Abstract: Provided are a method of forming a magnetic layer pattern and a method of manufacturing a thin film magnetic head, which can reduce the number of manufacturing steps and thus reduce the manufacturing time. A precursory nonmagnetic layer and a precursory bottom pole layer are formed in this sequence so as to cover a frame pattern formed on an underlayer (a top shield layer) and having an opening. Then, the precursory nonmagnetic layer and the precursory bottom pole layer are patterned by polishing the overall surface by CMP until at least the frame pattern is exposed, and thus a nonmagnetic layer and a bottom pole are selectively formed. The number of manufacturing steps can be reduced and thus the manufacturing time can be reduced, as compared to the case of forming the nonmagnetic layer and the bottom pole without forming the frame pattern.

Abstract: In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the electroplating current during the electroplating process. Generally, for a particular electroplating bath, where the electroplating current duty cycle is greatest the NiFe electroplated material has a higher Fe at. %, and where the electroplating current duty cycle is reduced, a lower Fe at. %. Therefore, electroplated NiFe components from a single electroplating bath can have differing NiFe concentrations where the electroplating current duty cycle is altered. Additionally, NiFe components can be electroplated with a graduated or changing Ni and Fe concentration by altering the electroplating current duty cycle during the electroplating process.

Abstract: The invention is directed to the use of electrochemical deposition to fabricate thin films of a material (e.g., bismuth) exhibiting a superior magnetoresistive effect. The process in accordance with a preferred embodiment produces a thin film of bismuth with reduced polycrystallinization and allows for the production of single crystalline thin films. Fabrication of a bismuth thin film in accordance with a preferred embodiment of the invention includes deposition of a bismuth layer onto a substrate using electrochemical deposition under relatively constant current density. Preferably, the resulting product is subsequently exposed to an annealing stage for the formation of a single crystal bismuth thin film. The inclusion of these two stages in the process produces a thin film exhibiting superior MR with a simple field dependence in the process suitable for a variety of field sensing applications.

Abstract: Provided are a method of forming a magnetic layer pattern and a method of manufacturing a thin film magnetic head, which can reduce the number of manufacturing steps and thus reduce the manufacturing time. A precursory nonmagnetic layer and a precursory bottom pole layer are formed in this sequence so as to cover a frame pattern formed on an underlayer (a top shield layer) and having an opening. Then, the precursory nonmagnetic layer and the precursory bottom pole layer are patterned by polishing the overall surface by CMP until at least the frame pattern is exposed, and thus a nonmagnetic layer and a bottom pole are selectively formed. The number of manufacturing steps can be reduced and thus the manufacturing time can be reduced, as compared to the case of forming the nonmagnetic layer and the bottom pole without forming the frame pattern.

Abstract: A magnetic thin film forming method forms a magnetic thin film on a conductive film by electroplating using a plating bath containing Ni ions, Fe ions, Mo ions and an organic acid. A concentration of the organic acid in the plating bath is 3-20 times a concentration of the Mo ions in the plating bath. An organic acid concentration in the plating bath versus an Mo ion concentration of the plating bath is set to be a suitable value, whereby an Mo mixed amount in the magnetic thin film can be set to be a suitable value. Accordingly, a magnetic thin film having a large specific resistance value and good magnetic characteristics can be formed.

Abstract: A magnetic thin film manufacturing method in which an object of treatment is electroplated in a plating bath so that a magnetic thin film is formed on the surface of the object of treatment. The plating bath contains two or more types of ions selected from a set consisting of Fe.sup.2+ ions, Ni.sup.2+ ions and Co.sup.2+ ions, and fine particles of an insulating material are dispersed in the plating bath. In a more particular embodiment of the invention, a magnetic thin film manufacturing method is characterized by the fact that ?a! the aforementioned two or more types of ions selected from a set consisting of Fe.sup.2+ ions, Ni.sup.2+ ions and Co.sup.2+ ions are supplied by means of sulfates and/or chlorides, ?b! the plating bath is an acidic bath, and ?c! the fine particles of an insulating material that are dispersed in the plating bath are colloidal particles of SiO.sub.2 and/or Al.sub.2 O.sub.3.