Bare-conductor Patents (Class 174/94R)
  • Patent number: 5268534
    Abstract: A combination Malleable Carbon Steel/Copper Wire Braided material. This braided material will allow the use of chassis mounted magnets on 1/24th and 1/32nd scale model Slot Cars for use as magnetic traction and downforce devices. Said braid being made of a combination including a copper plating over each individual strand of malleable carbon steel wire will provide a sufficient mass of steel while also providing the least resistive and most flexible conductor.
    Type: Grant
    Filed: March 27, 1992
    Date of Patent: December 7, 1993
    Inventors: Brian L. Gailey, Jefferson J. Honeycutt
  • Patent number: 5258577
    Abstract: An electronic device is made by a method of connecting a circuit member to a substrate. The circuit member is of the type having a discontinuous passivating layer thereon with recesses therein establishing electrical contacts. The circuit member is connected to a mounting surface of a substrate having conductive paths. An adhesive including a resin with spaced conductive metal particles suspended therein is applied over the conductive paths. The distance between the electrical contacts and conductive paths is decreased to provide electrical conduction through the adhesive, while maintaining the adhesive between conductive paths non-conductive. The conductive paths may have established thereon raised or protruding contact surfaces over a portion thereof. The circuit member is mounted on the adhesive while vertically aligning the electrical contacts over pre-selected protruding contact surfaces.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: November 2, 1993
    Inventor: James R. Clements
  • Patent number: 5245132
    Abstract: Noble plated tungsten corona wire for copy machine or xerography technology machines and method of securing terminal connectors to the ends of the noble plated tungsten corona wire. The terminal or crimping tab have compound radii to provide for a solid-state diffusion weld and to prevent stress at a junction of the wire and the terminal or the crimping tab.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: September 14, 1993
    Assignee: Minnesota Technical Research, Inc.
    Inventor: Edwin J. Luetzow
  • Patent number: 5241134
    Abstract: The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: August 31, 1993
    Inventor: Clarence S. Yoo
  • Patent number: 5241135
    Abstract: A brass strap is utilized as a common grounding bar for the shields of a plurality of coaxial cables. The individual coaxial cables pass through holes in the common grounding bar, and the inner conductors are connected to the pins of a printed circuit board connector.
    Type: Grant
    Filed: December 13, 1991
    Date of Patent: August 31, 1993
    Assignee: The Boeing Company
    Inventor: Barry A. Fetzer
  • Patent number: 5222811
    Abstract: A temperature sensor has a holder for housing a temperature sensing element therein, a terminal, and an electrical lead wire connecting the temperature sensing element and the terminal. The lead wire has a first end portion thereof electrically connected with the temperature sensing element and a second end portion thereof welded to the terminal. The lead wire is fastened in a variety of ways to the terminal to receive mechanical loads exerted by the lead wire. The terminal may be formed with a hole therein through which the lead wire is passed from one side of the terminal to the other. The lead may be soldered to the terminal at the hole. The terminal may also be formed with a cutout through which the lead wire is passed and is soldered at a portion closer to the temperature sensing element than the cutout.
    Type: Grant
    Filed: April 17, 1992
    Date of Patent: June 29, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Sotsuo Miyoshi
  • Patent number: 5200576
    Abstract: A multipoint contact compression connector provided with a plurality of recesses to include a like number of electrical conductors or cables therein. When placed in an appropriate crimping device, the connector would contact the interior die surfaces in at least four points, in such a manner, so as to secure at least three conductors or cables in place.
    Type: Grant
    Filed: March 2, 1992
    Date of Patent: April 6, 1993
    Assignee: Burndy Corporation
    Inventors: Gary E. Schrader, Robert K. Annan
  • Patent number: 5180888
    Abstract: In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.
    Type: Grant
    Filed: June 12, 1991
    Date of Patent: January 19, 1993
    Assignee: Casio Computer Co., Ltd.
    Inventors: Kazuhiro Sugiyama, Yoshinori Atsumi
  • Patent number: 5164545
    Abstract: A grounding connector for interconnecting a ground wire with a pipe in a one-piece stamped and formed member (10) which includes an outer section having diverging walls (14,16) extending from a base section (12) to form a V-shaped channel (18), upper sections (20,22) of the walls (termed outer walls) being crimpable toward each other and locked in a vertical orientation when applied to the pipe (70) and wire (68). An inner section (30) extends integrally from the top (24) of one outer wall (20) and is latchable to the top (24) of the other outer wall (22), and includes a pair of inner walls (36,40) joined by a central arcuate portion (38) crossing the top of the U-shaped channel (18).
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: November 17, 1992
    Assignee: AMP Incorporated
    Inventors: Earl R. Kreinberg, Marty E. Adcock
  • Patent number: 5163221
    Abstract: A connection process by welding a braided strip to a contact finger defined by side by side stacking of two elementary blades. The first blade is provided with a semi-open notch cooperating with the juxtaposed flat face of the second blade to define a housing receiving a compacted end of the braided strip, said end being hot encrusted in the housing by welding under pressure, without local deformation of the blades. The second blade comprises an overspill aperture located facing the notch to enable the molten copper from the compacted end to be transferred during the welding operation, the surface of the aperture being smaller than that of the notch. Assembly is performed in a single operation without addition of solder.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: November 17, 1992
    Assignee: Merlin Gerin
    Inventors: Jean-Paul Favre-Tissot, Georges Fevrier
  • Patent number: 5162615
    Abstract: An H-shaped compressible connector having a main body and two pairs of opposed legs extending in opposite directions from the main body. Each pair of opposed legs is provided with one leg which is curved inwardly with respect to the second leg. During the crimping process, this curved leg would move below the interior surface of the second leg in each pair, thereby providing a completely closed connector for various conductor sizes.
    Type: Grant
    Filed: March 2, 1992
    Date of Patent: November 10, 1992
    Assignee: Burndy Corporation
    Inventors: Gary E. Schrader, Urs F. Nager
  • Patent number: 5162613
    Abstract: Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive material advantageously has a cutout (24) therein located to expose at least a portion of the substrate lying between a pair of metallized areas (16). The cutout (24) serves to confine a quantity of adhesive (26) deposited therein which serves to secure the chip to the substrate without any physical bond between the metallized areas and the bond sites on the chip while maintaining the anisotropically conductive material in compression.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: November 10, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: David Schoenthaler
  • Patent number: 5151560
    Abstract: A grounding connector for interconnecting a pair of uninsulated conductors such as wires includes an outer body member having diverging tabs extending from upper extents of vertical walls of a U-shaped channel, the tabs being crimpable toward each other when applied to the wires. An inner body member includes a base section crossing the top of the U-shaped channel and diverging inner tabs extending along the inside surfaces of the outer body member to assured stops at the ends of the outer tabs. When the outer tabs are crimped to a vertical orientation, the inner tabs are also crimped to a vertical orientation and urge the base section against the wires in the U-shaped channel. The inner body member presses the wires against upper and lower surfaces of a conductive insert so that arrays of penetrating spikes along the insert surfaces break through corrosion of the wires and assuredly electrically interconnect the wires.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: September 29, 1992
    Assignee: AMP Incorporated
    Inventors: Earl R. Kreinberg, Marty E. Adcock
  • Patent number: 5149686
    Abstract: A high-T.sub.c superconducting unit is disclosed having low contact resistivity between a substantially non-degraded surface of the superconductor and a surface of a contact pad in engagement with the substantially non-degraded surface of the superconductor, with contact resistivity of less than 1000 .mu..OMEGA.-cm.sup.2 at high-T.sub.c superconductor operating temperatures being disclosed.
    Type: Grant
    Filed: October 16, 1990
    Date of Patent: September 22, 1992
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: John W. Ekin, Armand J. Panson, Betty A. Blankenship
  • Patent number: 5139192
    Abstract: A method of bonding a superconductive ribbon lead to a superconductive bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
    Type: Grant
    Filed: March 3, 1992
    Date of Patent: August 18, 1992
    Assignee: Quantum Magnetics, Inc.
    Inventor: Michael B. Simmonds
  • Patent number: 5136122
    Abstract: An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.
    Type: Grant
    Filed: May 13, 1991
    Date of Patent: August 4, 1992
    Assignee: Motorola, Inc.
    Inventors: Peter A. Kwitkowski, Detlef W. Schmidt, Carl Missele
  • Patent number: 5110034
    Abstract: A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
    Type: Grant
    Filed: August 30, 1990
    Date of Patent: May 5, 1992
    Assignee: Quantum Magnetics, Inc.
    Inventor: Michael B. Simmonds
  • Patent number: 5103068
    Abstract: A compressible electrical connector having slots or channels for the inclusion of two or more conductors therein. One or more surfaces of the connector are provided with an extruded groove having a tying device press-fitted therein. After the conductors are inserted into the various slots or channels of the connector, the tying device would be tied or twisted around each end of the conductor bundles prior to implementing the crimping process.
    Type: Grant
    Filed: February 15, 1991
    Date of Patent: April 7, 1992
    Assignee: Burndy Corporation
    Inventor: Gary E. Schrader
  • Patent number: 5097100
    Abstract: A lightweight, substantially corrosion-proof, conductive wire and terminal assembly (10) comprising a wire (12) laid on and welded to a terminal pad (18) at or near the end (16) of the wire. The wire (12) has an electrically conductive core (24) having a cylindrical surface. The cylindrical surface is substantially completely enveloped in a sheath of noble metal plating (26, 28). The terminal pad (18) has a noble metal surface where it is welded to the cylindrical surface of the wire (12), so the joint (22) formed by the weld is substantially sheathed in a noble metal, and thus is substantially as corrosion-proof as the noble metal sheath (26, 28) and terminal pad (18). The wire (12) is preferably covered with insulation (30) except at its end (16), which may be stripped.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: March 17, 1992
    Assignee: Sundstrand Data Control, Inc.
    Inventor: Jeffery E. Jackson
  • Patent number: 5095178
    Abstract: An electrical connector which is adapted to join two or more wires together and comprises a pair of hollow cylinders joined together and disposed such that one end portion of each cylindrical is free to be bent back upon itself after a wire is inserted therein to make good contact between the cylinder and the wire.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: March 10, 1992
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Elmont E. Hollingsworth
  • Patent number: 5093988
    Abstract: A flexible electrical connector is attached to a movable contact finger and a stationary termianl by placing the components in a work chamber and positioning a first end of the flexible connector against an attachment surface of the contact finger, preferably in a perpendicular orientation. After evacuating the work chamber, the output of an electron gun is directed toward a joint formed between the flexible connector and the contact finger. The electron beam forms a weld zone which fuses the the flexible connector with the contact finger without degrading the flexibility of the connector or the mechanical strength of the contact finger. A second end of the flexible connector is positioned against an attachment surface of the stationary terminal, such as in a parallel orientation, and attached in a similar manner.
    Type: Grant
    Filed: January 24, 1991
    Date of Patent: March 10, 1992
    Assignee: Kohler Co.
    Inventor: James A. Becker
  • Patent number: 5090923
    Abstract: A method and apparatus for preventing birdcaging of a conductor having multiple strands when these conductors are installed in a connector utilizing high speed installations, such as by an explosively-operated tool. The inside surface of the connector is coated with a mixture of 30% silica sand and 70% of PENETROX.RTM. A13 to reduce contact resistance. A wedge is then inserted into the connector between the conductors utilizing the explosively driven tool.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: February 25, 1992
    Assignee: Burndy Corporation
    Inventors: Lee G. Kenyon, Thomas C. Murray
  • Patent number: 5084963
    Abstract: A die and method for forming indentations in a grounding rod. The die is a U-shaped die for use in a hydraulic compression tool. The die has an inner face forming a general recess and has a plurality of series of individual tooth-like projections. The die is used to form a plurality of series of individual tooth-like indentations on an exterior surface of the grounding rod such that a connector can be compressed onto the rod with portions of the connector being deformed into the indentations to fixedly connect the connector to the rod.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: February 4, 1992
    Assignee: Burndy Corporation
    Inventors: Thomas C. Murray, Kevin J. Flynn
  • Patent number: 5082164
    Abstract: Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate, reactive-metal layer, and superconductive alloy layer are removed to form exposed sections of the parent metal layer. The tapes are positioned so that the exposed sections are in contact. Metallurgical bonding, for example by spot welding, forms bridges between the parent-metal layers. The joined exposed sections are heated in a protective atmosphere, and in the presence of excess reactive metal to form a continuous layer of the superconductive alloy on the bridge and the exposed areas that is continuous with the superconductive alloy layer on the superconducting tape.
    Type: Grant
    Filed: August 1, 1990
    Date of Patent: January 21, 1992
    Assignee: General Electric Company
    Inventors: Lee E. Rumaner, Mark G. Benz, Bruce A. Knudsen
  • Patent number: 5057650
    Abstract: A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: October 15, 1991
    Assignees: Sumitomo Electric Industries, Ltd., Matsushita Electric Industrial Co., Ltd., Sankyo Kasei Co., Ltd.
    Inventors: Kenichi Urushibata, Kiyoto Sugawara, Tatsuo Matsuda, Haruo Saen, Keiichi Kojima, Syusaku Kawasaki, Hiroshi Hatase, Katsuya Saito, Tetsuo Yumoto, Norio Yoshizawa, Tooru Kanno
  • Patent number: 5036164
    Abstract: Several configurations of compression ground connectors to allow for one, two, three or more taps from a single ground connector to an installation requiring grounding. The installation is completed using a single crimping stroke.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: July 30, 1991
    Assignee: Burndy Corporation
    Inventors: Gary E. Schrader, H. Thomas Nelson
  • Patent number: 5025554
    Abstract: A method of forming a crimp-style terminal and the resulting crimp-style terminal. A solder cream is applied to one or both of the inner surface of the conductor-holding portion of the terminal and the conductor wires which are to be held by the conductor-holding portion. The conductor-holding portion is subsequently deformed by pressing to grip the wire conductors. The solder cream fills the space between the conductor bundle and the inner surface of the conductor-holding portion and the space between conductors of the conductor bundle.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: June 25, 1991
    Assignee: Yazalci Corporation
    Inventor: Hikoo Dohi
  • Patent number: 5023403
    Abstract: A flexible connection is made between the printed conductor array of an automotive windshield or rear window and an electric cable by a braided body formed with a lug at one end for connection to the cable and having, at the opposite end, oppositely bent arms or feet in the form of arms of a T soldered to the conductor array only at the extremity of these feet.
    Type: Grant
    Filed: December 15, 1989
    Date of Patent: June 11, 1991
    Assignee: Flachglas Aktiengesellschaft
    Inventors: Rudolf Eckardt, Bernd Diedrichs
  • Patent number: 5017738
    Abstract: A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The plating layers are respectively impregnated with tin-zinc alloy and gallium. The electrical connection is established between the pads of the printed circuit board and the pads of the mother board through a liquid alloy by placing the plating layers in contact with each other. For the first printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while solder is temporarily adhered to the spacer. For the second printed circuit board having the pads and the connecting pads, tin or indium layer is provided on the surface of the pads, then the spacer of the first printed circuit board is positioned and fixed to the connecting pad of the second printed circuit board.
    Type: Grant
    Filed: February 22, 1990
    Date of Patent: May 21, 1991
    Assignee: Fujitsu Limited
    Inventors: Hiroki Tsuji, Kyoichiro Kawano, Teruo Murase
  • Patent number: 5003131
    Abstract: A device for connecting a metal conductor on a surface of a first ceramic body to an outer terminal in which dispersion of copper metal into adjoining layers is prevented. An outer surface conductor made of Cu or Au is connected to the metal conductor on the surface of the ceramic body and extends through a throughhole in a second ceramic body. A lower conductive layer of Pd is formed over and in electrical connection with the outer end of the outer surface conductor, the lower layer having an area greater than the area of the outer end of the outer surface conductor. A dispersion-preventing layer is formed on a portion of the lower layer concentric with the outer end of the outer surface conductor, the dispersion-preventing layer having an area greater than the area of the outer end of the outer surface conductor but less than the area of the lower layer. The dispersion-preventing layer is made of a crystallized glass material.
    Type: Grant
    Filed: September 8, 1989
    Date of Patent: March 26, 1991
    Assignee: NKG Spark Plug Co., Ltd.
    Inventors: Asao Morikawa, Kazuo Kondo
  • Patent number: 5001302
    Abstract: A connecting structure for an electronic part employs an improved anisotropic electrically conductive layer. The layer includes a hot melt type insulative adhesive, heat resilient particles and carbon particles. Each of the heat resilient particles is made of thermoplastic resin and is plated with metal such as gold, nickel or the like. Each of the carbon particles is melted by a heat pressure and brings about an electric conductivity when it is dried and hardened. Thus, the anisotropically conductive layer disclosed in this invention does not include hard particles at all. Namely, an electronic part such as a solar battery cell or a semiconductor device is not damaged by particles of the conductive layer. In addition, the connecting structure employing the aforementioned layer improves the security of adherence and the reliability of the electric conductivity.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: March 19, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventor: Yoshinori Atsumi
  • Patent number: 4999460
    Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.
    Type: Grant
    Filed: November 6, 1989
    Date of Patent: March 12, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Kazuhiro Sugiyama, Yoshinori Atsumi
  • Patent number: 4985663
    Abstract: A display device includes a display panel having electrodes with a plurality of terminals, a driver circuit having electrodes corresponding to the display panel electrodes, and an anisotropic conductive film for electrically connecting the display panel electrodes with the driver circuit electrodes. The connecting part of each of the driver circuit electrodes to be connected with each of the display panel electrodes includes a first connecting portion and a second connecting portion, where the first connecting portion is more narrow than the second connecting portion.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: January 15, 1991
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Hiroshi Nakatani
  • Patent number: 4976796
    Abstract: An electrical conductor or cable splice is formed by passing the conductor ends from which any insulation has been removed through a ceramic insert so that portions of the conductor ends protrude out of the ceramic insert. These protruding portions are then mechanically and electrically connected to each other, by example, by soldering, welding, or brazing. A metal sleeve is then pushed over the ceramic insert and the ends of the sleeve are hermetically sealed to the metal jackets of the conductors or cable. The seal is accomplished, for example, for soldering. In this manner a so-called parallel connection is easily made in which the conductors double back. A longitudinal connection can also be made in which the conductors continue in the same direction through two inner sleeves and through an outer sleeve.
    Type: Grant
    Filed: November 8, 1988
    Date of Patent: December 11, 1990
    Assignee: MTU Motoren- und Turbinen Union Muenchen GmbH
    Inventor: Ernst Feitzelmayer
  • Patent number: 4975544
    Abstract: A connecting structure for connecting conductors used for wiring in a semiconductor device comprises a first conductor provided on a part of the semiconductor device for passing the flow of electrons, an insulator provided on the first conductor and formed with a contact hole, and a second conductor provided on the insulator for passing the flow of electrons, in which the second conductor is provided so as to sandwich the insulator together with a part of the first conductor. The first and second conductors are contacted to each other across the insulator at the contact hole so that the electrons flow through the contact hole. The contact hole extends in a general direction of a flow of electrons passing therethrough and has a stepped shape in which a width measured perpendicularly to the general direction of the flow of electrons increases stepwise towards the general direction of the flow of electrons.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: December 4, 1990
    Assignees: Fujitsu Limited, Fujitsu Vlsi Limited
    Inventors: Nobuyuki Tanaka, Taichi Saitoh, Akio Kiso, Hideo Tokuda, Tetsuya Nakajima, Minoru Takagi
  • Patent number: 4963699
    Abstract: An apparatus for joining a plurality of lead wires with a corresponding plurality of flat type electric wires. The apparatus comprises a plurality of connector terminals, each having a first caulking portion for securing the round wire to a first end of the connector terminal, and a clasping portion for securing the flat wire to a second end of the connector terminal, the clasping portion comprising a first and second spring portion, a projecting portion projecting from the clasping portion toward the flat wire, and second caulking portion for compressing the flat electric wire between the first and second spring portion by securing the first spring portion to the second spring portion. The projecting portion may receive solder so that the flat type electric wire can be spot welded to the connector terminal. To prevent short circuits between the connector terminals, a comb-like spacer may separate the connector terminals, or the exterior of each connector terminal may be insulated.
    Type: Grant
    Filed: April 7, 1989
    Date of Patent: October 16, 1990
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kenichi Urushibata, Keiichi Kojima, Kiyoto Sugawara, Haruo Saen
  • Patent number: 4953289
    Abstract: A flat conductor of indeterminate length having a generally rectangular cross-section is terminated by forming a terminal which includes a seamless tubular barrel portion having a cylindrical bore, flattening the barrel portion to alter the cross-sectional configuration of the bore to generally complement the cross-sectional configuration of the conductor to be terminated, inserting the end portion of the conductor into the flattened barrel and swaging opposite sides of the flattened barrel in a controlled manner to simultaneously form indentations in opposite sides of the barrel which project into the bore and deform associated opposite flat sides of the end portion received therein.
    Type: Grant
    Filed: June 5, 1989
    Date of Patent: September 4, 1990
    Assignee: Pyle Overseas B.V.
    Inventors: Daniel J. Schreck, Ronald G. Ehrmann
  • Patent number: 4949454
    Abstract: A method is described for making an electrical through connection between a first insulated condution line including a flat electrical conductor to a second insulated electrical conduction line.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: August 21, 1990
    Assignee: Kabelmetal Electro GmbH
    Inventors: Friedrich Schauer, Manfred Wolff
  • Patent number: 4950838
    Abstract: An electrical connector for connecting a first conductor to a second conductor. The electrical connector includes a generally E-shaped body which defines first and second conductor receiving cavities for accommodating the respective conductors. An intermediate member extends generally centrally in the interior of the body member, serving to separate the conductor receiving cavities. The body member is provided with an opening communicating with the conductor receiving cavities, by means of which the conductors are adapted to be positioned within the cavities. A plurality of rib members project from the body member into each of the cavities, and are deformable under pressure to vary the size of the cavities.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: August 21, 1990
    Assignee: Burndy Corporation
    Inventor: Gregg Gordon
  • Patent number: 4945192
    Abstract: A connector terminal for joining a round type electric wire with a flat type electric wire. The connector terminal comprises a first crimpable portion for securing the round wire to a first end of the connector terminal, and a clasping portion for securing the flat wire to a second end of the connector terminal, the clasping portion comprising a first and second spring portion, a projecting portion projecting from the clasping portion toward the flat wire, and second crimpable portion for compressing the flat electric wire between the first and second spring portion by securing the first spring portion to the second spring portion. The projecting portion may receive solder so that the first type electric wire can be spot welded to the connector terminal. The resulting connection is extremely compact, reliable, and provides a stable electrical connection over time.
    Type: Grant
    Filed: March 6, 1989
    Date of Patent: July 31, 1990
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kenichi Urushibata, Kiyoto Sugawara, Haruo Saen
  • Patent number: 4943687
    Abstract: A current collecting unit comprises a current collecting rail having a longitudinal axis and provided with a sleeve, and a connecting member mounted in the sleeve having one curved portion located above the longitudinal axis and another curved portion located below the longitudinal axis and both forming electrode supports.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: July 24, 1990
    Assignee: Robert Bosch GmbH
    Inventors: Franz Armbruster, Carsten Bauer, Friedhelm Meyer
  • Patent number: 4942139
    Abstract: A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die. Etching of the die, plus unavoidable etching of the contact members, is conducted without contamination of the junction area.
    Type: Grant
    Filed: February 1, 1988
    Date of Patent: July 17, 1990
    Assignee: General Instrument Corporation
    Inventor: Michael Korwin-Pawlowski
  • Patent number: 4940856
    Abstract: An electrical connector for connecting a first conductor to a second conductor. The electrical connector includes a generally C-shaped body which defines first and second conductor receiving cavities for accomodating the respective conductors. The body member is provided with an opening communicating with the conductor receiving cavities, by means of which the condutors are adapted to be positioned within the cavities. An integral hingedly connected retaining member is associated with one of the conductor receiving cavities whereby, once a conductor has been placed in the latter cavity, the retaining member may be manually rotated to a position wherein it secured the condcutor in the cavity. The connector is then intended to be placed over a second conductor, such that the second conductor is received in the other conductor receiving cavity. The connector is adapted to be compressed, by means of a compression tool, so as to substantially close the opening in the body member.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: July 10, 1990
    Assignee: Burndy Corporation
    Inventor: Leonard Bock
  • Patent number: 4922058
    Abstract: An electrical connector for connecting a pair of electrical conductors is disclosed. The connector includes a connector body defining a connection nest which accommodates a pair of conductors having either similar transverse cross-sectional shapes or conductors having different transverse cross-sectional shapes. The connector body includes a conductor receiving channel in the bottom wall thereof and a channel plug which is frangibly connected to the bottom wall. The plug may be moved into position within the channel to accommodate the pair of conductors having similar transverse cross-sectional shape or may be removed from the connector to accommodate a pair of conductors having different transverse cross-sectional shapes.
    Type: Grant
    Filed: April 20, 1989
    Date of Patent: May 1, 1990
    Assignee: Thomas & Betts Corporation
    Inventor: Julio Rodrigues
  • Patent number: 4902857
    Abstract: A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: February 20, 1990
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Benjamin H. Cranston, Lloyd Shepherd
  • Patent number: 4894906
    Abstract: The ends of two composite superconductors (10a and 10b) having many filaments (12) are joined together to form a joint that is durable, superconducting under proper conditions, and has good shunting capacity. The filaments (12) are exposed by removal of the normal conducting matrices (14a and 14b) from the ends of the composite conductors (10a and 10b) to be joined. The superconductive filaments (12) from each of the composite conductors are inserted together into a sleeve (16) of bimetal construction. The inner surface (18) of the sleeve is made of superconducting material and is metallically bonded to the outer surface (20) of the sleeve which is made of normal conducting material. The bimetal sleeve (16) abuts the matrices (14a and 14b) of the composite conductors (10a and 10b) on one end, and the filaments (12) extend beyond the opposing end of the bimetal sleeve (16). The bimetal sleeve (16) is crimped to form a cold weld joint, and then severed in the region of the crimp to form another cold weld joint.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: January 23, 1990
    Assignee: Nicolet Instrument Corporation
    Inventor: Yuchi Huang
  • Patent number: 4888451
    Abstract: A means for conducting an electrical charge from one nonconducting article having a conductive layer thereon to another article across a joint, wherein the means is displaced from the mechanical interface of the joint. This reduces joint stresses from electrical currents.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: December 19, 1989
    Assignee: United Technologies Corporation
    Inventors: Darryl Toni, Eliasz Poss
  • Patent number: 4831240
    Abstract: Industrial electric ovens and fryers of the type used for cooking precooked foods such as meats prior to packaging of the food draw high currents which tend to melt internal electrical connections. An industrial heating device includes compression-type electrical connections which reliably carry high currents and are capable of withstanding high voltage levels without breaking down. Compression-type electrical connections are used instead of the screw-type connections of the prior art to insure that all electrical connections have reliable, relatively large current-carrying cross-sectional contact areas. The electrical connection matrix of the resulting industrial heating device has increased current-carrying capacity and is much more reliable and resistant to electrical failure.
    Type: Grant
    Filed: October 8, 1987
    Date of Patent: May 16, 1989
    Assignee: Hester Industries, Inc.
    Inventor: Kenneth F. Davis
  • Patent number: 4829146
    Abstract: A conductive metal coupling sleeve harder and springier than the conductor and connector to be joined is interposed between them. The sleeve having patterned inside and outside surfaces is placed over the conductor end and the conductor-sleeve combination is inserted into the bore of the desired connector and subjected to compressing forces to crimp the components together. The patterns of the sleeve interlock with the conductor and the walls that define the connector bore. The springiness of the sleeve insures good electrical conductivity between the components in the event there is some springback of the components upon the termination of assembly compression or creep during use.
    Type: Grant
    Filed: April 11, 1988
    Date of Patent: May 9, 1989
    Assignee: Amerace Corporation
    Inventor: Wolfgang Duve
  • Patent number: 4823461
    Abstract: A method of manufacturing a fluidic angular rate sensor of the type wherein fine wires, such as tungsten wires, are mounted in tension over the heads of two pairs of spaced apart metal supports which are mounted on a ceramic disc having fluid passage apertures therein, comprising plating gold on the wires; fixedly mounting the wires between the spread apart metal supports by means of thermocompression bonding or the like; and heating the mounted gold plated wires in a predetermined atmosphere for removing the plated gold from the wires and to recrystallize the wires.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: April 25, 1989
    Assignees: Honda Motor Co., Ltd., Stanley Electric Co., Ltd.
    Inventors: Fumitaka Takahashi, Kunio Okazaki, Masaru Shiraishi, Masayuki Takahashi