Abstract: An article, such as a semiconductor wafer (31), is selectively electrolytically plated to form metal deposits, such as contacts (26), adjacent to anodes of diode regions within such wafer by mounting the wafer in a plating chamber (36) opposite first and second electrodes (61 and 62), filling the chamber (36) with a metal plating electrolyte (49) and applying alternatingly plating pulses between the wafer (31) and the first electrode (61) and deplating pulses between the wafer (31) and the second electrode (62). The plating pulses are current controlled yielding a predetermined total plating current. The deplating pulses are voltage controlled yielding a deplating current which tends to subside in the course of the plating operation. The electrolyte in the chamber is agitated by streams of electrolyte pumped at a comparatively high rate toward the wafer (31) to break down surface layers of electrolyte adjacent to the wafer.

Abstract: A process for producing one-side electroplated steel sheet with the non-electroplating side having a high affinity for chemical conversion treatment is disclosed. The process comprises preparing a one-side electroplated steel sheet by applying a cathodic current thereto in an acidic plating bath simultaneously while slightly electroplating the non-electroplating surface thereof with a coating weight of 0.5 to 5 g/m.sup.2 by applying a cathodic current through said non-electroplating surface, and then applying electrolysis to said non-electroplating surface by passing an anodic current through said non-electroplating surface to thoroughly remove said electrodeposition on said non-electroplating surface.

Abstract: A plurality of rectangular electrolytic cells are disposed in at least two rows of a side-by-side arrangement of cells. A first set of cathode bus bars extends along the outside of the short end of the cell facing the other row of cells. This set of bus bars, along with a second set of bus bars disposed beneath the cell, collect cathode current from the upstream long side of the cell. The second bus bars are positioned, and current through each set of bus bars is controlled, to minimize disruption of the molten bath due to circulation flow.

Abstract: An electrowinning cell has anodes shielded by an electrical-flux-impervious, electrically non-conductive material which protectively covers each of the anode suspension members and adjoining upper margins of the main body of the anodes. At least one electrical-flux-pervious opening of proper shape, size, and appropriate position to permit sufficient current flux to flow to an associated cathode to induce a uniform current distribution on the upper portions of the cathode is provided for each suspension member. The resulting uniform current distribution insures deposition of highly pure metal values of uniform thickness without the usual undesirable extraneous formations on the top edge of the electrowon metal cathode. The shielding material may be applied to an anode before attachment to its hangerbar for suspension in an electrowinning cell or may be applied to an anode which is already in service.

Abstract: In a tank of aluminizing electroplating cells which may contain racks for articles, operated with aprotic oxygen-free and water-free organo-aluminum electrolytes, a lining of individual segments coated with resistant materials (enamel or electrolyte-resistant plastics) is provided as an electrically insulating protective device. The outer edges of the side baffles, coated all around, are bent round toward the outside and are held together by connecting straps which are bent round toward the inside. The individual bottom segments coated all around lie on top of each other overlapping in roof tile fashion. The protective device may also include a similarly insulated band arranged all around the cell.

Abstract: A device according to the invention comprises trolleys arranged above a plating bath and movable in transverse directions of a steel strip, guide rollers secured to lower ends of vertical levers depending from the trolleys and in contact with edges of the strip by urging means such as counter weights acting upon the vertical levers, and shielding plates secured to the lower ends of the vertical levers below the guide rollers so as to shield undersides of the strip in the proximity of the edges from anodes immersed in the plating bath in opposition to the strip.The device according to the invention can maintain the positional relation between the edges of the strip and shielding plates notwithstanding staggering movements of the strip to prevent the edges of the strip from being excessively plated.

Abstract: `Necking` of elongated cathodic protection anodes is obviated or reduced by means of a nonconductive shield placed around the periphery of the anode, but spaced away from the surface of the anode at the end at which it is connected to a conductor cable. The gap between the shield and the electrode surface is generally in the range of 15-30% of the radius of curvature of the electrode surface.The shield may extend over, but be spaced away from, the end surface of the electrode also.

Abstract: An apparatus is proposed for electroplating a strip of metal of a relatively low electric conductivity, which can be applied, for example, for a stainless steel strip with gold. Said apparatus comprises anode means, masking device and cathode means, said cathode means comprising a plurality of contact elements which are disposed in said masking device. Thereby, said steel is electroplated on one side partially along its length, in spite of the high electric resistance.

Abstract: An overhead monorail transports racks, in which individual generally flat planar workpieces are suspended, along a path which may provide for several discrete processes in the production line of the circuit boards, and which path includes horizontal linear portion defined in a receptacle adapted to contain an electrolytic solution through which solution the racks and workpieces move between opposed insoluble electrode grills. A pressure manifold is provided at the bottom of the electroplating tank and upstanding nozzle defining towers are adapted to spray electrolyte from immediately behind the above mentioned insoluble electrode grills to continuously impinge upon the surfaces of the circuit board as the boards pass downstream through the tank. Metal to be plated is stored in receptacles behind the pressure manifold nozzle defining towers and the workpiece racks and anode baskets are coupled to a primary source of electrical power such as a rectifier.

Abstract: An electrolytic processing device in which either or both surfaces of a belt-shaped metal plate can be selectively subjected to an electrolytic process. In a first electrolytic processing operation wherein only one surface of the belt-shaped metal plate is subjected to processing, an electrical insulating member is disposed between the belt-shaped metal plate and a first group of electrodes arranged over the surface of the belt-shaped metal plate to thereby suppress the flow of current between the belt-shaped metal plate and the first group of electrodes. In a second electrolytic processing operation in which both surfaces of the belt-shaped metal plate are subjected to processing, the electrical insulating member is removed from the position between the electrodes and the belt-shaped metal plate to thereby allow current to flow from the electrodes to both surfaces of the belt-shaped metal plate.

Abstract: An improved cathode head is disclosed for electroforming record matrixes. The cathode head includes a conductive cathode plate which is of approximately the same diameter as the matrix to be electroplated so that electrical contact is made to substantially the entire diameter of the matrix during electroforming.

Abstract: An overhead monorail transports racks, in which individual generally flat planar workpieces are suspended, along a path which may provide for several discrete processes in the production line of the circuit boards, and which path includes horizontal linear portion defined in a receptacle adapted to contain an electrolytic solution through which solution the racks and workpieces move between opposed insoluble electrode grills. A pressure manifold is provided at the bottom of the electroplating tank and upstanding nozzle defining towers are adapted to spray electrolyte from immediately behind the above mentioned insoluble electrode grills to continuously impinge upon the surfaces of the circuit board as the boards pass downstream through the tank. Metal to be plated is stored in receptacles behind the pressure manifold nozzle defining towers and the workpiece racks and anode baskets are coupled to a primary source of electrical power such as a rectifier.

Abstract: An overhead monorail transports racks, in which individual generally flat planar workpieces are suspended, along a path which may provide for several discrete processes in the production line of the circuit boards, and which path includes horizontal linear portion defined in a receptacle adapted to contain an electrolytic solution through which solution the racks and workpieces move between opposed insoluble electrode grills. A pressure manifold is provided at the bottom of the electroplating tank and upstanding nozzle defining towers are adapted to spray electrolyte from immediately behind the above mentioned insoluble electrode grills to continuously impinge upon the surfaces of the circuit board as the boards pass downstream through the tank. Metal to be plated is stored in receptacles behind the pressure manifold nozzle defining towers and the workpiece racks and anode baskets are coupled to a primary source of electrical power such as a rectifier.

Abstract: An anode assembly is provided for use in the electroforming of record matrixes. The anode assembly is comprised of a pair of spaced apart anode baskets for holding a supply of the metal to be electrodeposited, an electrolyte distribution manifold positioned between the baskets and a pair of anode shields positioned in front of each of the anode baskets for focusing the electroforming forces from the anode.

Abstract: An apparatus is disclosed for holding a matrix during electroforming. The apparatus is secured to the cathode of an electroforming apparatus and consists of a flat disc member having a diameter at least as large as the diameter of the matrix to be duplicated, and a ring member which is adapted to screw onto the outer diameter of the flat disc member so as to hold the matrix in contact with the surface of the disc. Resilient seals are provided in the ring member and disc member which encase and hold the matrix in a liquid-tight fit between the disc member and the ring member during electroforming of replica parts on the surface of the matrix.

Abstract: A method of manufacturing moulds for disc-shaped record carriers, and moulds manufactured by means of such a method.A method of manufacturing moulds for disc-shaped record carriers where a glass plate which contains information and which comprises a central hole and is covered with a vapor-deposited silver layer is suspended in an electroforming bath by means of a suspension pin which contacts the edge of the central hole. The mould is electroformed by application of current via the suspension pin and a metallic strip arranged around the outer circumference. After this treatment, the plate is removed from the electroplating bath and the electroformed mould is removed from the plate.

Abstract: An anodizing process having a suspended cathode having a casing of non-electrically conductive material to shield the upper portion of the cathode from effective anodizing communication with the electrolytic bath. The shield can be positioned selectively relative to the length of the cathode whereby the effective area of electrolytic communication can be controlled.

Abstract: An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition.

Abstract: This invention relates to a plating process and its means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating process according to this invention has a step for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, the consumption of the plating solution is saved greatly.

Abstract: In the electrodeposition of metals in electrowinning and electrorefining processes, the current between end electrodes in a cell is generally higher than the average current between all electrodes in the cell thereby causing warping of the end electrodes, overheating of the electrical contacts at the end electrodes and a majority of the electrical shorts to occur at these end electrodes. These problems are alleviated by controlling the current between the first two and between the last two electrodes at a value that is not greater than the average value of the current between all electrodes in the cell, by increasing the lateral spacing between the end electrodes and their immediate neighboring electrodes.

Abstract: A method and apparatus are disclosed for electroplating a selected portion of an article by carefully confining electrolyte contact to the selected portion of the article and establishing a generally uniform electrical field adjacent that selected portion. Electrolyte wetting of the article, which is partially immersed in an electrolytic plating bath maintained under agitation, is minimized by surrounding the article with a dielectric baffle to establish a quiescent zone on the bath surface adjacent the article. Thus, the selected portion of the article is fully exposed to the bath while electrolyte wetting of portions of the article outside of the selected portion is minimized by the baffle. A generally uniform plating of the selected portion is obtained by positioning an electrode in close proximity to the selected portion and maintaining a generally uniform separation between the selected portion and the electrode while an electrical potential is applied between the electrode and the article.

Abstract: In an apparatus for plating the cylindrical flat surface of a metal substrate which is seated in a recess in a substrate case, a shield is mounted on the case around the edge of the surface of the substrate. The shield has an opening therethrough of a diameter adjacent the substrate substantially equal to the diameter of the surface of the substrate, and at the top surface thereof smaller than the diameter of the substrate so as to extend over the substrate. The portion of the opening adjacent the substrate is beveled radially inwardly at an angle of between 45 degrees and 60 degrees.

Abstract: An apparatus for electrolytically etching a precision groove pattern in a metal workpiece. A concave shaped shield having a small aperture contains the electrode. The shield diverts gases evolved at the upward facing workpiece away from the electrode while still allowing circulation of electrolyte about the electrode.

Abstract: A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 10.sup.3, which is sufficient to eliminate the necessity of masking the surface.

Abstract: An improvement in a device for plating a thin layer of a first metal onto the surface of a generally flat metal strip formed of a second metal as the strip is moving in a selected direction along a given path, wherein the device includes an anode in the chamber and means for supplying electrolyte containing ions of the first metal between the anode and the moving strip. The improvement involves providing the anode as an electrically conductive, non-consumable, anode element having an outer surface with a transverse width substantially as great as the width of the strip. A plenum chamber is formed behind the anode element and generally coextensive with the outer surface of the element so that apertures in the anode element direct jets of electrolyte through the anode element and directly against the surface being plated to provide a uniformly turbulent flow of electrolyte at the surface of the strip.

Abstract: A composite material for graphical applications, in particular for nameplate production and having foil of aluminium or one of its alloys stuck on to a support foil. This aluminium foil bears on its side facing away from the supporting layer an aluminium oxide layer, which is thick by comparison with the thickness of the aluminium foil, on top of which there is a further layer of a light sensitive plastic.

Abstract: A device for fastening at least one plate inside an electrolyte bath and for feeding current thereto, which device comprises at least two electrically-insulated battens which run next to one another and between which the plate should be arranged with the flat sides thereof facing the battens, at least one of said battens comprising an imbedded electrical conductor which can be connected to the current source, and the device further comprises means to push the battens towards one another, said means being completely electrically insulated from the conductor while the means for insuring the electrical contact between the conductor and the plate are comprised of projections extending from that side facing the other batten of the first-mentioned batten with the electrical conductor, said projections contacting the conductor and passing cross-wise through said batten insulation, said projections engaging the plate when clamping said plate between both battens.

Abstract: In the present plating method the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.

Abstract: Metal in sheet or strip form is electroplated in a continuous or semi-continuous process in which a running length of the metal is passed through a bath of electrolyte solution having an anode structure supported therein adjacent the surface or surfaces to be electroplated. The structure of the anode enables use of the apparatus to electroplate strips of various widths without encountering adverse side effects or streaking and enables substantial economies in electrical current. The anode structure is particularly useful in the production of strip steel having a zinc coating on one side only.

Abstract: System for electric extraction of non-ferrous metals from their solutions. The system includes means for applying a reversing electric current of different duration for the current for the electric extraction and the dissolution. The system has means for conducting the process simultaneously in two groups of electrolytic baths, the electric current for dissolution for each group of electrolytic baths being provided by the electric current for electric extraction in the other group of electrolytic baths.

Abstract: Anode shields are provided around the anode baskets in an electroforming process.

Abstract: The surface of an intermetallic niobium compound or niobium alloy to be polished is electrically shunted across a niobium part and immersed in electrolyte together with the latter permitting relatively thick surface layers of niobium compounds of high quality which are used for superconducting a-c apparatus to be produced.

Abstract: In the present plating apparatus the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.

Abstract: Apparatus and method for continuous electroplating of at least first and second selected portions of an electronic component or the like, while effecting differential plating thicknesses upon said portions. The apparatus includes means for moving the components through an electroplating station with the portions selected to be plated in contact with a moving applicator belt. Means are provided for shunting a portion of the plating current preceding toward at least one of the selected portions of the component, back to the source which enables the plating potential, whereby differential plating is effected between the first and second portions of the component.

Abstract: A cylindrical surface of an article is electrolytically treated with a controlled, cross-sectional distribution of the electrolytic action. The distribution is achieved by placing the surface at a predetermined distance from a formed electrode to control the influence of the electrode on each portion of the surface along a cross section thereof. The influence on each such portion with respect to other portions of the surface is determined by the magnitude of an influence number associated with such portion in relation to the magnitude of similar influence numbers associated with the other surface portions along the cross section.

Abstract: A method of selectively plating an area of a substrate surface is disclosed. The method comprises contact masking at least one charged anode, spaced from the surface, with a dielectric member which is maintained between the anode and the surface, along their corresponding opposed surface areas, out of contact with the surface. The surface is cathodically charged. The masked anode is contacted with a stream of an electroplating electrolyte. The stream of electrolyte then contacts at least a portion of the charged surface, including the area to be plated, to fully flow electrolyte thereover to selectively electroplate the area.

Abstract: Apparatus for electrolytically refining copper by the series process comprises a tank having an inner surface of an electrically insulating synthetic polymeric material that is substantially inert to an electrolyte solution to be contained in the tank and, associated with the tank, baffles for reducing current flow that would otherwise occur around the edges of electrodes when immersed in the electroltye solution. These baffles comprise sheets of an electrically insulating material that is inert to the electrolyte solution. A pair of such sheets constitutes side baffles each of such a shape and size that it can be positioned with its major surfaces vertical between side edges of a group of electrodes when immersed in the tank and a neighboring side wall of the tank throughout the length of the group.

Abstract: Methods and apparatus are disclosed for manufacturing pellet sizing screen rods by applying a chromium plating or coating to elongated stainless steel and carbon steel rod cores of regular (circular) or irregular (T-shaped) cross sectional configuration. The method concerns surface grinding or blasting, cleaning, electroetching, electroplating, and sour-rinsing the rod cores. The apparatus concerns the construction of frames for supporting the rod cores during plating, as well as the construction, arrangement and proportions of the theivers and the plating anode means employed during plating.

Abstract: Electrophoretic coating of small ware such as metal fasteners or rivets.

Abstract: A method for producing galvanized metal sheet or strip material having a zinc coating on one side only. The method includes utilizing the strip as a bipolar electrode and electrolytically removing a zinc coating from one side of the strip while simultaneously depositing a substantially equivalent amount of zinc on the opposite side of the strip. The method is most economically performed with a steel strip having a differential coating of zinc.

Abstract: A method for producing galvanized metal sheet or strip material having a zinc coating on one side only. The method includes immersing a strip (zinc-coated on both sides) in an electrolyte and passing it between anode means and separate cathode means so as to remove a zinc coating from one side of the strip while simultaneously depositing a substantially equivalent amount of zinc on the opposite side of the strip. The cathode means is immersed in a separate caustic catholyte solution which is kept separate from the main electrolyte by an anion exchange membrane, supported at least partly within the electrolyte, so as to prevent migration of zinc ions from the main electrolyte to the catholyte and cathode means and the formation of a deposit on the cathode means. The method is most economically performed with a steel strip having a differential coating of zinc.

Abstract: A device is disclosed for the continuous application of strip-, ribbon- or spot-shaped coatings of metal layer patterns, particularly of a noble metal such as gold, to an electrically conductive tape comprising a rotatable wheel with two or more parts that define an electrolysis chamber with an outlet gap at the periphery thereof, along the surface of which wheel the tape to be treated is passed in operation to close the chamber, and which one or more parts that define the electrolysis chamber is axially displaceable.

Abstract: To electroplate a metal onto articles having conductive surfaces in an electrolyte bath containing in solution a salt of the metal to be plated onto the articles, a pair of straight, spaced and parallel rails are extended in an essentially horizontal plane along a path from a first point exterior of the plating bath, through the plating bath, and to a second point exterior of the plating bath. Facing slots are formed in the rails, and articles are advanced in tandem within the slots and between the rails along the path from the first to the second points. A plurality of fixed position electrical contactors are positioned to wipingly engage the articles within the plating bath to generate an electrical current between the articles and an anode within the plating bath, and through the plating bath, with the articles functioning as the cathodes to plate the metal onto the articles.

Abstract: An electroplating rack has a framework including a pair of interconnected uprights which support two vertically spaced pairs of arms. Removable pairs of inserts extend between the distal ends of the arms. Electrode bars underlie the pairs of inserts and define exposed, upwardly facing electrode surfaces. The inserts are provided with spaced apertures to support long, thin articles stood on end with their lower ends contacting the electrode surfaces. Interchangeable inserts having apertures of different sizes enable the racks to efficiently support long thin articles of different sizes.

Abstract: An apparatus for electrolytically treating an endless steel strip comprising an electrolytic treating tank having guide means associated therewith which are adapted to guide a continuously moving endless strip into and out of the interior of the tank and having at least one electrode disposed within the tank directly facing only one of the wide surfaces of the endless strip while the strip is being guided through said tank by the guide means and at least one cathodic electrode spaced from the anodic electrode and disposed within said tank directly facing only the opposite wide surface of said endless strip. The anodic electrode is connected with the positive terminal of a first source of direct current, such as a plating rectifier, and the cathodic electrode is connected with the negative terminal of a second source of direct current, such as an etching rectifier, which is independent of the first source of direct current.

Abstract: The invention relates to a process for making a nickel/chromium plated automobile wheel comprising plated rim and plated center, including special electroplating procedures and apparatus; and the resulting wheel.

Abstract: A process and apparatus for the high current density electroplating of recessed configurations such as inside corners or depressions. The apparatus employs a housing member, the front face of which has a number of closely spaced ports for the discharge of electrolyte jets which impinge upon the recessed configuration. The anode, supported within the housing, is non-consumable so as to prevent soluble anode products from depositing within the recessed configuration. Uniform plating is achieved by a new principle termed "coalescent jets" which requires a critical correlation between (i) the applied voltage, (ii) the force of the electrolyte jets, (iii) the size of the ports, (iv) the distance between ports and (v) the distance between the front face of the housing and the recessed configuration undergoing electroplating.

Abstract: A method for selectively controlling the plating thickness on opposing sides of a body is disclosed. The method comprises providing an assembly of the body to be plated, a shield having apertures therein and a sealing member between body to be plated and the shield. The sealing member has an opening to allow plating solution to reach one surface of the body to be plated and has further openings to allow gases and depleted solution to escape from the assembly. The process provides a thinner layer of plated metal on the inner surface of the body to be plated and a thicker layer in the outer surface. It is particularly useful in plating ceramic circuit boards.

Abstract: Anode shields are provided around the anode baskets in an electroforming process.