Abstract: A low-power electrical contact particularly suitable for switching and plug-in connections. The contact comprises an outer contact layer and a substrate composed of a copper base alloy. The contact layer consists essentially of an alloy of 35-55% by weight gold, 18-33.5% silver, 30-40% palladium, and (i) 1-6% indium, or (ii) 0.5-2% tin together with 0.5-2% indium. An intermediate layer of nickel or copper-nickel may be interposed between the contact layer and the substrate.

Abstract: A flexible high current carrying connection between relatively fixed and moveable terminals is provided by constructing the connection of electrically conductive laminated material and forming at least a portion of said connection into an S-shape. With this type of connection a flexible, low cost, high current-carrying connecting link permitting a limited degree of rotation between relatively fixed and moveable points is provided that requires a minimum amount of space to accommodate such a connecting link.

Abstract: An isolated phase bus disconnect switch has a cylindrical aluminum center conductor coaxially disposed within a cylindrical aluminum housing. The center conductor is composed of two fixed axially spaced sections and a coaxial telescoping sleeve assembly which moves axially to make and break electrical contact between the fixed sections. One end of each fixed section and both ends of the sleeve assembly have copper contact rings fixedly attached thereto. Adjoining surfaces of the copper-aluminum interfaces are silver plated, and each of the adjoining aluminum members is axially slotted to permit flexing to allow for differential thermal expansion, while at the same time preventing relative motion between the plated surfaces.

Abstract: The cooperating contacts of a reed switch each comprise a layer of palladium. A protective layer of ruthenium deposited on the palladium layer prevents the formation of frictional polymers.

Abstract: A contact arrangement for a graphite electric arc-electrode employs a contact spud composed of a metal having a high melting point and a soldering layer disposed between the contact spud and graphite electrode. The soldering layer contains at least one carbide forming metal. In one embodiment of the invention, a carbide-forming metal layer is disposed between the graphite electric arc-electrode and the soldering layer. In a preferred form of the method of making the arrangement, the soldering layer and the carbide-forming metal layer are plasma-sprayed or steamed onto the surface to be connected.

Abstract: A low-current contact structure formed on a contact member or substrate of various layers is described. A layer of refractory material is connected via a layer of easily diffusive metal with a layer of noble metal through diffusion annealing.