Involving Plating, Coating Or Stripping Patents (Class 204/434)
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Patent number: 6936157Abstract: The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.Type: GrantFiled: August 9, 2002Date of Patent: August 30, 2005Assignee: Advanced Technology Materials, Inc.Inventor: Peter M. Robertson
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Patent number: 6899801Abstract: A method and apparatus for automatically refilling reference electrodes used in chemical analysis. The apparatus generally includes a reference electrode including an outer chamber with an electrolyte contained therein, an adapter to secure the plumbing to the reference electrode, and a computer to control the refill unit. The refill unit further includes a pump, a refill bottle, and plumbing to connect the refill bottle to the pump and the pump to the reference electrode. The method generally includes drawing refill electrolyte from a refill bottle and pumping the refill electrolyte to the reference electrode. Embodiments of the invention further include an automatically refillable reference electrode.Type: GrantFiled: March 20, 2002Date of Patent: May 31, 2005Assignee: Applied Materials, Inc.Inventors: Todd A. Balisky, Srujal (Steven) Patel
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Patent number: 6899805Abstract: A method for determining the concentration of an additive X of an electrochemical bath that includes at least one further component Y is set forth. In accordance with the method, a predetermined amount of a starting solution is provided. The starting solution comprises virgin makeup solution that is saturated with the further additive, or forms a mixed solution that is saturated with the further additive when combined with an amount of the electrochemical bath for measurement that is extracted for measurement. A predetermined amount of the extracted electrochemical bath is then added to the predetermined amount of the starting solution to form the mixed solution. At least one electroanalytical measurement cycle it is then executed using the mixed solution and the results of the measurement cycle are compared with a known measurement standard.Type: GrantFiled: August 16, 2001Date of Patent: May 31, 2005Assignee: Semitool, Inc.Inventors: LinLin Chen, Lyndon W. Graham
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Patent number: 6884333Abstract: The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative information for the kinetics of the electrode reactions, the transport processes, the thermodynamic properties of the electrochemical processes taking place in the cell. When a deposition reaction takes place, the device provides also valuable information about the relationship between the current density and deposit properties including but not limited to the deposit color, luster, and other aspects of its appearance. The device disclosed herein typically is comprised of a multiplicity of cathodic or anodic regions where one or more electrochemical reactions take place simultaneously, but at a different rate.Type: GrantFiled: July 27, 2004Date of Patent: April 26, 2005Inventor: Uziel Landau
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Publication number: 20040256228Abstract: A disposable electrochemical sensor strip is provided. The sensor strip includes an isolating sheet having at least a through hole, at least a conductive raw material mounted in the through hole, a metal film covered on the conductive raw material to form an electrode which comprises an electrode working surface for processing an electrode action, and an electrode connecting surface, at least a printed conductive film mounted on the isolating sheet and having a connecting terminal for being electrically connected to the electrode connecting surface, and a signal output terminal for outputting a measured signal produced by the electrode action.Type: ApplicationFiled: June 17, 2003Publication date: December 23, 2004Inventor: Chun-Mu Huang
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Publication number: 20040253367Abstract: Sensors for the electro-chemical analysis of samples and methods for the manufacturing of sensors allow for more efficient manufacture and use of electro-chemical sensors. Flexible sheets, such as polycarbonate sheets, are used to easily manufacture sensor components, with sensor chemistry being applied to the sensor components at manufacture. Sensors may be manufactured with modular components, enabling easy production-line manufacture and construction of electro-chemical sensors with significant cost savings and increased efficiency over existing sensor styles and sensor manufacturing techniques.Type: ApplicationFiled: May 17, 2004Publication date: December 16, 2004Inventor: Frank W. Wogoman
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Patent number: 6830667Abstract: To provide a cathode cartridge, which comprises a tabular cathode conductor 5, which has an open hole having a same shape to that of plated pats 2a of a plated base 2 as a negative plate, which has a plurality of a protruding portion that presses contact to a peripheral part 2d around the plated parts 2a, a first elastic thin board 3, which covers a rear side of the plated base 2 and has a recess 3a, a tabular rear wall insulator 6, which covers both a back side of the cathode conductor 5 and a back side of the first elastic thin board 3, and has a recess 6b, a tabular front side insulator 7, which has an aperture having the same shape to that of the plated parts 2a, which covers a front side of the cathode conductor 5, and has a recess 7b, into which the cathode conductor 5 gets just, and a second elastic thin board 4, which has an aperture (open hole) having the same shape to that of the plated parts 2a, which is sandwiched between the cathode conductor 5 to provide a cathode cartridge of testing device forType: GrantFiled: June 20, 2001Date of Patent: December 14, 2004Assignee: Yamamoto-MS Co., Ltd.Inventor: Wataru Yamamoto
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Patent number: 6827839Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.Type: GrantFiled: November 2, 2001Date of Patent: December 7, 2004Assignee: Shipley Company, L.L.C.Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
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Publication number: 20040238360Abstract: A potentiometric sensor device for measuring pH value is provided, which sensor device has two electrodes situated on a substrate and applied with the aid of thick-film technology. The two electrodes form an interdigital comb structure on the substrate.Type: ApplicationFiled: April 15, 2004Publication date: December 2, 2004Inventors: Gerd Scheying, Jane Lewis
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Patent number: 6818110Abstract: An electrochemical deposition and testing system consisting of individually addressable electrode arrays, a fully automated deposition head, and a parallel screening apparatus is described. The system is capable of synthesizing and screening millions of new compositions at an unprecedented rate.Type: GrantFiled: October 23, 2000Date of Patent: November 16, 2004Assignee: Symyx Technologies, Inc.Inventors: Christopher J. Warren, Robert C. Haushalter, Leonid Matsiev, Martin Devenney, Eric McFarland, Earl Danielson
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Patent number: 6814855Abstract: A method and apparatus for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth. In accordance with the method, at least two electrodes are employed to execute the electroanalytical technique. Gasses that are trapped or generated at the surface of one or both of the electrodes of the pair are reduced and/or removed by directing a flow of solution toward the electrode surface. This flow of solution against the electrode surface acts to automatically flush the generated gasses (typically in the form of small bubbles) from the electrode surface and generally eliminates the need for manual purging by an operator. Elimination of these gasses reduces or eliminates variability in the open circuit potential, and concomitant noise that would otherwise occur in the electroanalytical measurements.Type: GrantFiled: August 16, 2001Date of Patent: November 9, 2004Assignee: Semitool, Inc.Inventors: Lyndon W. Graham, Dakin Fulton
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Patent number: 6811661Abstract: A cathode cartridge of a testing device for electroplating is provided, and includes a dummy plate 7 as a negative pole provided outside a tabular front insulator 6. The dummy plate includes an orifice a having the same shape as a plated part 2a of a plated base 2 as a negative plate. Protruding portions 4 press contact to a peripheral part of the plated base 2a. A tabular cathode conductor 4 connects with a direct voltage source not soaked in a plating solvent. A tabular rear insulator 5 covers rear sides of the plated base 2 and the cathode conductor 4, and has a recess, into which the plated base 2 and the cathode conductor 4 are retained. A tabular front insulator 6 having an orifice having the same shape as the plated base 2a covers a front side of the cathode conductor 4. An elastic thin board 9 is sandwiched between the plate base 2 and the tabular front insulator.Type: GrantFiled: May 22, 2001Date of Patent: November 2, 2004Assignee: Yamamoto-MS Co., Ltd.Inventor: Wataru Yamamoto
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Patent number: 6808611Abstract: Embodiments of the invention provide an electro-analytical method for determining the concentration of an organic additive in an acidic or basic metal plating bath using an organic chemical analyzer. The method includes preparing a supporting-electrolyte solution, preparing a testing solution including the supporting-electrolyte solution and a standard solution, measuring an electrochemical response of the supporting-electrolyte solution using the organic chemical analyzer, and implementing an electro-analytical technique to determine the concentration of the organic additive in the plating bath from the electrochemical response measurements. The method is performed for independently analyzing one organic additive component in a plating bath containing multi-component organic additives, regardless of knowledge of the concentration of other organic additives and with minimal interference among organic additives.Type: GrantFiled: June 27, 2002Date of Patent: October 26, 2004Assignee: Applied Materials, Inc.Inventors: Zhi-wen Sun, Chunman Yu, Brian Metzger, David W. Nguyen, Girish Dixit
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Patent number: 6805788Abstract: An apparatus for electrochemical impedance spectroscopy having a solid electrolyte is disclosed. The apparatus has a chamber made of an electronically insulating material, a solid electrolyte coupled to the chamber and an electrode disposed in the chamber. A biasing member is used to urge the electrode towards the solid electrolyte and urge the solid electrolyte toward the substrate. The solid electrolyte is designed to contact the surface to be tested directly with no corrosive or otherwise harmful effect to the surface. A method for the detection of corrosion in bare or coated metallic substrates is also provided.Type: GrantFiled: July 10, 1998Date of Patent: October 19, 2004Assignee: Lynntech, Inc.Inventors: Anuncia Gonzalez-Martin, Jinseong Kim, Dalibor Hodko, Carlos Salinas
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Patent number: 6749739Abstract: Relative concentrations of active suppressor additive species and suppressor breakdown contaminants in an acid copper electroplating bath are determined by cyclic voltammetric stripping (CVS) dilution titration analysis using two negative electrode potential limits. The analysis results for the more negative potential limit provide a measure of the suppressor additive concentration alone since the suppressor breakdowvn contaminants are not effective at suppressing the copper deposition rate at the more negative potentials. The analysis results for the less negative potential limit provide a measure of the combined concentrations of the suppressor additive and the suppressor breakdown contaminants. Comparison of the results for the two analyses yields a measure of the concentration of the suppressor breakdown contaminants relative to the suppressor additive concentration.Type: GrantFiled: October 7, 2002Date of Patent: June 15, 2004Assignee: ECI Technology, Inc.Inventors: Gene Chalyt, Peter Bratin, Michael Pavlov, Alex Kogan, Michael James Perpich
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Patent number: 6733656Abstract: In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a rotating platinum disk electrode in the plating bath supporting electrolyte. This calibration is readily performed during the normal course of cyclic voltammetric stripping (CVS) or cyclic pulse voltammetric stripping (CPVS) plating bath analysis the need for additional instrumentation or removal of the test reference electrode from the analysis equipment. Automatic calibration of the reference electrode enabled by the present invention, saves labor, time and expense, and minimizes errors in the plating bath analysis.Type: GrantFiled: April 3, 2002Date of Patent: May 11, 2004Assignee: ECI Technology Inc.Inventors: Gene Chalyt, Peter Bratin, Michael Pavlov, Alex Kogan, Michael James Perpich
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Publication number: 20040084327Abstract: A method and apparatus for analyzing plating solutions. The apparatus generally includes a plating cell, a reference electrolyte input, one or more external additive pumps, and a process controller. In one embodiment, the plating cell includes a cavity therein having a larger volumetric portion adjacent a smaller volumetric portion adapted to hold one or more solutions therein. The plating cell also includes a base disposed adjacent the bottom of the plating cell and adapted to receive and mix one or more test solutions as part of the plating solution analysis. In one configuration, the base includes electrical ports adapted to connect stimulation signals to a working electrode, counter electrode, and reference electrode disposed within the cell. The base also includes a thermal sensor in thermal contact with test solutions contained within the vessel.Type: ApplicationFiled: November 4, 2002Publication date: May 6, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Todd Alan Balisky, Donald A. Cameron, Zhi-Wen Sun
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Publication number: 20040065561Abstract: Relative concentrations of active suppressor additive species and suppressor breakdown contaminants in an acid copper electroplating bath are determined by cyclic voltammetric stripping (CVS) dilution titration analysis using two negative electrode potential limits. The analysis results for the more negative potential limit provide a measure of the suppressor additive concentration alone since the suppressor breakdown contaminants are not effective at suppressing the copper deposition rate at the more negative potentials. The analysis results for the less negative potential limit provide a measure of the combined concentrations of the suppressor additive and the suppressor breakdown contaminants. Comparison of the results for the two analyses yields a measure of the concentration of the suppressor breakdown contaminants relative to the suppressor additive concentration.Type: ApplicationFiled: October 7, 2002Publication date: April 8, 2004Applicant: ECI TECHNOLOGY, INC.Inventors: Gene Chalyt, Peter Bratin, Michael Pavlov, Alex Kogan, Michael James Perpich
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Patent number: 6709568Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.Type: GrantFiled: June 13, 2002Date of Patent: March 23, 2004Assignee: Advanced Technology Materials, Inc.Inventors: Jianwen Han, Ronni M. Etterman, Peter M. Robertson, Richard Bhella, David Price
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Publication number: 20040040842Abstract: The present invention relates to an electrochemical analytical apparatus for analyzing an electrochemical deposition solution, comprising a testing electrode, and a temperature detector attached thereto for monitoring temperature of said testing electrode. Preferably, such temperature detector is a resistance temperature detector.Type: ApplicationFiled: September 3, 2002Publication date: March 4, 2004Inventors: Mackenzie E. King, John W. Staples, Joseph W. Evans, Daniel O. Clark, Peter M. Robertson, Thomas B. Chatterton, Thomas Hartford
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Publication number: 20040020772Abstract: A method consists in measuring ac impedance spectrum using gold, platinum or carbon working ultramicroelectrodes (1). The direct current DC potential pulse which overlaps with alternating current AC signal of an amplitude in the range from 0.005 to 0.015 V and frequency in the range from 10−2 to 106, Hz is applied at the electrode. The value of said DC potential pulse for a process of copper electrorefining is in the range from −0.4 to −0.9 V in relation to a platinum reference electrode (2). Resistance values characteristic of a given electrolyte (E) are obtained from said AC impedance spectrum and compared with standard characteristic obtained by standard additions method. A measuring system consist of electrodes (1, 2, 3) placed inside a measuring cell (4) filled with flowing industrial electrolyte.Type: ApplicationFiled: February 7, 2003Publication date: February 5, 2004Inventors: Wlodzimierz Bas, Boguslaw Fuglewicz, Jan Garbaczewski, Olympia Gladysz, Jan Jagiello, Przemyalaw Los, Grzegorz Malachowicz, Stanislaw Nosal, Stanislaw Orzecki, Gtanislawa Plinska, MIroslaw Przysiezny, Piotr Romanowicz, Grzegorz Szwancyber, Roman Urbanowicz, Marian Warmuz
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Patent number: 6682647Abstract: Method and apparatus for trace metal detection and analysis using bismuth-coated electrodes and electrochemical stripping analysis. Both anodic stripping voltammetry and adsorptive stripping analysis may be employed.Type: GrantFiled: May 10, 2001Date of Patent: January 27, 2004Assignee: New Mexico State University Technology Transfer CorporationInventor: Joseph Wang
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Patent number: 6673218Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).Type: GrantFiled: October 1, 2002Date of Patent: January 6, 2004Assignee: Yamamoto-MS Co., Ltd.Inventor: Wataru Yamamoto
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Publication number: 20030230485Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, which minimizes the interference between the effects of the brightener and the effects of the leveler, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on either (1) the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, or (2) the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, that the rotation speed of the first set of measurement conditions is lower than the rotation speed of the second set of measurement conditions, and that the electroplatingType: ApplicationFiled: June 13, 2002Publication date: December 18, 2003Inventors: Jianwen Han, Ronni M. Etterman, Peter M. Robertson, Richard Bhella, David Price
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Publication number: 20030201191Abstract: A voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, including an unknown concentration of an additive to be measured, cycling an inert working electrode potential to alternately deposit and strip metal from the working electrode surface in the plating solution, wherein the metal deposition step includes a constant voltage plateau at a plateau potential sufficient to eliminate the interference of additives in the plating solution other than the additive to be measured. The method further includes determining a profile of the anodic current resulting from the applied working electrode potential as a function of time and determining a stripping peak area. The method may further include determining the concentration of the additive to be measured by the ratio of the stripping peak area from the profile to a stripping peak area of a base solution not including the additive to be measured.Type: ApplicationFiled: April 29, 2002Publication date: October 30, 2003Applicant: Applied Materials, Inc.Inventors: Nicolay Kovarsky, Zhi-Wen Sun
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Publication number: 20030192782Abstract: A cathode cartridge N for an electroplating tester includes a cathode conductor 10 that conducts electricity to a surface Wa to be plated of a silicon wafer W as an object to be plated, a first insulator 20 that covers a front side (the surface Wa to be plated) of the silicon wafer W and holds the cathode conductor 10, and a second insulator 30 that covers a back side (reverse to the surface Wa to be plated) of the silicon wafer W and holds the silicon wafer W. Negative portions other than the surface Wa to be plated of the silicon wafer W are insulated from plating solution with a first O-ring 22 fitted in the first insulator 20 and a second O-ring 32 fitted in the second insulator 30.Type: ApplicationFiled: October 1, 2002Publication date: October 16, 2003Applicant: YAMAMOTO-MS CO., LTD.Inventor: Wataru Yamamoto
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Publication number: 20030183521Abstract: A conductive composition of titanium boronitride (TiBxNy) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.Type: ApplicationFiled: May 2, 2003Publication date: October 2, 2003Inventor: Yungjun Jeff Hu
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Patent number: 6592737Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference and test electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.Type: GrantFiled: October 17, 2000Date of Patent: July 15, 2003Assignee: Advanced Technology Materials, Inc.Inventor: Peter M. Robertson
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Publication number: 20030127341Abstract: The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution.Type: ApplicationFiled: December 19, 2002Publication date: July 10, 2003Inventors: Mackenzie E. King, Richard Bhella, Cory Schomburg, Peter Robertson
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Publication number: 20030080000Abstract: The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.Type: ApplicationFiled: August 9, 2002Publication date: May 1, 2003Inventor: Peter M. Robertson
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Patent number: 6551479Abstract: A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition.Type: GrantFiled: May 17, 2000Date of Patent: April 22, 2003Assignee: Semitool, Inc.Inventors: Lyndon W. Graham, Thomas C. Taylor, Thomas L. Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter
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Patent number: 6533849Abstract: An neutral electroless gold plating method that minimises “black band” corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to allow a gold layer of the desired thickness to be plated under manufacturing conditions The gold layer produced thereof has good bondability and solderability.Type: GrantFiled: November 27, 2000Date of Patent: March 18, 2003Assignee: Gul Technologies Singapore LTDInventor: Jing Li Fang
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Patent number: 6533920Abstract: A device for detecting an end point of electro-plating comprises a mandrel having a substrate and a patterned conductive layer with a main conductive area and an insulated conductive area on the substrate, an insulation region interposed between the main conductive area and the insulated conductive area, and a sensor electrically connected to the insulated conductive area for detecting a signal which indicates the end point of electro-plating.Type: GrantFiled: January 8, 2001Date of Patent: March 18, 2003Assignee: Hewlett-Packard CompanyInventors: Joo Khim Joachim Ng, Hock Choon Tan
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Patent number: 6527930Abstract: An ultramicroelectrode is disclosed which includes a) a silicon substrate; b) a silicon oxide insulating layer; c) a titanium adhesion layer; d) an iridium layer; e) a gold bond pad layer; f) a titanium adhesion layer; and g) a silicon dioxide insulating layer. In a preferred embodiment, the f) and g) layers have been partially or totally removed. Preferably, the ultramicroelectrode of the invention does not include mercury.Type: GrantFiled: June 21, 2000Date of Patent: March 4, 2003Assignee: Trustees of Tufts CollegeInventors: Samuel P. Kounaves, Melissa A. Nolan
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Patent number: 6521119Abstract: A method and device for the detection of substances such as nitrotoluene, trinitrotoluene, dinitrotoluene, or derivatives, wherein a working electrode and an opposing electrode are contacted with the substance via a viscous electrolyte layer and a voltage is applied to the working electrode whose value is increased and decreased at least once with substantially equal beginning and end values within a predetermined time period, wherein the current strength is determined during this at least one measurement cycle in dependence on the applied voltage, is distinguished in that a plurality of measurement cycles are scanned, and differences of current values of sequential measurement cycles are determined and, in the event of the occurrence of a cathode current maximum, the associated voltage value is determined, held constant and the current strength extracted.Type: GrantFiled: April 4, 2001Date of Patent: February 18, 2003Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.Inventors: Michael Krausa, Klaus Schorb, Stefan Krebs, Frank Becker
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Patent number: 6516233Abstract: Methods, systems and computer program products for controlling plating pulse rectifiers are provided by identifying one of the plurality of plating pulse rectifiers as a master plating pulse rectifier and identifying at least one of the plurality of plating pulse rectifiers, other than the master plating pulse rectifier, as a slave plating pulse rectifier. A recipe comprising a pulse pattern is downloaded to the master plating pulse rectifier and the slave plating pulse rectifier. A synchronization signal is transmitted from the master plating pulse rectifier upon initiating the pulse pattern of the recipe to the at least one slave plating pulse rectifier so as to cause the slave plating pulse rectifier to initiate the pulse pattern of the downloaded recipe. Plating pulse rectifiers suitable for use as master/slave plating pulse rectifiers and systems incorporating such plating pulse rectifiers are also provided.Type: GrantFiled: June 15, 2000Date of Patent: February 4, 2003Assignee: Lambda EMI, Inc.Inventors: Pradeep M. Bhagwat, Tom Goodman, Vinod Bapat
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Publication number: 20030019748Abstract: A system for measuring the presence and concentration of electro-active species in a liquid solution. The system comprises a preparation module, a potentiometric module and a voltammetric module. The preparation module is adapted to prepare and isolate the contaminants of concern in a liquid sample into its electro-active form. The potentiometric module is coupled to the preparation module and adapted to gather environmental metrics of the liquid sample. The voltammetric module is adapted to receive the sample from the potentiometric module or preparation module and identify and determine a concentration of electro-active species.Type: ApplicationFiled: April 19, 2002Publication date: January 30, 2003Inventors: Elena Viltchinskaia, Peter Withers
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Publication number: 20030000850Abstract: Organic addition agents in copper plating baths are monitored by diluting a sample of the bath with sulfuric acid and hydrochloric acid and optionally a cupric salt. The diluting provides a bath having conventional concentrations of cupric ion, sulfuric acid and hydrochloric acid; and adjusted concentrations of the organic addition agents of 1/X of their original values in the sample; where X is the dilution factor. CVS techniques are used to determine concentrations of organic addition agents.Type: ApplicationFiled: June 18, 2001Publication date: January 2, 2003Inventors: Wilma Jean Horkans, Keith T. Kwietniak, Peter S. Locke
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Patent number: 6495011Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.Type: GrantFiled: March 28, 2001Date of Patent: December 17, 2002Assignee: Advanced Technology Materials, Inc.Inventor: Peter M. Robertson
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Patent number: 6440297Abstract: A system and method for determining a noble metal concentration in a sample that is representative of a noble metal concentration in either a volume of water circulated through a nuclear reactor or a surface of a nuclear reactor component exposed to the volume of water. The system comprises: at least one standard having a predetermined concentration of the noble metal disposed its surface; an electrolyte bath for immersing one of the sample and the standard therein; an auxiliary electrode connectable to one of the sample and the standard; a power source connectable to a reference electrode and one of the standard and the sample; and a current measurement device capable of measuring a current passing between the auxiliary electrode and one of the sample and the standard.Type: GrantFiled: December 18, 2000Date of Patent: August 27, 2002Assignee: General Electric CompanyInventors: Young Jin Kim, John Yupeng Gui, Peter Louis Andresen, Thomas Pompilio Diaz, Samson Hettiarachchi
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Publication number: 20020112970Abstract: A method and apparatus for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth. In accordance with the method, at least two electrodes are employed to execute the electroanalytical technique. Gasses that are trapped or generated at the surface of one or both of the electrodes of the pair are reduced and/or removed by directing a flow of solution toward the electrode surface. This flow of solution against the electrode surface acts to automatically flush the generated gasses (typically in the form of small bubbles) from the electrode surface and generally eliminates the need for manual purging by an operator. Elimination of these gasses reduces or eliminates variability in the open circuit potential, and concomitant noise that would otherwise occur in the electroanalytical measurements.Type: ApplicationFiled: August 16, 2001Publication date: August 22, 2002Inventors: Lyndon W. Graham, Dakin Fulton
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Publication number: 20020084195Abstract: A method for determining the concentration of an additive X of an electrochemical bath that includes at least one further component Y is set forth. In accordance with the method, a predetermined amount of a starting solution is provided. The starting solution comprises virgin makeup solution that is saturated with the further additive, or forms a mixed solution that is saturated with the further additive when combined with an amount of the electrochemical bath for measurement that is extracted for measurement. A predetermined amount of the extracted electrochemical bath is then added to the predetermined amount of the starting solution to form the mixed solution. At least one electroanalytical measurement cycle it is then executed using the mixed solution and the results of the measurement cycle are compared with a known measurement standard.Type: ApplicationFiled: August 16, 2001Publication date: July 4, 2002Inventors: Linlin Chen, Lyndon W. Graham
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Publication number: 20020074244Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.Type: ApplicationFiled: November 2, 2001Publication date: June 20, 2002Applicant: Shipley Company, L.L.C.Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
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Patent number: 6375829Abstract: This invention is directed to a method and apparatus for measuring the rate of calcium oxalate scale formation in a continuously flowing solution having a pH of from about 2 to about 3 comprising measuring the rate of deposition of calcium oxalate scale from the solution on to a quartz crystal microbalance having a top side comprising a working electrode in contact with the solution and a second, bottom side isolated from the solution, wherein the pH of the solution proximate to the microbalance is measured using a pH measuring module and is controlled electrochemically at from about 3.5 to about 9 and wherein the working electrode is coated with or made of a conductive material on which the intensive evolution of hydrogen gas proceeds at potentials more negative than those necessary to achieve a pH of 3.5-9 proximate to the microbalance.Type: GrantFiled: March 7, 2000Date of Patent: April 23, 2002Assignee: Nalco Chemical CompanyInventors: Sergey M. Shevchenko, Dmitri L. Kouznetsov, Prasad Y. Duggirala
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Publication number: 20020040849Abstract: To provide a cathode cartridge, which comprises a tabular cathode conductor 5, which has an open hole having a same shape to that of plated pats 2a of a plated base 2 as a negative plate, which has a plurality of a protruding portion that presses contact to a peripheral part 2d around the plated parts 2a, a first elastic thin board 3, which covers a rear side of the plated base 2 and has a recess 3a, a tabular rear wall insulator 6, which covers both a back side of the cathode conductor 5 and a back side of the first elastic thin board 3, and has a recess 6b, a tabular front side insulator 7, which has an aperture having the same shape to that of the plated parts 2a, which covers a front side of the cathode conductor 5, and has a recess 7b, into which the cathode conductor 5 gets just, and a second elastic thin board 4, which has an aperture (open hole) having the same shape to that of the plated parts 2a, which is sandwiched between the cathode conductor 5 to provide a cathode cartridge of testing device forType: ApplicationFiled: June 20, 2001Publication date: April 11, 2002Inventor: Wataru Yamamoto
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Patent number: 6365033Abstract: A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition.Type: GrantFiled: August 31, 1999Date of Patent: April 2, 2002Assignee: Semitoof, Inc.Inventors: Lyndon W. Graham, Thomas C. Taylor, Thomas L. Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter
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Patent number: 6365034Abstract: A high throughput electrochemical test method for determining the resistance to corrosion of a metal article coated with a resinous coating which comprises: (a) making, as the working electrode in an electrochemical cell which also comprises a reference electrode, a counter-electrode and an electrolytic solution, one or more metal articles comprising a plurality of coated areas thereon, with the proviso that a portion of the coating does not exist on the metal thereby allowing for the ultimate passage of electrical current to the metal without the coating being a barrier to such passage; (b) impressing a series of direct current electrical potentials upon each of the respective coated areas in sequence and upon the respective associated working electrode to enable current to flow between the metal article in the electrochemical cell and the counter-electrode; and (c) measuring the current flow as the direct current potential is varied relative to the reference electrode to generate a potentiodynamic scan oType: GrantFiled: October 27, 1999Date of Patent: April 2, 2002Assignee: Polymer Alloys LLCInventor: Peter J. Spellane
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Publication number: 20020008026Abstract: To provide a cathode cartridge of testing device for electroplating which includes a dummy plate 7 as a negative pole providing in outside of a tubular front insulator 6 in case, and which can obtain a uniform plating membrane, which has an orifice having a same shape to that of plated department 2a of a plated base 2 as a negative plate, which has a plurality of a protruding portion 4 that press contact to a peripheral part of said plating base 2a, which has a tubular cathode conductor 4 exposing to connect a direct voltage source with an are that is not soak in a plating solvent, a tabular rear insulator 5 which covers a rear side of said plated base 2 and a rear said cathode conductor 4, and has a recess, into which said plated base 2 and said cathode conductor 4 get just, a tabular front insulator 6, which has an orifice having a same shape to that of said plate base 2a, and which covers a front side of said cathode conductor 4, an elastic thin board 3, which is sandwiched between said plate base 2 and aType: ApplicationFiled: May 22, 2001Publication date: January 24, 2002Inventor: Wataru Yamamoto
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Publication number: 20010045356Abstract: A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition.Type: ApplicationFiled: March 16, 2001Publication date: November 29, 2001Inventors: Lyndon W. Graham, Thomas C. Taylor, Thomas L. Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter
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Publication number: 20010042694Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.Type: ApplicationFiled: March 28, 2001Publication date: November 22, 2001Inventor: Peter M. Robertson