of a first side from a second side of the pressure frame. The present invention also provides a fuselage for an aircraft or spacecraft having an arrangement of this type and an aircraft or spacecraft having an arrangement of this type or having a fuselage of this type.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: November 10, 2020
    Assignee: Airbus Operations GmbH
    Inventor: Ralf Becks
  • Patent number: 10811853
    Abstract: A modular enclosure comprises a first enclosure having a first enclosure cavity and a first door, and a second enclosure coupled to the first enclosure, the second enclosure having a second enclosure cavity and a second door. A power handle may be connected to the first enclosure, and can be operable to turn on power to the second enclosure in an “ON” position or turn off power to the second enclosure in an “OFF” position. The modular enclosure may further include a lockout assembly configured to prevent the second door from being opened while the power handle is in the “ON” position, and to prevent the first door from being opened until second door has been opened.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: October 20, 2020
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Jordan E. Rogers, Ahmad K. Omari
  • Patent number: 10777978
    Abstract: A modular enclosure comprises a first enclosure having a first enclosure cavity and a first door, and a second enclosure coupled to the first enclosure, the second enclosure having a second enclosure cavity and a second door. A power handle may be connected to the first enclosure, and can be operable to turn on power to the second enclosure in an “ON” position or turn off power to the second enclosure in an “OFF” position. The modular enclosure may further include a lockout assembly configured to prevent the second door from being opened while the power handle is in the “ON” position, and to prevent the first door from being opened until second door has been opened.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: September 15, 2020
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Jordan E. Rogers, Ahmad K. Omari
  • Patent number: 10737851
    Abstract: An insulating container may include an opening, which can be sealed by a closure. The closure may have an upper portion with a handle that has a circular curvature equal to the cylindrical portion of the closure. The closure may also have a lower portion that is joined to the upper portion by an injection molded polymer element. The closure may also be in the form of “flip” type of closure such that the lid can be selectably opened or closed by the user by rotating a flip closure into either the opened or closed position. The closure may also be a two-part lid having a lower cap that may be configured to be removably-coupled to the container and an upper cap that may be configured to be removably-coupled to the lower cap.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: August 11, 2020
    Assignee: YETI Coolers, LLC
    Inventors: Derek G. Sullivan, Andy Bondhus, Evan Goldberg, Roy Joseph Seiders
  • Patent number: 10700011
    Abstract: A semiconductor device has a substrate with a first opening and second opening formed in the substrate. A first semiconductor component is disposed on the substrate. The substrate is disposed on a carrier. A second semiconductor component is disposed on the carrier in the first opening of the substrate. A third semiconductor component is disposed in the second opening. The third semiconductor component is a semiconductor package in some embodiments. A first shielding layer may be formed over the semiconductor package. An encapsulant is deposited over the substrate, first semiconductor component, and second semiconductor component. A shielding layer may be formed over the encapsulant.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 30, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, Woonjae Beak, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee
  • Patent number: 10701845
    Abstract: A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: June 30, 2020
    Assignee: Apple Inc.
    Inventors: Griffin L. Schmitt, Benjamin S. Bustle, Kevin M. Froese, Lucy E. Browning, Zhipeng Zhang, Jaden A. Barney, Nan Li
  • Patent number: 10627578
    Abstract: Provided is a cable device including an optical cable capable of power transmission and a connector coupled with the optical cable, and having improved electromagnetic shielding performance. The cable device includes a cable; and a connector coupled to the cable, wherein the connector includes a printed circuit board (PCB) including a ground electrode, a shield case provided to accommodate the PCB and include a first face facing a mounting surface of the PCB and a second face perpendicular to the first face, and an elastic member arranged between the PCB and the shield case and provided to contact the ground electrode and the second face of the shield case so as to ground the shield case.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub Kim, Baek Seok Ko, Sun Woo Kim, Dong Jin Park
  • Patent number: 10594127
    Abstract: A cable gland for providing strain relief and sealing for a cable that can be coupled to a device. The cable gland includes a sealing gland having a sealant. Upon assembly of the cable gland, the sealing gland is compressed in a manner that can releases, or otherwise can facilitate the displacement of, the sealant about an interface between a portion of the cable and the sealing gland, and/or into spaces between exposed insulative jackets and/or conductors of the cable. The sealant can include a curable viscous sealant that is housed within a package of the sealing gland, the package being configured to rupture upon compression of the sealing gland. Alternatively, the sealant can be a malleable sealant material that can be pressed or otherwise displaced to form a seal between the sealing gland and cable and/or into the spaces between exposed insulative jackets and/or conductors of the cable.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: March 17, 2020
    Assignee: Thomas & Betts International LLC
    Inventor: Jesus Ricardo Portillo Gallego
  • Patent number: 10531599
    Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: January 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Il-ju Mun, Keon Kuk, Kyong-il Kim, Jin-woo Jung
  • Patent number: 10531591
    Abstract: A storage system for mounting equipment includes a plurality of vertical structural side members positioned at corners of the storage system. A plurality of horizontal structural members is coupled to the plurality of vertical structural side members. Specifically, each of the horizontal structural members has a plurality of corners, and each corner of each horizontal structural member is coupled to one of the vertical structural side members. Each vertical structural side member is an extrusion having a length selected to accommodate a desired height in a facility in which the storage system is installed.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 7, 2020
    Assignee: ARA USA LLC
    Inventor: Barrett W. Franklin
  • Patent number: 10431970
    Abstract: An electrical insider fitting for connecting flexible metal conduit to an electrical box without disrupting the walls surrounding the box. The fitting includes a connector body with a leading end, a trailing end, and a nose portion. A resilient split snap ring on the fitting enables snap connection of the fitting to the interior wall of an electrical box. Discontinuous threads on the nose portion are adapted to grab and hold a flexible metal conduit to the box. Conductors from the attached flexible metal conduit feed through the interior bores of the fitting to the interior of the electrical box enabling an installer to complete electrical connections in order to supply voltage to any components within the box.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: October 1, 2019
    Assignee: ARLINGTON INDUSTRIES, INC.
    Inventor: Thomas J. Gretz
  • Patent number: 10364566
    Abstract: The present invention relates to metal framed wall components with self-locking connections having ledges connected to support members and crossing connecting members having punch out tabs being connected to ledges, notches and tabs being connected to other tabs interlocking together to connect wall components together. The wall components spanning between support members connected by holes from support members, hooked receivers, hooked tongues, hook finger ends from the wall components wherein also U-shaped and W-shape clips can also connect other wall components. The wall components can be installed individually or in tandem vertically, horizontally and diagonally between support members or over the side edges.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 30, 2019
    Inventor: Dennis LeBlang
  • Patent number: 10312643
    Abstract: A connector for connecting an electrical cable to an aperture in an electrical panel having a spring, a shell, and a insulator along a longitudinal axis. The spring has a base from which two insertion tabs extend coaxial with the axis and a pressure tab extending from the base perpendicular to the two insertion tables having a pressure prong to provide a radial grounding force for the connector. The insertion tabs of the spring have hook latches extending past the insulator that lock the connector in the panel and the base of the spring has a hole to receive the cable where first and second clamping tabs clampingly lock the cable in the connector.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: June 4, 2019
    Assignee: HAMPTON ELECTRIC, LLC
    Inventor: Afshin Jafari
  • Patent number: 10304621
    Abstract: An assembly includes a metallic housing, an electromagnetic (EM) device, and a bobbin in which the EM device is supported. The bobbin has a non-metallic, inner bobbin body, a non-metallic, outer bobbin body, and a metallic shield sandwiched between the inner and outer bobbin bodies. The EM device and the bobbin are mounted in the housing with the bobbin being between the EM device and the housing for heat from the EM device to thermally conduct through the inner and outer bobbin bodies and the shield to the housing while the shield shields noise of the EM device from the housing.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: May 28, 2019
    Assignee: Lear Corporation
    Inventors: Ajmal Imran Ansari, David A. Hein, Steven Cong, Allen Leo Mott
  • Patent number: 10306816
    Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Il-ju Mun, Keon Kuk, Ji-woon Yeom
  • Patent number: 10270235
    Abstract: The present invention is directed to an electrical wiring system having a frame assembly that includes a frame opening at a central portion thereof. The frame opening provides access to the interior of the device wall box. At least one electrical wiring device is configured to snap into the frame opening such that the interior of the device wall box is completely enclosed by the frame assembly and the at least one electrical wiring device such that access to wiring disposed within the device wall box is substantially prevented. The at least one electrical wiring device includes at least one user-interface. An aesthetic overlay may be coupled to the frame assembly. The aesthetic overlay includes an overlay opening configured to accommodate the at least one user-interface such that the at least one user-interface is accessible to a user.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: April 23, 2019
    Assignee: Pass & Seymour, Inc.
    Inventors: Richard M. Rohmer, Francois Bardot, Jean-Luc Chaumeny, Anthony Lochet
  • Patent number: 10256195
    Abstract: A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: April 9, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Issei Yamamoto, Atsushi Shimizu, Yoichi Takagi, Hideo Nakagoshi
  • Patent number: 10208874
    Abstract: A retaining clip configured to secure an elongate member to a generally planar panel is described herein. The retaining clip includes a first side wall, a second side wall opposite the first side wall, and an end wall interconnecting the side walls. The side walls define a gap configured to receive the panel. The retaining clip includes further includes a resilient first cantilevered prong projecting into the gap from the first side wall and a resilient second cantilevered prong projecting from into the first gap from the second side wall. Free ends of the first and second prongs are characterized as having a pair of pointed barbs on distal edges of the first and second prongs. The pointed barbs are configured to increase a removal force required to remove the panel from the first gap. A method of forming such a retaining clip is also described.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: February 19, 2019
    Assignee: HELLERMANNTYTON CORPORATION
    Inventors: Gerard G. Geiger, Giovanni Lewinski
  • Patent number: 10199153
    Abstract: For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: February 5, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Yi-Wei Chen, Cheng-Chang Lee
  • Patent number: 10185279
    Abstract: An exemplary grounding device includes an electrically conductive planar member having a hollow, central opening. Arms extend from inner edges of the hollow, central opening of the planar member. Each arm is angled relative to a surface of the planar member and each arm includes a facing portion having an electrically conductive cushion attached thereto. Each arm is approximately the same size and is configured to contact a shaft extending through the hollow, central opening of the planar member to form an electrical connection between the planar member and the shaft. The electrically conductive cushion is between the arm and the shaft. A tab projection extends from an outer edge of the planar member. Each tab projection is in the same plane as the planar member.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: January 22, 2019
    Assignee: Xerox Corporation
    Inventors: Jonathan D. Sadik, Nancy L. Belknap, Karl E. Kurz
  • Patent number: 10116128
    Abstract: A universal wall box thread repair clip includes a front portion that has at least two openings sized to engage the threads of a wall box screw. The repair clip is placed over the end of a wall box so that one of the openings on the front portion is aligned with screw hole formed in the material of the wall box. The repair clip includes retention features that retain it on both plastic and metal wall boxes, where the metal wall boxes include screw tabs that can have varying offset distances.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: October 30, 2018
    Inventor: Patrick Loughlin
  • Patent number: 10113738
    Abstract: An underwater wall mounted light fitting having a sealed light source chamber and an electrical supply connection chamber including a port to sealingly engage over an electrical supply line with an array of electrical conductive connectors embedded in a dividing wall and each providing a connection terminal on opposite sides of the wall within the chambers respectively. The dividing wall is moulded around the connectors which are provided as rigid spigots with circumferential grooves to receive the moulded wall material. The connection chamber is a hollow cover with the port which includes a compression gland assembly for an electrical supply line. The dividing wall is securable against a peripheral frame provided on the lens and the frame includes a continuous flange which fits around the dividing wall. The housing is releasably securable to a wall mountable bracket. LEDs provide the light source.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: October 30, 2018
    Assignee: INTEGRATED POOL PRODUCTS (PTY) LTD.
    Inventor: Karl-heinz Schmitt
  • Patent number: 10104794
    Abstract: A metal housing is provided. The metal housing includes a bottom plate, a first side plate, a second side plate, a third side plate, a fourth side plate, and a ground portion. The second side plate is parallel to the first plate. The fourth side plate is parallel to the third side plate. The first side plate, the second side plate, the third side plate, and the fourth side plate are integrally formed on the bottom plate. The ground portion is formed on an inner surface of one of the side plates. The ground portion includes a restriction structure and an opening. The restriction structure is integrally formed on the inner surface. The restriction structure is adapted to hold a ground line.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: October 16, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hung-Chi Chen, Do Chen, Ching-Ho Chou, Shang-Yu Li
  • Patent number: 10078944
    Abstract: Disclosed is an apparatus for optimally facilitating interconnections between electrical endpoints. The apparatus comprises a number of terminals equal to a number of combinations of the plurality of endpoints. For example, to enable combinations of two endpoints to be made between N endpoints, the apparatus comprises N(N?1)/2 terminals. Each terminal at least comprises a first contact coupled to a first endpoint and a second contact coupled to a second endpoint. The first contact and second contact of any terminal can be shorted to connect their corresponding endpoints. The apparatus may further comprise a circuit identification process executed by a microcontroller. In this case, each terminal additionally comprises a first circuit identification contact and a second circuit identification contact.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: September 18, 2018
    Inventor: Pablo Oscar Olivera Brizzio
  • Patent number: 10064295
    Abstract: A Printed Circuit Board (PCB) mounting structure having an improved structure for improving assemblability of a product, and a display apparatus including the PCB mounting structure. The PCB mounting structure includes a mounting member provided on the PCB and a mounting portion provided on a chassis for mounting the PCB to the chassis without using screws.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Song Hyeon Kim, Sung Soo Jung, Dae Sung Ko, Jun Pil Oh
  • Patent number: 10056716
    Abstract: A female connector including a guide extending in a first direction, a pair of support portions on one side in the first direction relative to the guide, an insulative female body between the support portions, a female terminal held in the female body, and a shaft. The guide guides a mating male connector in the first direction floatably along a second direction orthogonal to the first direction. The support portions are spaced from each other in the second direction and each have a support hole passing therethrough in the second direction. The female body has a through hole passing in the second direction through at least a portion in the second direction of the female body. The shaft is received in the support holes of the support portions and the through hole of the female body so as to support the female body floatably along the second direction.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 21, 2018
    Assignees: Nintendo Co., Ltd., Hosiden Corporation
    Inventors: Kumpei Fujita, Hiroki Ikuta, Shinji Hirose, Naoki Yamachika, Hideaki Taketsu
  • Patent number: 10056665
    Abstract: A resonator assembly comprising a resonant member within a conductive resonator cavity is disclosed. The resonant member extends from a first inner surface of the resonator cavity towards an opposing second inner surface. A main portion of the resonant member has a substantially constant first cross sectional area. A cap portion of the resonant member extending from the main portion towards the opposing second inner surface has a progressively increasing cross sectional area increasing from the first cross sectional area adjacent to the main portion to a larger cap cross sectional area at an end of the resonant member, the larger cap cross sectional area being at least 1.i times as large as the first cross sectional area. The resonant member may also have a flared section at the other end giving the resonant member an hour glass type shape.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 21, 2018
    Assignee: Alcatel Lucent
    Inventor: Senad Bulja
  • Patent number: 9917379
    Abstract: The present disclosure relates to a conduit coupler including a hub and a lock nut that thread on the hub. In one example, the lock nut includes a ground connection location including a linear wire retention slot. The ground wire can be retained in the linear wire retention slot by a grounding bracket secured at the ground connection location by a grounding screw. The grounding bracket can be captive relative to the grounding screw. The grounding bracket can include integrated spring washer functionality. The ground connection location can be provided on a tower of the lock nut.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 13, 2018
    Assignee: Cooper Technologies Company
    Inventors: Matthew Thomas Pernot, Joseph Edward Platt, Eric Perry Cheney, Andrew F. Scarlata
  • Patent number: 9883582
    Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 30, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Tran Lin
  • Patent number: 9866006
    Abstract: In order to ensure a reliable connection between a shield of a high-voltage cable and a housing, in particular for an electric or hybrid vehicle, the shield of the cable is crimped between an under-sleeve and a contact sleeve, forming an electrically conductive connection with the housing via the contact sleeve. The contact sleeve, formed as a crimp sleeve, also has a rim made of spring tongues. In addition, the under-sleeve is also simultaneously crimped with a cable sheathing of the cable in order to create a strain relief. Furthermore, the cable can be preferably fixed to the housing by a simple plug-locking connection.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 9, 2018
    Assignee: LEONI Bordnetz-Systeme GmbH
    Inventors: Volker Albert, Michael Pieczka, Alexander Kett, Christian Dehn
  • Patent number: 9847627
    Abstract: A base is a platform that supports a component off the ground in a solar energy installation. The specific configuration of a base can vary based on the intended component, for example whether it holds a transformer or power component. Multiple bases are mechanically and/or electrically connected to form a system of bases in the field. Proper placement of bases and engagement of those bases is facilitated by mating alignment mechanisms such that one base can be lowered “fit” with another. A method of positioning components includes positioning a base and aligning and lowering a second base alongside the first such that the bases engage.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: December 19, 2017
    Assignee: Shoals Technologies Group, LLC
    Inventor: Dean Solon
  • Patent number: 9812854
    Abstract: A power supply device is disclosed. A circuit board is disposed inside a conductive housing. A rectifying module is disposed on the circuit board and has primary and secondary sides. The grounding module includes a first grounding element, a second grounding element, and a fastening element. Two terminals of the first surge protection module are respectively electrically connected to the primary side and the first grounding element. Two terminals of the second surge protection module are respectively electrically connected to the secondary side and the second grounding element. The second grounding element and the first grounding element are not directly connected. The fastening element passes through the conductive housing, the circuit board, the first grounding element, and the second grounding element so that the conductive housing, the first grounding element, and the second grounding element are electrically connected to one another.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: November 7, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shan-Chun Yang, Cheng-Chun Lin, Yi-Hua Chang
  • Patent number: 9799845
    Abstract: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.
    Type: Grant
    Filed: June 27, 2015
    Date of Patent: October 24, 2017
    Assignee: Intel Corporation
    Inventor: Douglas G. Bennett
  • Patent number: 9765913
    Abstract: A polymeric riser cap member includes a central tubular section defining a generally cylindrical bore for receiving a sprinkler riser, the central tubular section having open top and bottom ends, and an annular skirt coaxial with the central tubular section and having an inner diameter larger than an inner diameter of the central tubular section. The annular skirt has an inner surface having internal threads threadably connectable with the externally threaded surface of a tubular riser adapter member of a tubular coupler. The bottom end of the central tubular section has an annular projection disposed opposite and spaced from a portion of the annular skirt. The riser cap member includes an annular recess adapted to receive a seal located in a wall extending laterally between the annular skirt and the annular projection.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: September 19, 2017
    Assignee: NORTH AMERICAN SPECIALTY PRODUCTS LLC
    Inventors: John R. Magargal, Gary A. Leigh