Copper Patents (Class 205/772)
  • Patent number: 10337114
    Abstract: A process for recycling glass from screens deriving from the disposal of cathode-ray tube television sets with quantitative recovery of the lead in metal form, is described.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: July 2, 2019
    Assignee: E.V.H. S.r.l.
    Inventor: Francesco Della Casa
  • Patent number: 9717877
    Abstract: An apparatus includes an electrolytic cell having an electrolytic chamber to which subject raw water is introduced, at least one membrane that separates inside and outside of the electrolytic chamber, and at least one pair of electrode plates provided in the inside and the outside of the electrolytic chamber so as to sandwich the membrane, the electrode plate in the outside of the electrolytic chamber being provided to be in contact with the membrane; a direct-current power source that applies a direct-current voltage to the pair of electrode plates; and a diluent gas supplier for diluting hydrogen gas generated from the electrode plate that is to be a cathode, wherein the apparatus blows diluent gas supplied from the diluent gas supplier to the cathode thereby to constantly maintain a hydrogen gas concentration in the vicinity of the cathode during electrolysis at lower than 18.3 vol % so that mixed gas comprising the hydrogen gas and the diluent gas and having a hydrogen gas concentration of 0.1 to 18.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: August 1, 2017
    Assignee: MIZ Co., Ltd.
    Inventors: Fumitake Satoh, Ryousuke Kurokawa, Bunpei Satoh, Tomoki Seo
  • Patent number: 8968442
    Abstract: A method of recovering copper from a copper sulfide concentrate comprising a copper arsenic sulfosalt or a copper antimony sulfosalt, using carbon as a catalyst. The concentrate and carbon are added to an acidic sulfate leach solution. The copper is leached from the concentrate, in the presence of an oxygen-containing gas. The operating potential is maintained above a selected level. The carbon copper sulfide ratio of the carbon being added to the copper sulfide present in the concentrate being added is at least 1:20. The carbon may be maintained above a selected concentration in the leach solution. The leached copper is recovered from the solution by conventional methods.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: March 3, 2015
    Assignee: The University of British Columbia
    Inventors: David G. Dixon, Berny Rivera-Vasquez
  • Publication number: 20150037512
    Abstract: A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method.
    Type: Application
    Filed: November 27, 2012
    Publication date: February 5, 2015
    Applicant: Fuji Shoji Co., Ltd.
    Inventors: Tatsuya Banno, Katsuhiro Goto, Nobuhiro Kanazawa
  • Patent number: 8840773
    Abstract: Techniques and systems for reclaiming metals from articles having one or more components containing or coated with copper are provided. An example technique may include providing an article having one or more components containing or coated with copper, providing a barrel disposed in a container, the container containing an electrolytic solution and a copper starting pole component, positioning a plurality of electrically conductive particles and the article within the barrel, and separating one or more copper ions from at least a portion of the article by electrolysis.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: September 23, 2014
    Assignee: Empire Technology Development LLP
    Inventor: Wusheng Wang
  • Patent number: 8491700
    Abstract: Various embodiments provide new methods of rhenium recovery. The methods can include subjecting a metal-bearing solution to an activated carbon bed, and adsorbing rhenium onto the activated carbon. The methods can also include heating a basic aqueous elution solution and eluting the rhenium from the activated carbon with the heated elution solution. The methods can also incorporate an ion exchange as a rhenium recovery apparatus.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: July 23, 2013
    Assignee: Freeport-McMoran Corporation
    Inventors: Brett T. Waterman, Steve Nels Dixon, Theresa Linne Morelli, George Owusu, Stefka Todorova Ormsby
  • Patent number: 8366903
    Abstract: In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: February 5, 2013
    Assignee: Hitachi Via Mechanics
    Inventors: Toshinori Kawamura, Haruo Akahoshi, Kunio Arai
  • Publication number: 20120279357
    Abstract: A method of recovering copper from a copper sulfide concentrate comprising a copper arsenic sulfosalt or a copper antimony sulfosalt, using carbon as a catalyst. The concentrate and carbon are added to an acidic sulfate leach solution. The copper is leached from the concentrate, in the presence of an oxygen-containing gas. The operating potential is maintained above a selected level. The carbon copper sulfide ratio of the carbon being added to the copper sulfide present in the concentrate being added is at least 1:20. The carbon may be maintained above a selected concentration in the leach solution. The leached copper is recovered from the solution by conventional methods.
    Type: Application
    Filed: October 20, 2010
    Publication date: November 8, 2012
    Applicant: The University of British Columbia
    Inventors: David G. Dixon, Berny Rivera-Vasquez
  • Patent number: 7794582
    Abstract: Disclosed is a method of recovering metal from waste plating stream and using the recovered metal comprising: providing a waste metal plating stream containing metal ions in an aqueous solution; passing the waste metal plating stream containing the metal ions into an electrochemical cell assembly having an inlet for the waste metal plating stream, a plurality of alternating anodes and cathodes porous to the waste metal solution and an exit from the cell; passing the waste metal plating stream through pores of the cathode; passing an electrical current through the anodes and cathodes, thereby depositing a portion of the metal ions onto the cathodes and reducing the amount of the metal ion in the solution from that in the introduced waste metal plating stream; recovering the deposited metal from the cathode; and using the recovered deposited metal as a source of soluble metallic anode to be deposited on to a substrate in a subsequent metal plating process.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: September 14, 2010
    Assignee: EW Metals LLC
    Inventors: Paul E Cook, Jeries I Bishara
  • Patent number: 6869519
    Abstract: An electrolytic process for the production of metallic copper in an electrolytic cell including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, and a cathode disposed in the cathode chamber. The process comprises providing an ammoniacal alkaline electrolyte solution containing diammine cuprous ions in each of the anode and cathode chambers, and applying direct current to the anode and cathode to produce metallic copper on the cathode and to produce tetrammine cupric ions on the anode. An electrolytic cell apparatus including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, a cathode disposed in the cathode chamber, and a DC current source connected to the anode and cathode, wherein each of the anode and cathode chambers contains an ammoniacal alkaline electrolyte solution containing diammine cuprous ions.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: March 22, 2005
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventor: Kazuya Koyama
  • Patent number: 6733679
    Abstract: A method of treating an electroless plating waste is provided. The waste is contained and an ability of a reducing agent to reduce a metal of the waste is decreased, for example by adding a stabilizing chemical or by exposing the waste to an anode to which a positive voltage is applied. Poisonous and explosive gases evolve from the waste, which are vented. Upon completion, the waste is drained.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: May 11, 2004
    Assignee: Intel Corporation
    Inventors: Valery M. Dubin, Chin-Chang Cheng, Christopher D. Thomas
  • Patent number: 6521117
    Abstract: The present invention is directed to an improved process for the recovery of metal ions from metal-containing aqueous solutions using a supported liquid membrane (SLM) whereby the pH of the metal-containing solution is preferably adjusted to between 5.5 and 8 and ammonia or other weak base is present in the metal-containing solution in a concentration sufficient to form a complex between the weak base and metal ions present in the solution. The present invention permits enhanced recovery of metal in the solution without any need to adjust the pH of the solution during the SLM process.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: February 18, 2003
    Assignee: National University of Singapore
    Inventors: Nikolai Kocherginsky, Andrew Grishchenko
  • Patent number: 6372111
    Abstract: A method and apparatus is disclosed for reclaiming a metal from the effluent of a chemical mechanical planarization (CMP) process and using the reclaimed metal in an electroplating process. The steps of the method include using a chemical solution in a CMP process to remove material from a semiconductor device. An effluent is produced by this step that contains a dissolved first species removed from the semiconductor device. Then a second step of treating the effluent is performed to remove the dissolved first species and to produce a reclaimed metal. Then a third step of using the metal in an electroplating process is performed.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: April 16, 2002
    Inventor: David K. Watts
  • Patent number: 6332973
    Abstract: CMOS processing is enhanced via a method and system that use a chemical bath purification process. According to an example embodiment of the present invention, solution from a CMOS wet chemical bath is passed over a powered circuit. The powered circuit plates out copper from the solution, and the solution is then returned to the bath. By removing copper from the chemical bath in this manner, cross-contamination of wet chemical equipment is reduced, and the need for redundant tool sets can be eliminated.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: December 25, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: James Clayton Stice
  • Patent number: 6319391
    Abstract: A method of treating scrap graphite having a metal contaminant adhered thereto. The metal is separated from the graphite by placing the scrap graphite in an aqueous oxidizing electrolyte and passing there through an electric current. The electric current may be directional. The metal may be uranium and the scrap graphite may be from the casting of uranium fuel rods. The graphite body disintegrates in the electrolyte and the metal dissolves at an accelerated rate under the influence of the electric current. The metal can also break off from the graphite and may dissolve over a longer time period in the electrolyte. The graphite so treated may be separated from the electrolyte by filtering and washing. Where the graphite has been contaminated with uranium the separation by this process is sufficient to allow the graphite to be disposed of in a conventional manner rather than special means required for hazardous, radioactive materials.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: November 20, 2001
    Assignee: British Nuclear Fuels
    Inventors: Stewart Garfield Holderness, Robert Glyn Lewin
  • Patent number: 6298996
    Abstract: Efficient and cost-effective electrochemical devices and processes for the remediation of aqueous waste streams. The invention provides electrolytic cells having a high surface area spouted electrode for removal of heavy metals and oxidation of organics from aqueous environments. Heavy metal ions are reduced, deposited on cathode particles of a spouted bed cathode and removed from solution. Organics are efficiently oxidized at anode particles of a spouted bed anode and removed from solution. The method of this inventions employs an electrochemical cell having an anolyte compartment and a catholyte compartment, separated by a microporous membrane, in and through which compartments anolyte and catholyte, respectively, are circulated. A spouted-bed electrode is employed as the cathode for metal deposition from contaminated aqueous media introduced as catholyte and as the anode for oxidation of organics from contaminated aqueous media introduced as anolyte.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: October 9, 2001
    Assignee: Eltron Research, Inc.
    Inventors: Ella F. Spiegel, Anthony F. Sammells
  • Patent number: 6294071
    Abstract: Methods of dissolving copper into electrolytic solutions, such as solutions comprising nitrogen compounds, by supplying an anodic current to a copper or copper-containing metal that is in contact with an electrolytic solution comprising a nitrogen compound (such as 2-hydroxyethylamine) and carbon dioxide. Anodic current may be provided by, for example, galvanic coupling with a material having a more positive reduction potential in the electrolytic solution (or given the system of electrolytic solutions) than copper, and/or by applying an impressed anodic current to the copper or copper-containing metal. Separate reaction vessels may be employed to house a first copper metal and a second cathode metal, as well as the electrolytic solutions associated with each.
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: September 25, 2001
    Assignee: Huntsman Petrochemical Corporation
    Inventors: David Lawrence Miller, David Ross McCoy
  • Patent number: 6251258
    Abstract: In an electrolytic bath, an extraction part extracts heavy metal in the internal organs of scallops into an acid solution. A direct current voltage is applied between electrodes, which are provided in the acid solution, to deposit the heavy metal in the acid solution on the electrodes. If the deposit efficiency deteriorates, the polarity applied between the electrodes is reversed from the polarity in the deposition of the heavy metal in a neutral or alkali electrolytic solution. Consequently, the heavy metal is removed from the electrodes. Since arsenic is dissolved in the acid solution, an alkali liquid and a flocculant are added to the acid solution to sediment arsenic.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: June 26, 2001
    Assignee: Hitachi Plant Engineering & Construction Co., Ltd.
    Inventors: Masayuki Kojima, Toshiyuki Hishinuma, Hiroyuki Ichikawa, Hiroshi Asakura, Masataka Kasai
  • Patent number: 6056869
    Abstract: A device for electrochemically deplating metal from side edges and a backside of a semiconductor wafer or substrate. The device includes a shaped cathode having a shape substantially corresponding to a shape of at least a portion of the semiconductor wafer, such that the shaped cathode at least partially covers the backside and at least partially covers the side edges of the semiconductor wafer. The position of at least one of the semiconductor wafer and the shaped cathode is altered by position altering apparatus during the electrochemical deplating.
    Type: Grant
    Filed: June 4, 1998
    Date of Patent: May 2, 2000
    Assignee: International Business Machines Corporation
    Inventor: Cyprian Emeka Uzoh
  • Patent number: 6030520
    Abstract: Nitrates are reduced to nitrogen gas by contacting the nitrates with a metal to reduce the nitrates to nitrites which are then contacted with an amide to produce nitrogen and carbon dioxide or acid anions which can be released to the atmosphere. Minor amounts of metal catalysts can be useful in the reduction of the nitrates to nitrites. Metal salts which are formed can be treated electrochemically to recover the metals.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: February 29, 2000
    Assignee: The Regents of the University of California
    Inventors: Jacek J. Dziewinski, Stanislaw Marczak
  • Patent number: 5804057
    Abstract: Metal salts are removed from solution in an electrolyte by subjecting the solution to electrolysis in a cell having an anode that has an anion exchange membrane closely associated therewith which sequesters the anion of the salt. The cathode may also be provided with a closely associated cation exchange membrane that sequesters, at least partially, the cation of the salt. A metal salt solution can be regenerated by reversing the polarity of the electrodes and conducting an electrolysis using fresh electrolyte.
    Type: Grant
    Filed: June 7, 1996
    Date of Patent: September 8, 1998
    Assignee: Faraday Technology, Inc.
    Inventors: Chengdong Zhou, E. Jennings Taylor, Robert P. Renz, Eric C. Stortz, Jenny J. Sun
  • Patent number: 5656144
    Abstract: An apparatus and method for soil remediation replaces specific ions in the soil electrochemically, using a DC voltage source and special multicompartment anodes and cathodes, each comprising an inner compartment containing electrolyte and a submerged electrode, a salt bridge connecting the electrolyte to an outer compartment containing a specific solution with replacement ions for soil remediation, and a membrane holding in the replacement solution. The membrane is put into contact with the soil, allowing electrical contact and ion migration while keeping the solution inside the anode or cathode. The multicompartment structure prevents the hydroxide and hydronium ion emplacement that causes acid and base fronts to form.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: August 12, 1997
    Assignee: The United States of America as represented by the Secretary of the Interior
    Inventors: Donald B. Hoover, Reinhard W. Leinz
  • Patent number: 5626739
    Abstract: A method of treating a solid material containing a substance of economic importance so as to recover or extract the substance from the material involving the following: forming a conducting mixture of the solid with a liquid so that at least some of the substance of economic importance is dissolved in the liquid, applying an electrical potential difference between at least two electrodes in contact with the mixture at spaced apart locations so as to impart opposite charges to the respective electrodes thereby attracting the liquid containing the dissolved substance to one of the electrodes, removing the liquid from an area surrounding or from a vicinity of the one electrode, and treating the liquid containing the substance of economic importance so as to recover or extract the substance. The liquid used is at least partially conducting. The present method is particularly useful for extracting or recovering gold from gold-containing or gold bearing ores.
    Type: Grant
    Filed: February 27, 1995
    Date of Patent: May 6, 1997
    Inventors: Colin J. Burns, David J. Wright
  • Patent number: 5599437
    Abstract: A waste solution containing electroactive species, e.g., metal ions, can be remediated to very low levels of contaminant by an electrolysis method including the steps of introducing an electrolyte containing an electroactive species into an electrolytic cell having a cathode and an anode, producing a flow of the electrolyte past at least one of the electrodes at an electrolyte flow rate, and passing an electric current through the solution between the anode and the cathode whereby the electroactive species undergoes an electrochemical reaction at one of the electrodes at an electrochemical reaction rate, using an electric current pulsed at a frequency of 0.5 to 1000 Hertz and a duty cycle of not greater than 50%, and adjusting the electrolyte flow rate for the pulsed current electrolysis such that the electrochemical reaction rate for pulsed current electrolysis is greater than the electrochemical reaction rate for direct current electrolysis.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: February 4, 1997
    Assignee: Faraday Technology, Inc.
    Inventors: E. Jennings Taylor, Chengdong Zhou, Robert P. Renz, Mahendra K. Sunkara