Abstract: In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.

Abstract: A method for producing busbar includes a step of applying pressure to pressure-weld a plurality of electric wires in a plurality of first regions in a bundle of the plurality of electric wires, the first regions being arranged at a predetermined interval in the extending direction of the bundle, to form a plurality of terminal joints that are joined to the output terminals of the respective batteries.

Abstract: The present disclosure aims to provide an electrical contact to which a low boiling point metal is added, the electrical contact being able secure both mechanical strength and conductivity at the same time. The electrical contact according to the present disclosure includes a base material made of Cu, particles of a high melting point substance dispersed in the base material, the particles being made of at least one of a high melting point metal or a carbide of the high melting point metal, and Te and Ti dispersed in the base material, wherein, the Te of 3.5 to 14.5 mass % is added where the total is 100 mass %, and Ti/Te is 0.12 to 0.38.

Abstract: A material and method for manufacturing an Ag-based electrical contact material includes synthesizing an intermetallic compound of MexSny type; ball milling the intermetallic compound; mixing the so obtained intermetallic compound powder with silver powder; packing the mixed powders into a green body; and forming a MeO-SnO2 cluster structure by internally oxidizing the intermetallic compound MexSny while sintering the green body.

Abstract: A ceramic reed switch includes a ceramic tube, and a first end cover and a second end cover, a first pin is disposed on an outer side of the first end cover, a first magnetic reed is disposed on an inner side of the first end cover, the first magnetic reed forms a cantilever beam structure on the first end cover, a second pin is disposed on an outer side of the second end cover, a second magnetic reed is disposed on an inner side of the second end cover, the second magnetic reed forms a cantilever beam structure on the second end cover, free ends of the first magnetic reed and the second magnetic reed are overlapped in the ceramic tube and form an air gap, and a contact is disposed on an overlapped end of the first magnetic reed and the second magnetic reed.

Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: Provided is a method of manufacturing a contact material, including the steps of: forming a Ni alloy film having a film thickness of 40 nm or more and 110 nm or less on a surface of WC powder having an average particle diameter of 2 ?m or more and 10 ?m or less by an electroless Ni plating method; performing heat treatment for degassing at a temperature of 500° C. or more and 860° C. or less; crushing Ni alloy-coated WC powder after the heat treatment; mixing the crushed Ni alloy-coated WC powder and Cu powder having an average particle diameter of 1 ?m or more and 100 ?m or less; and compressing the resultant mixture, followed by sintering the mixture at a temperature of more than 1,083° C. and less than 1,455° C.

Abstract: A circuit board for an electronic device includes pattern areas on both sides of the circuit board. Each end of a thermistor is electrically connected to electrically conductive pads on pattern areas on the top and bottom sides of the circuit board. An input plug is electrically connected to an end of the thermistor. The input plug is electrically connected to the thermistor by way of an input connector to which the circuit board is inserted.

Abstract: An electric contact for preventing a terminal of an electric part and the electric contact from sticking to each other after a continuity test to improve the durability of the electric contact; and a socket for electric parts using the electric contact. The electric contact of this invention includes a first layer made from a material into which Sn melts and diffuses upon application of heat; and a second layer formed on the outer side of the first layer and made from a material lower in the rate at which Sn melts and diffuses upon application of heat than the first layer.

Abstract: A method for producing an electrode material, provided to involve: (i) a provisional sintering step of sintering a mixed powder containing a powder of a heat resistant element and a powder of Cr to obtain a solid solution where the heat resistant element and Cr are dissolved; (ii) a pulverizing step of pulverizing the solid solution to obtain a powder; (iii) a main sintering step of sintering a molded body obtained by molding the powder of the solid solution, to produce a sintered body; and (iv) a Cu infiltration step of infiltrating the sintered body with Cu.

Abstract: An electrical contact tip for switching applications. The contact tip includes a body having a first layer and a second layer. The first layer arranged on the second layer and adapted to come in contact with a corresponding contact tip during switching operations. The first and second layers consist of Ag-composites of one or more elements, compounds or alloys, where the hardness of the first layer is lower than the hardness of the second layer.

Abstract: A laminated ceramic electronic component that includes a laminated body formed by laminating a ceramic layer and an internal electrode; and an external electrode formed on an outer surface of the laminated body so as to be electrically connected to the internal electrode. The external electrode includes a conducting layer that is in contact with the internal electrode, and the internal electrode contains Ni. The conducting layer contains metal particles containing a Cu3Sn alloy, and a thermosetting resin. The metal particles contain Sn in a weight ratio of 36.5 to 47.8% to the total amount of Sn and Cu.

Abstract: The disclosed concept pertains to vacuum interrupters and arc-resistant shields. The arc-resistant shields are positioned in between a ceramic insulator. Each end of the arc-resistant shield is hermetically sealed to the ceramic insulator. The arc-resistant shield includes an outer surface and an inner surface. The inner surface includes an arc-resistant material. Disposed within the arc-resistant shield is a pair of electrode assemblies which are separable to establish arcing. In certain embodiments, the arc-resistant material is copper-chromium alloy.

Abstract: A method for producing an electrode material, involving: (i) a step of preparing a powder of a solid solution of Cr and a heat resistant material selected from the group consisting of Mo, W, Ta, Nb, V and Zr, wherein either a peak corresponding to Cr element or a peak corresponding to the heat resistant element, which are observed by X ray diffraction measurement made on the powder of the solid solution, disappears; (ii) a step of molding the powder of the solid solution to obtain a molded body and then sintering the molded body to produce a sintered body; and (iii) a Cu infiltration step of infiltrating the sintered body with Cu.

Abstract: An improved printed circuit board contacts that are used to implement switch contacts of keypads and keyboards combining gold and silver plating over copper conductors. In the preferred embodiment of FIG. 5 shows a cross section of the printed circuit board 14 and the switch contact 20, where the switch contact material is electrolysis immersion silver layer 26 plated onto copper layer 22 and an electrolysis immersion gold layer 28 plated over that. An alternate embodiment is shown in FIG. 4 of a printed circuit board 14 with a switch contact 20, wherein a layer of nickel 24 is plated over the copper layer 22, then the silver layer 26 is plated onto the nickel 24, then the gold layer 28 is the topmost layer. Here the nickel layer is used to prevent copper migration into the other layers.

Abstract: A temperature fuse includes a cylindrical metal case, a sliding electrode slidable over an inner surface of the metal case, and a terminal electrically connected to the metal case while the sliding electrode is in contact therewith, during activation, the sliding electrode moving away from the terminal so that electrical connection between the metal case and the terminal is cut off, the sliding electrode being formed by working a thin metal plate, the sliding electrode including at least a base material layer composed of copper or a copper alloy and a first surface layer composed of silver or a silver alloy, and a site of contact with the terminal being the first surface layer having a thickness not smaller than 5 ?m.

Abstract: An electrical contact is disclosed. The electrical contact includes a first element of a first material having one or more aperture, and a second element of a second material, the second element being positioned in at least one aperture of the one or more aperture of the first element, wherein the second material is different from the first material. Electrical contact devices, assemblies, and methods are provided, as are other aspects.

Abstract: A touch module includes a transparent substrate, a shield layer, a touch electrode layer, a transparent insulation layer and a lead layer. The shield layer is coated on the transparent substrate. The touch electrode layer is coated on both the transparent substrate and the shield layer. The transparent insulation layer is disposed on the touch electrode layer and formed with at least one through hole. The lead layer is disposed on the transparent insulation layer and formed with a conduction section positioned in the through hole in electrical connection with the touch electrode layer. Therefore, the lead layer can directly electrically connect with the touch electrode layer through the through hole of the transparent insulation layer. Accordingly, the cost for the optical mask design and the lithographic and etching processes can be saved and the problem that the transparent substrates often fail to fully attach is eliminated.

Abstract: The invention discloses a semi-finished product for making plug-in contacts in plug-in connectors for electric DC power systems in motor vehicles which are operated at a nominal voltage at which electric arcing may occur, having an electrically conductive main body made of a non-precious metallic material that carries, at least in part, a contact-making coating of a material more precious than the material of the main body. It is provided according to the invention that the coating has thickness of at least 0.3 ?m and consists of silver or of a silver-based alloy with an addition that will not form an alloy with silver or with the silver-based alloy, or will at best form a precipitation alloy, and which has a higher melting point than silver.

Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.

Abstract: A switching arrangement having a plurality of electrical contacts configured for high speed electromechanical power switching applications such as transfer switches and circuit breakers. Contacts that contact one another when closed can include snubber portions or parallel snubber contacts that vary in resistance during sliding contact travel. One snubbering switching arrangement includes a first pair of snubbing contacts in parallel with a first pair of electrical contacts where the snubbing contacts make sliding contact before the electrical contacts when the load is being connected to one power source and a second pair of snubbing contacts in parallel with a second pair of electrical contact where the snubbing contacts make contact before the electrical contacts when the load is being connected to a second power source. One such switching arrangement includes the snubber or snubbing contact formed of a brush of electrically conductive bristles.

Abstract: Disclosed is an electrical contact having high electrical conductivity for a compact electromagnetic relay including an internally oxidized silver-oxide material which is prepared by subjecting an Ag alloy having a composition consisting essentially of, by weight, 5.1 to 9% Sn, 1.5 to 5% In, and 0.005 to 0.06% Bi, with the balance being Ag and unavoidable impurities, to an internal oxidation treatment and then subjecting to a heat treatment for diffusion, aggregation, and growth of precipitated oxides, wherein the internally oxidized silver-oxide material has a metallographic structure such that coarse grains of composite oxides are dispersed and distributed in an Ag matrix, the coarse grains of composite oxides being formed as a result of coarsening of ultra-fine grains of Sn-based oxides and ultra-fine grains of In-based oxides, which are precipitated by the internal oxidation treatment, by the heat treatment for diffusion, aggregation, and growth of the precipitated oxides.

Abstract: A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower than the sheet resistance of the pure metal. In addition, the alloy may have superior creep and higher recrystallization temperature than the pure metal. It is hypothesized that these advantageous material properties are a result of the larger grain structure existing in the NiMn alloy film compared to the pure nickel metal film. These properties may make the alloy appropriate for applications such as MEMS thermal electrical switches for telecommunications applications.

Abstract: Contact pad designed to be fixed on a movable contact of a low-voltage circuit breaker designed to withstand peak short-circuit currents comprised between 200 and 600 amperes per square millimeter of pad. The pad is made of a silver- or copper-based conducting material alloy, a fraction of refractory particles such as tungsten carbide, tungsten or titanium nitride and a fraction of carbon fibers. The weight percentage of carbon fibers in the pad is strictly less than 2% of the total weight of the pad.

Abstract: An electrical contact, especially an electrical contact of a plug connector, includes a metallic substrate on which a contact layer is applied in the form of a gradient layer. The gradient layer is formed by at least two elements of which one is silver and forms a matrix for the second element or forms an alloy therewith, or of which one is tin and the other is phosphorus or of which one is indium and the other is tin.

Abstract: Angled spring contacts and switches made with contactors containing angled spring contacts are disclosed. The housing for the angled spring contacts has a generally cylindrical shape. The contacts are contained within the housing with their ends extending from the housing on either side. The contacts are formed by making bullet-shaped internal contacts that are joined by a spring. The spring is mounted to the two contacts to urge the two contacts away from each other at an angle to a longitudinal axis of the housing. This angle forces contact between each contact and the housing in at least two places, thus creating redundant paths between the contacts. Switches, such as plunger switches having a normal or OFF position, and an actuated or ON position, may be made with one or more angled spring contacts. The contacts have separate surfaces for electrical conduction and for arcing.

Abstract: The invention provides a material for sliding contacts that is suitable for a small-sized DC motor used in recent downsized CD players and is excellent in durability. A material for sliding contacts used in a commutator of a small-sized DC motor that consists essentially of 0.01 to 3.0% Ni by weight, 0.01 to 6.0% ZnO by weight and/or 0.01 to 3.0% MgO by weight, furthermore, in some cases, 0.01 to 5.0% Cu by weight, and the balance Ag, in which Ni metal particles, ZnO particles or MgO particles are dispersed in the matrix of Ag.

Abstract: An electric contact comprises a main body consisting of a copper-based alloy or of stainless steel and a contact layer consisting of a gold-based alloy. The contact layer has a thickness of at least 0.3 ?m and consists of gold with a content of 0.5 percent by weight to 15 percent by weight of one or more platinum group metals, and that an intermediate layer consisting of silver or of a silver-based alloy or of nickel is provided between the main body and the contact layer. The contact layer is preferably applied on the main body by a PVD process.

Abstract: A high quality electrical contact that is made of a Cd free Ag alloy and can be applied to a breaker is provided. The electrical contact is made of an Ag alloy containing Sn and In each 1 to 9% by weight, and has a first layer as the surface layer and a second layer as an internal portion. The hardness of the first layer and the hardness of the second layer are equal to or more than 190 and equal to or less than 130, respectively, based on micro Vickers standard defined by JIS. The thickness of the first layer is within the range from 10 to 360 ?m. In particular, the electrical contact has a high quality temperature characteristic as well as a high quality welding resistance characteristic.

Abstract: Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate having board leads and a plurality of electrical connectors arranged adjacent a component site. Selectively configurable circuitry may be carried by the substrate and adapted to selectively couple selected ones of the electrical connectors to selected ones of the board leads. One or more trace may be associated with each of the electrical connectors and one or more of these traces may include a thermally actuatable switch that can be selectively closed. The thermally actuatable switch may comprise a gap between two conductive lengths of the conductive trace, an exposed switch surface, and a thermally responsive member that may wet the exposed switch surface when selectively heated above an activation temperature.

Abstract: In the fabrication of a surge protector device which utilizes breakdown phenomena of a resistive film, a case which fixes metal bars in it, makes electrical contacts with the metal bars and contains oxidizing and refractory agents, a cap, metal bars and oxidizing and refractory agents are prepared in advance. In the fabrication process of the surge protector device using these elements, a step to control the force applied to the cap, the metal bars and the case so that the force applied to the interface between the resistive films and the mechanical contacts which form electrodes to the metal bars can be controlled. Automation process to fabricate the surge protector device will be realized and efficient fabrication of the precise surge protector device will be also realized. A surge protector device whose breakdown voltage is precisely controlled will be realized reproducibly.

Abstract: The present invention is aimed at providing a sliding contact material that has an alloy composition containing no harmful substance like Cd, especially excellent contact resistance properties, electrical functions that are good and is not subject to secular change, and abrasion resistance practically bearing comparison with conventional sliding contact materials, and is aimed at lengthening the life of a motor by the use of a sliding contact material having excellent durability as a commutator for a small direct-current motor. The present invention is a sliding contact material of an Ag—Ni-based alloy that is used in sliding part electrically switching on and off by mechanical sliding action, and the material is a sliding contact material of Ni metal particle-dispersed-type Ag—Ni-based alloy that is produced in such a method that 0.7 to 3.0 wt. % Ni powder, an additive of Li2CO3 powder corresponding to 0.01 to 0.50 wt.

Abstract: An electrically conductive metal strip for the production of electrical contact components, in particular plug connectors, having a core strip made of a copper material and a metal facing, made of a copper-nickel-zinc alloy (nickel silver), roll-bonded clad on at least one side. The core strip possesses an electrical conductivity of at least 20 m&OHgr;/mm2. The combination of copper material and nickel silver as the metal facing yields a metal strip with high electrical conductivity whose mechanical surface properties correspond to those of nickel silver.

Abstract: The present invention relates to powder-metallurgically produced composite material comprising a matrix of a metal with a melting point of at most 1,200° C. and a granular additive which consists of at least two refractory components embedded in said matrix, characterized in that the refractory components are present as mixed crystals or intermetallic phases. In one embodiment of the invention one or a first group of refractory component(s) has a melting point in the range of 1,500 to 2,400° C. and the second or the second group of refractory component(s) has a melting point above 2,400° C. The composite material is produced by heating a pulverized mixture of the refractory components, thus converting it into a mixed crystal or an intermetallic phase, and then combining the powder obtained by cooling and pulverizing with a metal matrix having a melting point of at most 1,200° C. by means of powder-metallurgy.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: The contact material of the present invention comprises: an anti-arcing constituent consisting of at least one TiC, V and VC of which the content is 30˜70 volume % and whose mean particle (grain) size is 0.1˜9 &mgr;m; C whose content is 0.005˜0.5 weight % with respect to the anti-arcing constituent, whose diameter is 0.01˜5 &mgr;m when its shape is calculated as spherical, and which is in non-solid solution condition or condition in which it does not form a chemical compound; and a conductive constituent consisting of Cu and constituting the balance.

Abstract: The present invention provides an electric contact structure comprising a first contact surface and a second contact surface, wherein at least one of the first and second contact surfaces comprises an AuAgPd alloy including 7-16% by weight of Ag and 1-10% by weight of Pd, whereby a high anti-adhesion property and a highly stable contact resistance can be obtained particularly when the electric contacts are in non-operating state.

Abstract: A vacuum valve which has a contact material having a constituent of high electrical conductivity such as Cu and an anti-arcing constituent including Cr in which particles whose particle size is in the range 0.1.about.150 .mu.m represent at least 90 volume %, and a ratio defined by the formula (.alpha..sub.900 -.alpha..sub.50).times.100/(.alpha..sub.900) for this contact material has a value of 8-12% and is the coefficient of thermal expansion of the contact material .alpha..sub.50 is the coefficient of thermal expansion of the contact material at 50.degree. C. The formation of channels generated at the interfaces of the Cr particles and the Cu matrix after undergoing the brazing step is suppressed, enabling the static withstand-voltage, contact resistance, and the breaking performance characteristics of the vacuum valve to be stabilized.

Abstract: A contact material for a vacuum interrupter including, a conductive component including at least Cu, and an arc-proof component including at least one selected from the group consisting of carbides of W, Zr, Hf, V and Ti. An amount of the conductive component in the contact material is 40-50 vol %, an amount of the arc-proof component in the contact material is 50-60 vol %, and a grain size of the arc-proof component is 3 .mu.m or less. A total amount of a sintering activator including at least one selected from the group consisting of Co, Fe and Ni melted in the conductive component is 0.1% or less of the amount of the conductive component.

Abstract: Sintered silver-iron material for electrical contacts, with properties comparable with those of silver-nickel materials, is obtained by using iron powder having more than 0.25% carbon by weight and microhardness higher than 200 HV 0.025 and sintering in a hydrogen-free protective gas.

Abstract: The vacuum valve contact material of the present invention is manufactured by a step of mixing an anti-arc constituent powder and a conductive constituent powder, a step of forming, and a step of sintering the formed body below the melting point of the conductive constituent, and has improved arc interruption performance.

Abstract: An Ag--Cu alloy for a sliding contact containing:a) 0.1 to 8.0 wt. % of Cu, based on the weight of the alloy, wherein at least 70 wt. % of the Cu contained in the alloy is solid-solubilized in an Ag-.alpha.-phase; andb) 0.1 to 4.0 wt. %, based on the weight of the alloy, of at least one metal selected from the group consisting of Ge, Ni, Sn, In, Zn, Mg, Mn, Sb, Pb and Bi.The Ag--Cu alloy is desirably utilized to form a composite with a Cu or Cu alloy base material. Such composite has been found to be very useful for fabricating the commutator of a compact DC motor.

Abstract: A membrane switch having a pair of flexible printed boards and a pair of contacts respectively disposed on said printed boards. The contacts are formed of powdered alloy of silver and palladium bounded by resinous material, and a conductive layer of silver powder is disposed between the flexible printed board and the contact. Preferably, the powdered alloy contains 50-97 weight percent silver and palladium in the remainder of weight percent.

Abstract: Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy. Also, three-layered composites comprising a surface layer of one of the foregoing alloys, an intermediate layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy as well as direct current motors comprising commutators comprising a three-layered composite.

Abstract: Silver-iron materials for electrical switching contacts with properties which come very close to those of silver-nickel materials formed of 4.6 to 15% by weight iron and 0.05 to 5% by weight of one or more of the oxides magnesium oxide, calcium oxide, yttrium oxide, lanthanum oxide, cerium oxide, chromium oxide, iron oxide, aluminum oxide, indium oxide, silicon oxide, and tin oxide, the balance being silver.

Abstract: A one-sided oxidized silver-cadmium object is formed. One side of a silver-cadmium object is covered with a non-silver-cadmium shield to enable the one side to resist oxidation. Then the object is oxidized under conditions that leave substantially unoxidized a layer of the object adjacent the one side. An oxidized silver-cadmium object has a non-silver-cadmium, oxidation-resistant shield attached to one side of the object, the object having a substantially unoxidized layer adjacent the one side.

Abstract: A thin film silver-nickel coating for use as a protective coating on electrical terminals of separable electrical connectors. The silver-nickel coating is a silver-nickel nano-composite material characterized by silver and nickel grains having an average grain size of about five to about fifty nanometers, yielding a silver-rich phase and a harder nickel-rich phase as a result of silver and nickel being immiscible. In accordance with this invention, the volume fraction of nickel significantly influences the fretting wear resistance of the coating, with a preferred nickel content being resulting in the presence of disconnected islands of the nickel phase dispersed within a relatively softer silver matrix.

Abstract: In a rotary switch, a manually rotatable shaft turns a disk which has a plurality of riser cam segments on one of its faces. Stepwise rotation of the disk causes the cam segments to press down on flat spring contacts arranged in the switch to put the tip of one of the contacts at a time into contact with a stationary electrical contact bar that is coated with a noble metal. The spring contacts are configured such that when pressed by a cam the tips are caused to make contact with the stationary contact bar and then slide longitudinally so as the tip will pick up some of the noble metal coating from the contact bar. The tips are shaped with a traverse curve intersecting a longitudinal groove to thereby produce two points that make high unit stress contact with the stationary contact bar.

Abstract: A new class of low chop contact materials based on Ag-chromium carbide and Ag-Cr compositions have an essentially 100% dense, porosity free microstructure. These materials combine the advantageous properties of Ag-WC and Cu-Cr contacts without their disadvantages. A method of making this new class of low chop contact materials includes the steps of cold pressing a mixture of Ag and chromium or chromium carbide to form an unsintered blank and the elevated temperature infiltration of silver into the unsintered blank to obtain an essentially 100% dense, porosity free microstructure.

Abstract: A silver-oxide material for electric contacts of high-current switches, having excellent deposition resistance and consumption resistance. The material is formed by subjecting to an internal oxidation treatment an Ag alloy consisting essentially, by weight %, of:Sn: 5.1-8.5%;In: 1.7-3.2%;Te: 0.1-0.6%; andAg and inevitable impurities: the balance. If required, at least one of the following elements may be added:Ni: 0.05-0.2%; andCd: 0.3-0.8%.