Road Vehicle Patents (Class 188/208)
  • Patent number: 8462510
    Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: June 11, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Yi Lin, Po-Yao Lin
  • Patent number: 4729325
    Abstract: A bolster having a plurality of flat surfaces on the opposite side thereof arranged to provide a surface on which the saddles of an air brake assembly are fastened.
    Type: Grant
    Filed: April 7, 1986
    Date of Patent: March 8, 1988
    Assignee: AMSTED Industries Incorporated
    Inventor: James A. Henkel