Abstract: A method and apparatus for controlling and changing the composition of a cadmium zinc telluride (CZT) transition layer as it is formed over a partially completed photovoltaic device using electrochemical deposition (ECD) where plating variables are systematically changed while the CZT transition layer is formed to change the composition of the plated CZT transition layer.

Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

Abstract: A feed control method for wire cutting electrochemical discharge machining is disclosed. The method determines whether a contact event has occurred using a wire electrode, based on variations in wire tension when being cut. A wire is cut with an ideal feed speed when the wire electrode is not in contact with a workpiece.

Abstract: In an apparatus and method for magnetic field assisted electrochemical discharge machining (ECDM), the magneto hydrodynamic (MHD) effect is utilized to improve the thickness of bubble film and the electrolyte circulation so as to enhance the machining accuracy and efficiency. Since charged ions in a magnetic field are induced by Lorenz force to move, and the electrolysis bubbles generated in the ECDM process are suffused with electrification ions on their surfaces, the electrolysis bubbles can be forced to move in the direction of the magnetic field without the need of mechanical disturbance. The present invention can be widely applied in the micro-machining of non-conductive brittle materials of different dimensions and shapes, comprising the forming of microchannels and microholes on a biochip, and in the micro-opto-electro-mechanical system (MOEMS) and various kinds of micro-machining fields. The machined surface is smooth and does not require a second time machining.

Abstract: An objective of this invention is to reliably form a plating film. The following two steps are sequentially conducted: a first step of connecting a film-formation surface of a wafer 109 to a cathode electrode 107, making the film-formation surface inclined from the surface of a plating solution 103 and immersing the wafer 109 into the plating solution 103 with applying a first current between the cathode electrode 107 and an Cu anode electrode 105 disposed in the plating solution 103, and second step of, after immersing the film-formation surface in the plating solution 103, applying a second current between the cathode electrode 107 and the Cu anode electrode 105 to form a metal film on the film-formation surface by electrolytic plating. In the first step, the first current is controlled on the basis of an inclination angle between the liquid surface and the film-formation surface.

Abstract: A vacuum processing apparatus includes a tray configured to hold a substrate, a tray support member including an arm configured to support the tray, and a holder to which the tray support member is attached. The arm includes a support portion which abuts against a lower portion of the tray, and a counterbore portion formed into a recessed shape below an edge of the tray such that the counterbore portion does not abut against the tray. When the tray is supported by the tray support member, an edge of an outer side surface of the tray is positioned above the counterbore portion and does not contact the tray support member, and the tray support member is configured to support the tray while pushing the tray against the holder. The tray is configured to form a space with the holder when pushed against the holder while holding the substrate and includes, on a side of the holder, a substantially ring-like projection configured to abut against the holder.

Abstract: A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material.

Abstract: The invention is an electrolytic microfinishing process which utilizes a conductive tool as a cathode and a conductive workpiece as an anode both connected to a power supply. Electrolytic fluid is pumped between the tool and workpiece, creating a decomposition of the workpiece surface allowing the surface of the workpiece to be removed or wiped away by the interaction of the flowing electrolyte and rotation of the tool without generating any heat at a rate significantly faster than any other known machining process. The tool has no contact with the workpiece and accordingly, requires very low clamping loads to hold the workpiece in the spindle during the finishing operation. Due to the low clamping loads, the distortion of the workpiece is completely eliminated. Modulating the power supply during the work cycle allows the use of a single tool for both roughing and finishing as a continuous cycle to significantly provide surface finishes previously unobtainable.

Abstract: An electrochemical discharge machining device includes a base, a sensor disposed on the base, a shaft rotatably disposed on the base, an electrode disposed at one end of the shaft and contacting with a work piece, an isolating element disposed between the sensor and the shaft, and a control module connected to the sensor. Current flows to the electrode via the shaft to machine the work piece, and the force exerted on the electrode by the work piece is transmitted via the shaft and the isolating element to the sensor converting the force into a signal sent to the control module for raising or lowering the base to maintain contact between the electrode and the work piece. The sensor serves as a detecting mechanism to ensure appropriate contact between the electrode and the work piece.

Abstract: The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is disposed. The apparatus has an electroplating bath in which an electrolyte for depositing conductive material is provided, at least two contact rollers which are disposed outside of the electroplating bath and which can be connected as cathode and/or anodes, and at least one deflection roller which is connected between the contact rollers, the position of the deflection roller being changeable between two contact rollers such that by changing the position of the deflection roller a distance to be covered by the carrier and which is formed between two contact points of two adjacent contact rollers corresponds to the extension of the starter layer to be coated.

Abstract: A drag through electro-deposition system and a method of performing a drag through electro-deposition process on a vehicle body is disclosed. The system may include pairs of anodes, with each pair having a corresponding anode pair power supply. As a vehicle body is carried through the electro-deposition tank, the electric power to each pair is individually adjusted relative to the vehicle body position in the tank.

Abstract: A plating apparatus for plating a substrate comprises a power supply for generating a voltage between a pair of terminals; an anode connected to one terminal of the power supply; a main cathode connected to the other terminal of the power supply while in contact with the substrate; an auxiliary cathode connected to the other terminal of the power supply while out of contact with the substrate; a main resistance R1 connected in series between the other terminal of the power supply and the main cathode; and an auxiliary resistance R2 connected in series between the other terminal of the power supply and the auxiliary cathode.

Abstract: This invention relates to a method for controlling additions of powder materials into an electrolytic cell designed for the production of aluminium by fused bath electrolysis. The method according to the invention, which can easily be automated, can be used to maintain monitoring of operation of the feed even during anode effects.

Abstract: The invention relates to an electrodipping device comprising, in a known manner, a bath of enamel, and a transport device used, during the continuous method, to dip the workpieces (1a, 1b, 1c) to be coated into the bath of enamel, to move the workpieces through the bath, and remove the same therefrom. Electrodes are arranged in the bath of enamel, along the path of displacement of the workpieces (1a, 1b, 1c), said electrodes being connected to a voltage source (20) with one pole thereof. The second pole of said voltage source (20) is connected to a contact rail (2) extending along the path of displacement of the workpieces (1a, 1b, 1c). Each workpiece (1a, 1b, 1c) is provided with a contact device (3a, 3b, 3c) which is in contact with the contact rail (2). A controllable voltage regulating unit (4a, 4b, 4c) is arranged between each contact device (3a, 3b, 3c) and the corresponding workpiece (1a, 1b, 1c).

Abstract: For an electrolytic cell, an apparatus and method are described that use one or more sensors to measure magnetic field strength about a conductor carrying electrical current. A processor is in electrical communication with the sensors and determines a compensated magnetic field strength based on the magnetic fields of other conductors that also carry electrical current to or from the electrolytic cell. The processor uses this compensated magnetic field strength to determine the cathode electrical current carried by the conductor and to identify open and short circuits between the anodes and cathodes of the cell. The described apparatus and method account for interactions between the magnetic fields of the neighboring cathodes.

Abstract: A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract: A pulsed electric field system for inactivation of biological agents on a dielectric sheet material. The pulsed electric field (PEF) system includes a dielectric layer located between an active electrode and a ground electrode, wherein said dielectric layer has a uniform surface profile. A pulsed electric field is provided in a gap between the dielectric layer and the active electrode. A transport assembly moves the dielectric sheet material through the gap. In a preferred embodiment, the system also includes sensors for sensing the position of the dielectric sheet material as it passes through the pulsed electric field.

Abstract: A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector mounted along the back side of a rotor which acts as a workpiece holder. The emitted beam passes through the workpiece holder and is reflected by any workpiece present in the workpiece holder. The preferred units include both an optical emitter and pair of detectors. The detection is preferably able to discriminate on the basis of the angle of the reflected beam, so that a portion of the beam reflected by the workpiece holder is not considered or minimized.

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control means (30) are arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control means comprise an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control means (30) alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28(has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).

Abstract: An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated. When an initial amount of metal is built up on the wafer surface, the target may be moved closer to the wafer for faster processing. The movement of the target may be controlled automatically according to one or more process parameters.