Abstract: A method for determining a cathodic current (such as from a cathodic protection system) in a tubular disposed within a wellbore drilled in a subterranean zone. A electromagnetic tool disposed within the tubular includes an electromagnetic transmitter, an electromagnetic receiver, a helical transmitter coil, and a helical receiver coil. An axis of the helical transmitter coil and an axis of the helical receiver coil are substantially parallel to an axis of the tubular. An electromagnetic field is transmitted by flowing a first electrical current to the helical transmitter coil. During the transmitting, an electromagnetic signal is received by the electromagnetic receiver via the helical receiver coil. A second electrical current is calculated based on the electromagnetic signal received by the electromagnetic receiver. A magnitude of the cathodic current flowing through the tubular is calculated based on a difference between the first electrical current and the second electrical current.

Abstract: A high-gain and low-noise negative feedback control (“feedback control”) system can detect charge transfer in quantum systems at room temperatures. The feedback control system can attenuate dissipative coupling between a quantum system and its thermodynamic environment. The feedback control system can be integrated with standard commercial voltage-impedance measurement system, for example, a potentiostat. In one aspect, the feedback control system includes a plurality of electrodes that are configured to electrically couple to a sample, and a feedback mechanism coupled to a first electrode of the plurality of electrodes. The feedback mechanism is configured to detect a potential associated with the sample via the first electrode. The feedback mechanism provides a feedback signal to the sample via a second electrode of the plurality of electrodes, the feedback signal is configured to provide excitation control of the sample at a third electrode of the plurality of electrode.

Abstract: A hydrogen generation system includes a signal generation system configured to generate a driver signal. A signal processing system is configured to process the driver signal and generate a chamber excitation signal. A hydrogen generation chamber is configured to receive the chamber excitation signal and generate hydrogen from a feedstock contained within the hydrogen generation chamber. The signal processing system includes a negative reactive circuit coupled to a cathode of the hydrogen generation chamber.

Abstract: A hydrogen generation system includes a signal generation system configured to generate a driver signal. A signal processing system is configured to process the driver signal and generate a chamber excitation signal. A hydrogen generation chamber is configured to receive the chamber excitation signal and generate hydrogen from a feedstock contained within the hydrogen generation chamber. The signal processing system includes a positive reactive circuit coupled to an anode of the hydrogen generation chamber.

Abstract: An electrochemical reduction device is provided with an electrolyte membrane, an electrode unit, a power control unit, hydrogen gas generation amount measuring unit, and a control unit. The electrolyte membrane has ion conductivity. The electrode unit includes both a reduction electrode that is provided on one side of the electrolyte membrane and contains a reduction catalyst for hydrogenating at least one benzene ring of an aromatic hydrocarbon compound or a nitrogen-containing heterocyclic aromatic compound, and an oxygen evolving electrode. The control unit releases, when the hydrogen gas generation amount F1 is larger than an acceptable upper limit F0 of a hydrogen gas generation amount in the electrode unit, the application of a voltage by the power control unit.

Abstract: An electrochemical reduction device comprises an electrode unit including an electrolyte membrane, a reduction electrode, and an oxygen evolving electrode; a power control unit that applies a voltage Va between the reduction electrode and the oxygen evolving electrode; a hydrogen gas generation rate measurement unit that measures a hydrogen gas generation rate F1; and a control unit that controls the power control unit so as to gradually increase the Va within a range that satisfies a relationship of F1?F0 and VCA>VHER?acceptable potential difference (APD), when the potential at a reversible hydrogen electrode is VHER, the potential of the reduction electrode is VCA, the acceptable upper limit of the hydrogen gas generation rate is F0, and the APD is a potential difference that defines an upper limit of a potential difference between VCA and VHER.

Abstract: An electrochemical reduction device is provided with an electrode unit, a power control unit, an organic material storage tank, a water storage tank, a gas-liquid separator, and a control unit. The electrode unit has an electrolyte membrane, a reduction electrode, and an oxygen evolving electrode. The electrolyte membrane is formed of an ionomer. A reduction catalyst used for the reduction electrode contains at least one of Pt and Pd. The oxygen evolving electrode contains catalysts of noble metal oxides such as RuO2, IrO2, and the like. The control unit controls the power control unit such that a relationship, VHER?20 mV?VCA?VTRR, can be satisfied when the potential at a reversible hydrogen electrode, the standard redox potential of an aromatic hydrocarbon compound or an N-containing heterocyclic aromatic compound, and the potential of the reduction electrode are expressed as VHER, VTRR, and VCA, respectively.

Abstract: A method of monitoring an electrolytic cell including detecting information indicative of a thermite reaction, comparing the information indicative of a thermite reaction to a threshold, generating a thermite response signal according to the comparison, and reacting to the thermite response signal by adjusting the operation of the electrolytic cell.

Abstract: An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.

Abstract: A method for measuring an iodine adsorption number of carbon black includes: (a) electrochemically reducing an unknown amount of iodine adsorbed by a predetermined amount of a carbon black sample; (b) measuring the electrical charge used for reducing the unknown amount of the iodine adsorbed by the carbon black sample; and (c) obtaining the iodine adsorption number from the measured electrical charge. An electrolytic cell and a kit for measuring an iodine adsorption number of carbon black are also disclosed.

Abstract: An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.

Abstract: Disclosed is a method for depositing an alloy and/or chemical compounds on a substrate immersed in an electrolyte (1), comprising the steps of: I) applying a first constant or varying potential to the substrate under voltage control for a first time interval (tA); II) applying a second constant or varying current to the substrate under current control for a second time interval (tB); repeating the sequence of steps (I-II). at least twice. Further the use of the method in particular for the deposition of Bi2+xTe3?x is disclosed as well as a specific device for carrying out the above method.

Abstract: A photoelectrocatalytic method for detecting current that illuminates a photoelectrochemical electrode to generate a photocurrent and to magnify the current. Thereby, accuracy of the detection is increased. A photoelectrochemical detector used in the method has a base (10), a cover (20) pivotally mounted on the base (10) and a locking device attached between the base (10) and the cover (20). The base (10) has a top and a recess (12) defined in the top to accommodate a working electrode (50) with a photoelectrochemical inner lead (52). A spacer is clamped between the base (10) and the cover (20) to form a space over the inner lead (52). Multiple channels and a light hole (22) are defined through the cover (20) to communicate with the space. Therefore, the inner lead is illuminated through the light hole (22) to perform the photoelectrochemical method.

Abstract: A flow injection electrochemical detecting device has a base (10), a cover pivotally mounted on the base (10), and a locking device attached between the base (10) and the cover (20). The base (10) has a recess (12) defined in a top to accommodate a working electrode inside the recess (12). An annular trench (28) in a bottom partially receives an O-ring (282) serving as a separator to form a space between the base (10) and the cover (20). Multiple channels are defined through the cover (20) to communicate with the space. Therefore, a flow injection electrochemical detecting device is achieved. By pivotally attaching the cover (20) on the base (10) and using the locking device, the detecting device is easily opened or closed to change the working electrode (50) in a convenient way.

Abstract: Various apparatuses and methods for producing ammonia are provided. One embodiment has uses a plurality of environments and an electrode configured to be exposed to the plurality of environments. The electrode is configured to receive hydrogen while being exposed to one of the environments, reduce nitrogen while being exposed to another environment, and allow the hydrogen and nitrogen to react with each other to form ammonia. Other embodiments provide for simultaneous hydrogen oxidation and nitrogen reduction at the same electrode, which in turn react for formation of ammonia.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: The present invention relates to a control loop to be used in a system for stripping a coating from a part. The control loop comprises an electrometer for measuring a potential between the part and a reference electrode and generating a voltage output signal, an operational amplifier for comparing the voltage output signal to a set point voltage and for producing an output signal to be used to reduce the difference between the voltage output signal and the set point voltage, and a high current power transistors for supplying a current to the part.

Abstract: A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.

Abstract: A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.

Abstract: A method and assembly for recovering a metal from by-products produced from etching a metal (e.g., platinum, iridium, aluminum, etc.) in a plasma processing chamber. The method includes recovering from the plasma processing chamber a deposit of the by-products containing the metal. The deposit is dissolved in an acid, and the metal is recovered from the acid by inserting a working electrode, a reference electrode, and a counter electrode into the acid and applying a difference in potential between the working and reference electrodes to cause current to flow through the working and counter electrodes and the metal to be removed from the liquid and deposit on the working electrode. The metal is removed from the working electrode to recover the metal.