Abstract: A thermal recording head comprises a supporting substrate having a wiring pattern wherein a plurality of heating elements arranged linearly and a plurality of lead-out wires connected respectively to each heating element are formed on the end surface and said lead-out wires are elongated to the adjacent side surface selective terminals connected to a plurality of said heating elements a wiring substrate having a wiring pattern having signal terminals for applying a selective signal for selecting said heating elements and a diode matrix connected to said terminals; a plurality of diodes which are connected between said wiring pattern on said supporting substrate and said wiring pattern on said wiring substrate and which form said diode matrix in the space facing said wiring patterns.