Abstract: To quickly remove, away from a rail, an article which is subject to defects in the case where the feeding of the article to be delivered along the rail and plated is hindered, there is provided a continuous plating apparatus in which a planar article (3) to be plated is laid in a vertical direction on a rail (2) horizontally provided in a plating bath, and the article to be plated is clamped on both surfaces by rollers (5 and 17) fixed to vertical rotary shafts (4 and 10) and moved on and along the rail (2) to thereby plate the article (3), characterized in that an upper end side of each unit composed of the plurality of rotary shafts (10) is moved in a direction away from the article (3) to be plated. By only moving the upper ends of the rotary shafts (10) in the direction away from the articles (3) to be plated and by slanting the rotary shaft (10), the articles (3) having an inconvenience can be removed upwardly without removing the rotary shafts (10).

Abstract: A process and apparatus for selectively electroplating the tip portion of an airfoil. The airfoil includes a root portion and a blade portion having a tip. At least part of the blade including the tip is coated with an insulating material. Insulating material is removed from the tip and the airfoil is mounted in a fixture so that the tip is exposed. The fixture is immersed in a sealing bath, and the fixture and at least a portion of the airfoil is encased in sealing material while leaving the tip exposed. The fixture is then immersed in an electroplating bath, the exposed tip is electroplated, and the fixture is removed from the bath. The fixture includes an elongated base member and a grip element supported on the base member. The grip element is made of a flexible material and has a plurality of slots configured for receiving the root portion of the airfoils. An electrical contact is provided in each slot so as to contact the root portion of the airfoil. A plurality of fixture may be mounted on a carousel.

Abstract: A semi-conductive grindstone (10) comprising grains and a semi-conductive binder to fix the grains is prepared, a voltage is applied between the grindstone and the conductive workpiece (1), an conductive grinding fluid is supplied between them, the grindstone is contacted to the workpiece, the binder of the grindstone is subjected to electrolytic dressing in the contact point, and the workpiece is simultaneously ground by using the grindstone. A semi-conductive binder is preferably composed of metal powder and an insulating resin. Consequently, application is possible to peculiar grindstones such as ball-nose grindstone, grinding of the workpiece is simultaneously possible with dressing of the working surface of the grindstone by electrolytic dressing, and thus, grinding of long duration is also possible maintaining high efficiency and high preciseness.

Abstract: An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and rotatably held by a motor at a position opposite to the metal plate for anode; a metal plate for cathode in the shape of a thin plate mounted on the metal rod; and a DC power supply connected to the metal plate for anode and the metal rod for cathode.

Abstract: A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared to the base. The electrolyte is applied with a long stretched-out plastic electroplating tip which has a plurality of channel passages through which the electrolyte passes and which are arranged at a right angle to the tip. The plurality of channel passages terminates at and empties into at least one discharge opening which extends along the entire length of the tip. The electroplating tip, when it is in the operating position, is arranged such that the at least one discharge opening is positioned on the bottom and extends horizontally. The electrolyte is supplied to the electroplating tip from above.

Abstract: The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.

Abstract: The non-uniformity of electroplating on wafers is due to the appreciable resistance of the thin seed layer and edge effects. Mathematical analysis of the current distribution during wafer electroplating reveals that the ratio between the resistance of the thin deposited seed layer and the resistance of the electrolyte and the electrochemical reaction determines the uniformity of the electroplated layer. Uniform plating is critical-in-wafer metallization for the subsequent step of chemical mechanical polishing of the wafer. Based on the analysis, methods to improve the uniformity of metal electroplating over the entire wafer include increasing the resistance of the electrolyte, increasing the distance between the wafer and the anode, increasing the thickness of the seed layer, increasing the ionic resistance of a porous separator placed between the wafer and the anode, placement of a rotating distributor in front of the wafer, and establishing contacts at the center of the wafer.

Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.

Abstract: A device for evenly distributed electrical current transmission to a disc element when electroplating the disc element includes a closed loop of an elongated, elastic, electrically conducting body contacting one side of the disc element at least at its outer peripheral area.

Abstract: An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface. The contact assembly includes a closed or substantially closed cylinder member of titanium or titanium alloy, a copper lining or disk disposed within the cylinder, and a titanium or titanium alloy post fixed and in electrical engagement with the lining or disk.

Abstract: A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.

Abstract: An electroplating apparatus is made up of a cup having a plating solution therein, a plating solution controlling unit which overflows the plating solution from the cup, a holding unit which holds an object to be plated so as to contact to the overflowed plating solution, and a mesh shaped anode electrode provided in an internal portion of the cup, the mesh shaped anode electrode having a surface comprising a metal which are plated by the plating solution. Accordingly, the electroplating apparatus can get the plated film having a smooth surface.

Abstract: A composite plating apparatus includes a cylindrical electrode which is positioned in a hollow section of a workpiece with a surrounding gap left therebetween. A plurality of through-holes are formed across the thickness of an outer wall of the cylindrical electrode. Composite plating liquid is jetted out through the through-holes and impinge on the inner surface of the hollow section to thereby produce turbulence. The turbulent liquid provides a uniform distribution of ceramic particles in the liquid. As a result, the ceramic particles can be co-deposited uniformly in a metallic matrix, and hence a uniform abrasion-resistant characteristic is obtained all over a resultant composite plating film.

Abstract: A system and method for electro-forming a metal layer on a substrate. The system has a rotary jet planarizer in an electro-forming or galvanic cell. The cell includes a toroidally-shaped manifold with two inlets and an outlet. Each of the inlets is coupled to tubing from a sump assembly. Pressurized electrolyte flows from the sump assembly to the manifold. Directly downstream from the manifold is a diffuser having a plurality of openings. Electrolyte flows through the diffuser to an toroidally-shaped anode basket filled with metal pellets. After flowing through the anode basket, the electrolyte flows to a rotary jet planarizer. The planarizer has a rotatable plate with a main opening, a plurality of apertures radially extending from the main opening, and a conduit that is coupled to the main opening and extends out of the cell. A motor is coupled to the rotary jet planarizer to rotate the plate.

Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is used to agitate and distribute the electrolyte. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while a rotating anode is used to agitate and distribute the electrolyte.

Abstract: A fixture for supporting a workpiece during electroplating of a metal upon the workpiece in a conductive electroplating bath includes a non-conductive frame member for receiving the workpiece therein. The fixture further includes a current distribution means having a plurality of contacts. The plurality of contacts is disposed inwardly for providing an equally distributed electrical contact with an outer perimeter region of the workpiece. The workpiece is supported between the frame member and the current distribution means. Lastly, a thief electrode is perimetrically disposed about the workpiece and spaced a prescribed distance from the workpiece by a gap region. During plating of a metal upon the workpiece, the gap region between the thief and the workpiece is filled with the conductive electroplating bath. An electroplating apparatus having a fixture for supporting a workpiece during an electroplating process and a method of supporting the workpiece to be electroplated are also disclosed.

Abstract: The present invention provides a structure of an electric contact of an electrolytic cell, wherein an elongated conductive member is provided as a bus bar 10 on a wall of an electrolytic cell for feeding current to anodes 1 and cathodes 2 arranged in the electrolytic cell; the conductive member 10 forms a convex portion 12 in parallel with the longitudinal direction on the upper surface of an elongated plate member 11 forming a base; and at least the upper surface of the convex portion 12 is totally or partially gold plated 13 in the longitudinal direction.

Abstract: According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank. The temperature control device provides selective control of temperature in various regions of the substrate during plating so as to control plating over the first face of the substrate.

Abstract: Bumps are formed by means of uniform plating in which air can be easily discharged.

Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.

Abstract: A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: An electroplating wand has a tubular housing with a battery compartment at a first end and an elongated anode protruding from a second end of the housing. The anode is covered with a cloth material that absorbs plating solution when immersed within a container of plating solution. A DC battery is received within the battery chamber and provides the sole power source for the wand. A cap for a container of plating solution is clamped on the anode with the end of the anode protruding past the cap so that it can be immersed within a container of plating solution while the container is fastened to the cap over the end of the anode. A ground wire protrudes from the battery chamber and has a clip allowing it to be fastened to the material that is to be plated.

Abstract: An apparatus may be used to deposit metal or conductive layers upon semiconductor wafers using an electrochemical process. The apparatus comprises a housing for retaining a first electrode (e.g., anode) and a second electrode (e.g., cathode), in a fixed spaced-apart relation to each other, with the surface area of the anode exceeding the surface area of the cathode (the wafer). The back surface of the wafer is mounted on a handling disk; the disk has an aperture for accessing the wafer and is held in the housing. A contact probe passes through the aperture to touch the back surface of the wafer, the probe having a spring-loaded spherical radius head for depressurizing the head as it touches the wafer. This apparatus permits a uniform current distribution as the contact probe is not interposed between the electrodes, and the larger surface area of the anode relative to the wafer enhances the production of uniform and reproducible films.

Abstract: The invention relates to a method to produce an oxide coating that protects against corrosion and wear on the metal surface of a workpiece, more specifically, for the metal surface of a body for accepting a valve, wherein with the use of a cathode, the workpiece, as an anode, is subjected to constant or pulsating direct current in an electrolyte, with an auxiliary anode, which is resistant to the electrolyte, being attached to the workpiece before the workpiece is dipped into the electrolyte, which discharges the anodizing current at locations where no anodized coating is required or only a limited anodized coating is required.

Abstract: A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This makes silicon substrates with various sizes processable. A silicon substrate is held by suction by reducing a pressure in a space in a groove of the suction pad by a pump (120). An opening (103) is formed in the holder (102) so that the both surfaces of the silicon substrate are brought into contact with an HF solution (115). The silicon substrate is anodized by applying a DC voltage by using a platinum electrode (109a) as a negative electrode and a platinum electrode (109b) as a positive electrode, and thereby a substrate having a porous layer is produced.

Abstract: A lithographic apparatus and method are presented which use an electric field to form features from a desired material upon an upper topography of a semiconductor substrate. A layer of an electric field resist material is formed over a layer of the desired material upon the upper topography of the semiconductor substrate. The electric field resist layer is then patterned by exposure to an electric field via the apparatus. The apparatus includes a plate and a voltage source. In one embodiment, the plate is electrically conductive and a lower surface of the plate has one or more raised portions with recessed portions existing between adjacent raised portions. The lower surface of the conductive plate is positioned above and in close proximity to the exposed surface of the electric field resist layer. The voltage source applies an electrical voltage between the electrically conductive plate and the semiconductor substrate, creating the electric field.

Abstract: A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a vertical closed position. There is a circular opening in a front wall against which the door seats. The door can have a sealing ring that contacts the wall of the cell outside of the opening. A cathode ring disposed in a recess in the periphery of the opening makes electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper within the plating chamber rotates to draw bubbles or other impurities from the substrate, and a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 Mhz. The cell can be used for electroless or galvanic plating.

Abstract: An electroforming apparatus, in particular for the manufacture of CD/LD data media molding tools, comprises an anode assembly and a rotatable cathode assembly spaced therefrom, and a stationary nozzle means for ejecting an electrolytic fluid into the space between the anode and cathode assemblies. An annular part of the cathode assembly surrounding a molding tool blank is penetrated by a plurality of circumferentially distributed flow passages, the inlet ends thereof are disposed to successively come into alignment with the nozzle means upon rotation of the cathode assembly so that the electrolytic fluid ejected from the nozzle means is received by the flow passages and guided thereby into the space between the anode and cathode assemblies. The width of the spac can thereby substantially be minimized.

Abstract: A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), by movement in a direction transverse to a longitudinal axis of the wire (2), whereafter an electric voltage is applied to the drop holder (11) and the wire (2) to deposit the emitter material (3) on the wire (2), after which the drop holder (11) is withdrawn from the wire (2) again. During the electrodeposition process the drop holder (11) and the wire (2) can be moved with respect to each other along sections of the wire (2) where the emitter material (3) has to be deposited.

Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.

Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).

Abstract: A method and apparatus for treating with treating liquid the inside surfaces of cylinders of a work such as a V-shaped engine having cylinders with at least two different axial alignments, characterized in the steps of rotating the work in such a way that each cylinder in another axial alignment is aligned with a longitudinal passage-forming member provided in a workstation; and repeating the same operations on said cylinder at said workstation, thereby allowing for easy operations without interruption an apparatus for performing these steps is also disclosed.

Abstract: A method and apparatus for performing high speed chemical treatment of v type cylinder blocks. First the cylinder bores of one bank are treated. Then those of the other bank are treated. This permits a simple but compact treating plant.

Abstract: Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of a semiconductor wafer during plating.

Abstract: A nozzle for fast plating with plating solution jetting and sucking functions includes an outer cylindrical member and an inner cylindrical member, a plating solution issuing passage being defined between the outer and inner cylindrical members, and the inner space in the inner cylindrical member constituting a plating solution sucking passage. The inner cylindrical member has a front end flared portion having a forwardly flared surface acting to diffuse the solution. The outer cylindrical member has a front open end defining a gap with respect to the flared surface, the gap constituting a jetting port of the plating solution jetting passage. Plating solution supplied from a supply opening of the plating solution jetting passage is jetted from the jetting port toward a workpiece to be plated, the jetted plating solution is discharged from a rear end discharge opening of the plating solution sucking passage.

Abstract: The invention relates to a method and an apparatus for forming bonding bumps on wafers (5) to be plated in an electroless process (not requiring an externally applied voltage). According to the method, the object to be plated is immersed in a vessel (2) containing a desired solution (10) of metal salts thermostatted at a desired temperature. According to the invention, the wafer (5) to be plated is fixed to a filler block (4) which has a volume essentially equal to the volume of the process vessel (2) to the end of reducing the required filling volume of the vessel (2), and said filler block (4) is moved in the vessel (2) for improving the mixing of the solution of metal salts contained therein.

Abstract: The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.

Abstract: A surface treating device for applying a surface treatment through the use of a fluid to the cylinder bores of a wide variety of types of cylinder blocks. The apparatus includes a cylinder block mounting arrangement that has flow paths formed in it that are adapted to accommodate a wide variety of types of cylinder blocks and cylinder blocks having different cylinder numbers and different cylinder bore diameters. Improved flushing and fluid recovery systems are also disclosed.

Abstract: The cylinder running surfaces of an internal combustion engine are treated with pretreatment and coating baths by using flush-in devices (5, 11) with lances insertable into the cylinder bores (1'). The flush-in devices (5, 11) can be successively connected via manifold devices (10, 12) with reservoirs (V.sub.1 to V.sub.5 ; B.sub.1 to B.sub.3) for different bath liquors. Thus, each flush-in device (5, 11) serves for the successive introduction of different bath liquors into the cylinder bores (1').

Abstract: An apparatus is configured with first and second applicators for applying respective first and second electrolytic fluids. Decontaminating a surface comprises supplying a first electrolytic fluid to a first applicator, supplying a second electrolytic fluid to a second applicator, generating an electrical potential between the first and second applicators, and contacting the contaminated surface with the first and second applicators.

Abstract: An apparatus for simultaneously anodizing the heads of several aluminum pistons includes a plating tank with an array of apertures extending through one side wall, one aperture for each piston; a fixture on the wall providing a cylindrical bore aligned with each aperture adapted to receive a piston; and a plurality of actuators which, when pivoted and locked into alignment with the fixture bores, operate to secure individual pistons in their respective apertures. A masking/sealing assembly within each fixture bore ensures that each aperture is sealed upon the securing of a piston therein, with only the piston's head and peripheral land being placed in fluid communication with the interior of the plating tank. A remote storage tank provides a supply of an electrolyte which is circulated by a fluid supply network between the storage tank and the thus-sealed plating tank during electrolysis. After the desired coating is achieved, the electrolyte is drained from the tank.

Abstract: A device for electrolytic oxidation of silicon wafers comprises a plate-like anode (6) and a plate-like cathode (1) as well as an arrangement for holding a silicon wafer (4) between and spaced from the anode and the cathode. The anode, the cathode and the silicon wafer are horizontally arranged, and the anode and the cathode are larger than the silicon wafer. The holder arrangement consists of loose spacers (3, 5) which are provided between the silicon wafer and the respective electrode, and which enclose electrolyte, and the stack of electrodes, silicon wafer and spacers being held together only by gravity.

Abstract: A separating plant for separating metals from an electrolyte which contains metal, particularly for coating steel strip, includes successively arranged vertical coating cells in which the strip to be coated is guided from an upper deflection roller and/or current-carrying roller to a lower deflection roller and from there to another upper deflection roller and/or current-carrying roller. The upwardly or downwardly travelling strip portion passes through a gap between vertically arranged anodes and an electrolyte flow which is circulated by means of pumps is fed into the gap, preferably in a direction opposite the strip travel direction. Two oppositely arranged walls of each coating cell are constructed as anode plates and adjacent anode plates of successive coating cells form a separating chamber.

Abstract: A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), by movement in a direction transverse to a longitudinal axis of the wire (2), whereafter an electric voltage is applied to the drop holder (11) and the wire (2) to deposit the emitter material (3) on the wire (2), after which the drop holder (11) is withdrawn from the wire (2) again. During the electrodeposition process the drop holder (11) and the wire (2) can be moved with respect to each other along sections of the wire (2) where the emitter material (3) has to be deposited.

Abstract: There is disclosed apparatus for selectively electrolytically treating defined regions of a continuously moving conductive workpiece. The apparatus comprises means for conveying the workpiece through an electrolytic treatment zone of the apparatus where it is contacted with a treatment electrolyte; the conveying means affording masking means to mask the workpiece so that electrolyte contacts only the defined regions; the conveying means comprising an endless chain affording indexing means by which the workpiece is located in register with the masking means; means for supplying electrolyte to the masked workpiece; and means for passing a current between the workpiece as one electrode and another electrode; the means for conveying the workpiece comprising two endless chain conveyors made of articulated links of electrically non-conductive material between which the workpiece is held whilst it is passed through the treatment zone.

Abstract: A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips of the blades extending through sealed openings in the jig and abrasive tips are formed on the tips. The parts of the blades within the hollow jig are isolated from the electrolyte without the need for wax masking. Preferably the jig is cylindrical with the blades extending radially through at least one circumferential row of apertures. The jig may comprise two end discs and at least one ring in which a circumferential row of apertures is formed. The ring is positioned between the end discs and means are provided for securing the discs and ring together.

Abstract: A plating system (10) for plating a substrate such as a semiconductor wafer (116) in an electrolytic tank (12). A fixture wheel (14) is mounted within the electrolytic tank to rotate about a first axis (140). The fixture wheel receives the semiconductor wafer and supplies electrical current to the perimeter edge of the wafer. A fixture wheel drive motor (90) drives rotation of the fixture wheel about the first axis. An anode assembly (18) is mounted in the tank spaced from and facing towards the fixture wheel and received semiconductor wafer. The anode assembly carries first and second anodes (72) which are supplied with electrical current. A second motor (142) causes reciprocation of the anode assembly transversely in front of the rotating fixture wheel for improved uniformity in plating thickness and composition.

Abstract: A technique for utilizing an electric field to initiate electroless deposition of a material to form layers and/or structures on a semiconductor wafer. The wafer is disposed between a positive electrode and a negative electrode and disposed so that its deposition surface faces the positive electrode. A conductive surface on the wafer is then subjected to an electroless copper deposition solution. When copper is the conductive material being deposited, positive copper ions in the solution are repelled by the positive electrode and attracted by the negatively charged wafer surface. Once physical contact is made, the copper ions dissipate their charges by accepting electrons from the conductive surface, thereby forming copper atoms on the surface. The deposited copper have the catalytic properties so that when a reductant in the solution is absorbed at the copper sites and then oxidized, additional electrons are released into the conductive surface.

Abstract: An apparatus for spraying electroplating of metal onto a panel surface that moves through a plating chamber employs roller brushes positioned between electrolyte spray heads and the panel. Metal anodes are positioned to contact the fluffy, absorbent outer layer of the roller brushes while they are being wet by the electrolyte to provide for electrical contact between the anodes and the panel being plated. A suitable power supply has its positive terminal connected to the anodes and its negative terminal connected to the moving panel.