Abstract: A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material (10) is coated in an electrophoretic coating means (14) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser (40), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas (42) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.

Abstract: A housing made of a magnesium material is colored by a non-painting process. In this process, an anode oxide film is grown on the surface of the housing by subjecting the housing to anodization. The anode oxide film is colored without a paint being applied to the surface of the film.

Abstract: A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper.

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

Abstract: A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes. A strike plating of copper is provided on the copper film, and the substrate is immersed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper strike. The plating promoter is removed from the copper strike plating located on the top surface insulation layer while leaving the plating promoter on the side walls and bottoms of the respective via holes. The substrate is subsequently electroplated with copper to fill the via holes.

Abstract: The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.

Abstract: This invention provides an electrodeposition apparatus, comprising at least one electrodeposition vessel for supplying a current between a substrate and an electrode in an electrodeposition bath to form an oxide film or the substrate and a rinsing means for rinsing the substrate after passing the electrodeposition tank with water, wherein a humidifying means for preventing drying of at least the film forming surface of the substrate is provided along the transporting path of the substrate at least at the exit side of the electrodeposition vessel and an oxide film forming method. Thus a uniform oxide film without unevenness can be formed on the substrate.

Abstract: Disclosed is a method for forming an aluminum oxide film of a large surface area on an electrode for a high voltage electrolytic capacitor. In accordance with the method, an oxide film of a uniform thickness is formed, prior to a process of etching the oxide film. A re-anodization is then partially conducted for an etched portion of the oxide film. The resultant oxide film has an increased surface area. The method of the invention makes it possible to prepare a dielectric oxide film having characteristics of a uniform thickness and a large surface area. In accordance with the invention, it is possible to expect an increase in the capacitance of electrolytic capacitors.

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract: An anodized pressed valve metal powder pellet is described. The anodized pellet is particularly useful as an anode in an electrolytic capacitor having an improved breakdown voltage. The anodized pellet is formed by periodically holding the pellet at a constant voltage and allowing the current to decay over a period of time, or by turning the formation power supply off altogether during the anodization process. Either way provides an opportunity for heated electrolyte to diffuse from the anodized pellet.

Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.

Abstract: A microetch composition for a circuit board containing sulfuric acid in combination with a carboxylic acid having 2 to 6 carbon atoms, wherein the volume of the carboxylic acid is preferably greater than the amount of sulfuric acid. The method discloses the contacting of a electrically conductive polymer with the microetch composition disclosed above to expose copper underlying the electrically conductive polymer.

Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

Abstract: A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.

Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

Abstract: A method for coating metal cookware includes the steps of (1) cleaning a cooking surface of the metal cookware; (2) roughening the cooking surface by blasting aluminum oxide particles against the cleaned cooking surface; (3) forming a scratch-resistant layer on the roughened cooking surface by electric-arc spraying an aluminum alloy onto the roughened cooking surface, the scratch-resistant layer covering about 50-90% of the area of the roughened cooking surface; (4) forming an oxide film on the scratch-resistant layer and the roughened cooking surface by anodic oxidation; and (5) applying an anti-stick film of fluorocarbon resin on the oxide film.

Abstract: The durability and reliability of a polymer layer/metal layer sensor structure is improved by the incorporation of a metal oxide, e.g., tantalum oxide (Ta.sub.2 O.sub.5), layer between the polymer, e.g., polyimide, and the metal, e.g., platinum. sensor element.

Abstract: A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.

Abstract: A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450.degree. C. to interdiffuse the base coating with the composite material. A nickel or gold top layer is electrolytically deposited over the base coat on the heat-treated composite material.

Abstract: The present invention relates to an electrolytic electrode comprising a core material made of a valve metal, a dense electrically conductive tin oxide layer formed on the core material, an .alpha.-lead dioxide layer formed on the tin oxide layer, and a .beta.-lead dioxide layer formed on the .alpha.-lead dioxide layer. The present invention also relates to a method for preparing the electrolytic electrode.

Abstract: The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semiconductor substrate are capped to obtain a robust electrical interconnect structure. A method for obtaining such capped copper electrical interconnect structure is also disclosed. These capped interconnects can be a single layer or multi-layer structures. Similarly, the interconnect structure that is being capped can itself be composed of single or multi-layered material.

Abstract: A process for forming an electrical circuit component includes forming an initial metal layer on a surface of a synthetic plastics substrate, and irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong. The closed path irradiated by the laser light thereby establishes an insulating region covered by a first portion of the initial metal layer which is bounded by the closed path, and a conducting region covered by a second portion of the initial metal layer which surrounds the closed path and the insulating region established thereby. A further metal layer is then formed over the second portion of the initial metal layer of the conducting region. The first portion of the initial metal layer of the insulating region may thus be removed to thereby expose a corresponding surface portion of the synthetic plastics substrate.

Abstract: An improved method of anodizing aluminum which produces an oxide surface receptive to the formation of strong and durable bonds with epoxy adhesives and coatings with underlying bulk properties providing dissimilar metal separation and basic corrosion protection. The invention provides a two step electrolytic process which includes, firstly, anodizing the aluminum with a phosphoric acid solution and then, secondly, further anodizing the aluminum with a sulfuric and boric acid solution. A product is provided that has a final coating having two anodized regions. The first outer region produced by the phosphoric acid solution is about 3000 angstroms thick and is characterized by open pores which is particularly well suited for the establishment of stable, strong and durable bonds with epoxy primers and adhesives. The second base region produced by the sulfuric/boric acid solution provides a thick, tough, corrosion resistant region about 15,000 angstroms thick.

Abstract: A corrodible iron-based work such as a cylinder rod is subjected to hard chrome plating, heat-treatment by high frequency heating or baking at a temperature of not less than 150.degree. C. (e.g. 170.degree. to 600.degree. C.), resin impregnation treatment and finish buffing in that order to produce a corrosion-inhibited member. In the impregnation step, a thermosetting resin may be impregnated under subatmospheric pressure. After the impregnation step, the thermosettable resin or sealant may be cured in a curing step. The present invention provides for an remarkably high degree of corrosion resistance even though the thickness of the hard chrome plating layer is small.

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: A broad range of colors within the visible spectrum can be obtained by light interference and multiple refraction in an anodized aluminum product, by electrolytically depositing on an aluminum-based substrate an aluminum oxide anodic film separated from the substrate by an aluminum/aluminum oxide interface. The aluminum oxide anodic film comprises at least three superimposed aluminum oxide anodic layers having different porosities and separated by interfaces between each other, the innermost one of said anodic layers having a non porous barrier layer arranged between the bottom of the pores thereof and the aluminum/aluminum oxide interface. Pigmentary inorganic material is deposited within the pores of the superimposed anodic layers and at least in portions of the interfaces between them, the different colors being produced by varying the current and/or time conditions when depositing the innermost one of the aluminum oxide anodic layers.

Abstract: Annular grooves having substantially V-shaped cross sections are formed on the front surface and the rear surface of a grille body. A through hole communicating to the front surface and the rear surface of the grille body is also formed so that the front aperture may be smaller than the rear aperture. A protrusion is formed on the rear surface of the grille body, which is located inner than the groove. The grille body is immersed into a chemical plating solution to form a chemical plating layer on the entire surface of the grille body except for the bottoms of the grooves.

Abstract: Method of making a cast-to-size mold for molding class A finishes on molded plastic articles including the steps of filling any pores in the molding surface with a conductive thermosetting resin and thereafter electroplating the surface.

Abstract: A zinc or zinc-alloy plated steel sheet having an improved weldability and plating properties, as well as a method for making the same is provided. Even when the substrate steel sheet is the one which is difficult to deposit a zinc or zinc-alloy layer by conventional methods, such as an extra low carbon steel sheet, the present invention enables a reliable production of a galvanized steel sheet suffering from no plating failure of insufficient adhesion as well as a reliable production of a galvanized steel sheet suffering from no plating failure or streaking of the alloyed layer. The zinc or zinc-alloy plated steel sheet having improved weldability comprises an extra low carbon steel sheet, an iron-carbon plated layer or a carbon-rich layer generated by diffusion of the iron-carbon plated layer on at least one major surface of the extra low carbon steel sheet, and a zinc or zinc-alloy plated layer on the iron-carbon plated layer or the carbon-rich layer.

Abstract: A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam.

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before or simultaneously with last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: The invention relates to an improved process and apparatus for electroplating an object and removing the excess electroplating solution from the electroplating object. The improvement comprises performing the electroplating process utilizing an apparatus and in a manner which eliminates all waste rinse solution and which provides substantially complete recovery of the chemicals utilized, but not used up, in the plating process.

Abstract: Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.

Abstract: Addition polymer substrates comprising structural groups derived from olefinic nitriles and conjugated dienes, especially ABS resin substrates, are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably with a tetravalent cerium solution, to improve adhesion to metal coatings subsequently deposited non-electrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.

Abstract: A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

Abstract: The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before the last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: A process for depositing an anti-wear coating on a titanium-based substrate comprises:a) roughening the substrate by sanding;b) deposition of a keying nickel sub-layer on the substrate by cathodic spraying (cathode sputtering);c) intermediate cleaning;d) activation of the cleaned part by immersion of the part in a cyanide bath;e) electrolytic deposition of nickel; andf) deposition of a final, anti-wear layer of a material selected from the group consisting of Ag, Cr, Ni, Co, and mixtures thereof, with or without ceramic particles such as SiC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3, Cr.sub.2 O.sub.3.

Abstract: A method for the formation of an electrolyte layer of solid electrolytic capacitors is provided. The method comprises: (1) forming an oxide film with dielectric properties on the surface of a porous electrode made of a valve metal, the electrode being electrically connected to an anode lead made of a valve metal, (2) impregnating the electrode, on which the oxide film has been formed, with a solution of manganese nitrate, (3) electrostatically depositing electrolyte powder particles on the surface of the electrode which has been impregnated with the solution, and (4) pyrolyzing the manganese nitrate to manganese dioxide to form an electrolyte layer on the surface of the oxide film.

Abstract: A method for fabricating conductors in dielectric trenches in a self-aligned manner. Interconnect modules with a high conductor density are achieved by using a copper-polyimide system as a versatile packaging approach. A photosensitive polyimide is applied to a substrate and lithographically patterned to form polyimide steps having a characteristic positive slope, between which are defined trenches in which the substrate is exposed. A thin electroplating seed layer is deposited over the polyimide steps and the substrate. Copper is electroplated into trenches, but does not plate onto the tops of the polyimide steps, since the electroplating seed layer at that location is not electrically connected to the electroplating seed layer in the bottom of the trenches. The electroplating seed layer on top of the polyimide steps is then removed by chemical etching, plasma machining, or ion-milling.

Abstract: A method for applying a sequence of protective coatings to steel parts includes the steps of depositing a zinc coating, a chromate coating and a synthetic resin coating. The parts to be coated are supported on a hanger and carried thoughout the entire coating operation by a continous conveyer system. The zinc coating is electrolytically deposited from an alkaline non-cyanide electroplating bath to a thickness of from 0.05 to 0.2 mils. The zinc-coated parts are washed, and while still wet, are sprayed with an aqueous chromating solution. After rinsing and drying, a synthetic resin coating is applied to the chromate-coated parts by electrostatic powder spraying. The parts are then baked in an oven to fuse the resin coating. The method is particularly applicable to refrigerator racks.

Abstract: An electrodeposition method wherein a conductive substrate such as, for example, a metal fastener is first coated by means of an anodic electrodeposition process, then subjected to thermal curing, and then subjected to a cathodic electrodeposition process. The anodic electrodeposition process is carried out until the coating insulates the substrate at which point the coating process stops. The curing step lowers the dielectric strength of the anodically deposited coating, thereby allowing the substrate to accept a cathodically deposited top coat. The resultant coated substrate demonstrates superior corrosion resistance properties and improved cosmetic appeal.

Abstract: Apparatus for plating electrical or electronic components, comprises a plating chamber (2) for receiving electrolyte through which a current is to be passed via a first anode (10) and cathode (13) pair, means being provided to arrange a component (12) to be plated as the cathode of said first pair, means for supplying the plating chamber with electrolyte enriched with plating material, the supplying means including a reservoir chamber (4) for receiving electrolyte through which a current is to be passed via a second anode and cathode pair (21, 22), means being provided to arrange a body of plating material (17) as the anode of said second pair, whereby in use plating material dissolved from the anode of the second pair enriches the electrolyte supplied to the plating chamber (2) and is deposited on the cathode of the first pair.

Abstract: Gas-diffusion electrodes (GDE's) suitable for use with a solid polymer electrolyte (s.p.e.), particularly in s.p.e. fuel cells, which GDE's provide unusually highly efficient use of noble or precious electrocatalytic metals, are obtained by starting with a GDE which is essentially fully fabricated except for electrocatalytic metal treatment and s.p.e. treatment, e.g. a carbon GDE having a gas-permeable hydrophobic face and a particulate carbon-containing catalytic face. This untreated GDE is treated bya. impregnating an s.p.e. solutuion into the catalytic face until the solution penetrates part way into the cross-section of the GDE, especially into the carbon particulate or other support material, but not as far as the hydrophobic, gas permeable face,b. inserting the thus-treated GDE and a counterelectrode into a plating bath containing, for example, M.sup.+, M.sup.++, and/or M.sup.+++ ions, where M is a metal of Group VIII or I-B of the Periodic Table, andc.